IP Library Granted Patent US 7,635,851
Granted Patent B2
US 7,635,851 · App. 11/519,872 · Granted Dec 22, 2009

Electron beam apparatus and method of generating an electron beam irradiation pattern

View Patent ↗
Loading inventors, assignments & file history…
Monitor This Case
Get email alerts when status or documents change.
Order Certified Copies
Most orders are placed with the USPTO same day — all within 24 business hours.
Order via The Patent Place →
Pre-filled with this patent's details
Quick Facts
Patent No.
US 7,635,851
App. No.
11/519,872
Granted
Dec 22, 2009
Kind
B2
Abstract

High-contrast exposure is performed by use of a small dose of electron beams, a pattern is formed on a wafer with high accuracy, and high-precision inspection is performed. In pattern formation, proximity effect correction processing is performed. Moreover, exposure of electron beams is performed based on a result of filtering using an inverse characteristic of exposure characteristics of the electron beams. Furthermore, in pattern inspection, electron beams are irradiated based on a result of filtering for obtaining a peripheral region of an edge of the pattern formed.

Claims (23)

1. An electron beam apparatus which draws a pattern by performing raster scan of finely focused electron beams on a sample, comprising:

means for retaining drawing pattern data including a plurality of graphics as a bit map formed of pixels;

means for calculating a drawing pattern density based on the bit map;

means for correcting the bit map according to the drawing pattern density by adding a large additive correction amount to a value of each of the pixels included in the bit map in a region where the drawing pattern density is low and by adding a small additive correction amount thereto in a region where the drawing pattern density is high; and

means for controlling a dose of electron beams according to the value of each pixel in the corrected bit map.

2. The electron beam apparatus according to claim 1 , further comprising:

means for subjecting the data in the corrected bit map to filtering for sharpening, within a range in which the value of each pixel in the corrected bit map does not take on a negative value.

3. The electron beam apparatus according to claim 2 , wherein, in the filtering for sharpening, blur of the finely focused electron beams is approximated by a Gaussian filter, and a high-pass filter having an inverse characteristic of the Gaussian filter is used.

4. The electron beam apparatus according to claim 1 , wherein a plurality of the finely focused electron beams are raster scanned at the same time.

5. An electron beam irradiation pattern generation method for drawing a pattern by raster scanning finely focused electron beams on a sample, comprising the steps of:

converting drawing pattern data including a plurality of graphics into a bit map formed of pixels;

calculating a drawing pattern density based on the bit map;

correcting the bit map according to the drawing pattern density by adding a large additive correction amount to a value of each of the pixels included in the bit map in a region where the drawing pattern density is low and by adding a small additive correction amount thereto in a region where the drawing pattern density is high; and

obtaining an electron beam dose by performing filtering for sharpening within a range in which the value of each pixel in the corrected bit map does not take on a negative value.

6. An electron beam apparatus having a function of drawing an arbitrary graphic pattern by irradiating finely focused electron beam onto a sample, and a function of detecting a sample signal emitted from the sample by irradiating the finely focused electron beams onto the sample and of observing a shape of a sample surface, comprising:

means for converting drawing pattern data including a plurality of graphics into a bit map formed of pixels;

means for calculating a drawing pattern density based on the bit map;

means for correcting the bit map according to the drawing pattern density by adding a large additive correction amount to a value of each of the pixels included in the bit map in a region where the drawing pattern density is low and by adding a small additive correction amount thereto in a region where the drawing pattern density is high;

means for controlling a dose of electron beams according to the value of each pixel in the corrected bit map;

means for selecting between irradiation of at least one electron beam and irradiation of a plurality of electron beams for the plurality of electron beams;

at least one detection means for detecting the sample signal; and

means for performing image processing for an image obtained by the detection means,

wherein the electron beams irradiated onto the sample are formed of a plurality of finely focused electron beams.

Assignments (1)
CHANGE OF NAME AND ADDRESS Recorded Mar 30, 2020
From: HITACHI HIGH-TECHNOLOGIES CORPORATION
To: HITACHI HIGH-TECH CORPORATION
Reel/Frame 052259/0227 →