Wafer level chip package and a method of fabricating thereof
View Patent ↗Wafer level chip packages including risers having sloped sidewalls and methods of fabricating such chip packages are disclosed. The inventive wafer level chip packages may advantageously be used in various microelectronic assemblies.
1. A method of fabricating a microelectronic element, comprising:
(a) providing a substrate having a front surface and posts projecting from said front surface, said posts having sidewalls; and
(b) applying a first dielectric material to the front surface so that said first dielectric material is deposited on the sidewalls of the posts to thereby form risers, each riser including a post and having a sloping surface defined by said first dielectric material, wherein the sloping surface of each riser as a whole is disposed at a lesser angle to the front surface than the sidewall as a whole of the post included in the riser;
wherein said substrate has contact pads exposed at said front surface, the method further comprising forming conductive lines propagating from contact pads of the substrate to tips of the risers, said conductive lines extending over said sloping surfaces of said risers.
2. The method of claim 1 wherein said step of applying the first dielectric material includes applying the first dielectric material in a flowable condition and curing the first dielectric material in the flowable condition to a solid condition.
3. The method of claim 2 wherein said applying step is performed so as that the first dielectric material in the flowable condition forms menisci and said menisci form said sloping surfaces of said risers.
4. The method of claim 1 wherein said step of applying the first dielectric material includes spin-coating the front surface of the substrate with a flowable dielectric material.
5. The method of claim 1 wherein the risers have an aspect ratio smaller than an aspect ratio of the posts.
6. The method of claim 1 wherein said substrate includes one or more semiconductor chips.
7. The method of claim 6 wherein said substrate includes a plurality of semiconductor chips, the method further comprising the step of severing the substrate to form individual packaged chips.
8. The method of claim 1 wherein the posts and the first dielectric material have elastic moduli lower than an elastic modulus of the substrate.
9. The method of claim 1 wherein the step of forming conductive lines includes forming terminals on the tips of the risers, the terminals being connected to the conductive lines.
10. The method of claim 9 further comprising depositing a solder mask layer over the conductive lines.
11. The method of claim 9 further comprising attaching solder balls to at least some of the terminals.
12. The method of claim 1 wherein said providing step includes forming the posts on the front surface of the substrate.
13. The method of claim 12 wherein said step of forming the posts includes applying a layer of a photoimageable dielectric material, selectively exposing the photoimageable dielectric material to light, and removing portions of the layer of the photoimageable dielectric material.
14. The method of claim 12 wherein the step of forming the posts comprises:
applying a layer of a dielectric material to the front surface of the substrate;
forming an etch mask on said layer;
etching said layer of said dielectric material through the etch mask; and
removing the etch mask.
15. A method of fabricating a microelectronic element, comprising:
(a) providing a substrate having a front surface and posts projecting from said front surface, said posts having sidewalls;
(b) applying a first dielectric material to the front surface so that said first dielectric material is deposited on the sidewalls of the posts to thereby form risers having tips remote from the front surface and having tip surfaces on the tips and sloping surfaces defined by said first dielectric material, the applying step including applying the first dielectric material in a flowable condition and curing the first dielectric material in the flowable condition to a solid condition, the risers having continuous smooth surfaces including the sloping surfaces and the tip surfaces;
wherein said substrate has contact pads exposed at said front surface, the method further comprising forming conductive lines propagating from contact pads of the substrate to tips of the risers, said conductive lines extending over said sloping surfaces of said risers and said smooth surfaces.
16. The method of claim 15 wherein said applying step is performed so as that the first dielectric material in the flowable condition forms menisci and said menisci form said sloping surfaces of said risers.
17. The method of claim 15 wherein said providing step includes forming the posts on the front surface of the substrate.
18. The method of claim 17 wherein said step of forming the posts includes applying a layer of a photoimageable dielectric material, selectively exposing the photoimageable dielectric material to light, and removing portions of the layer of the photoimageable dielectric material.
19. The method of claim 17 wherein the step of forming the posts comprises:
applying a layer of a dielectric material to the front surface of the substrate;
forming an etch mask on said layer;
etching said layer of said dielectric material through the etch mask; and
removing the etch mask.