System, method and apparatus for improved electrical-to-optical transmitters disposed within printed circuit boards
View Patent ↗The present invention provides a system, method and apparatus for improved electrical-to-optical transmitters ( 100 ) disposed within printed circuit boards ( 104 ). The heat sink ( 110, 200 ) is a thermal conductive material disposed within a cavity ( 102 ) of the printed circuit board ( 104 ) and is thermally coupled to a bottom surface ( 112 ) of the electrical-to-optical transmitter ( 100 ). A portion of the thermal conductive material extends approximately to an outer surface ( 120, 122 or 124 ) of a layer ( 114, 116 or 118 ) of the printed circuit board ( 104 ). The printed circuit board may comprise a planarized signal communications system or an optoelectronic signal communications system. In addition, the present invention provides a method for fabricating the heat sink wherein the electrical-to-optical transmitter disposed within a cavity of the printed circuit board is fabricated. New methods for flexible waveguides and micro-mirror couplers are also provided.
1. An optical waveguide circuit disposed within a printed circuit board comprising:
a flexible optical waveguide film;
an electrical-to-optical transmitter connected to the flexible optical waveguide film;
a heat sink for the electrical-to-optical transmitter disposed within a cavity of the printed circuit board, the heat sink comprising a thermal conductive material disposed within the cavity wherein the thermal conductive material is thermally coupled to a bottom surface of the electrical-to-optical transmitter and at least a portion of the thermal conductive material extends approximately to an outer surface of a layer of the printed circuit board;
a photoelectric detector connected to the flexible optical waveguide film; and
a first and second reflective elements to optically couple the electrical-to-optical transmitter to the photoelectric detector via the flexible optical waveguide film.
2. The optical waveguide circuit as recited in claim 1 , wherein the flexible optical waveguide film comprises SU-8 photoresist.
3. The optical waveguide circuit as recited in claim 1 , wherein the first and second reflective elements are waveguide mirror couplers fabricated using a microtome blade while the waveguide mirror couplers are greater than 100° C.
4. The optical waveguide circuit as recited in claim 3 , wherein the waveguide mirror couplers have an angle of 45 degrees plus or minus 1.5 degrees.
5. The optical waveguide circuit as recited in claim 1 , wherein the coupling efficiency is greater than 90%.
6. The optical waveguide circuit as recited in claim 1 , wherein the electrical-to-optical transmitter comprises a laser, a vertical cavity surface emitting laser, or an edge emitting laser.
7. The optical waveguide circuit as recited in claim 1 , further comprising a cooling device thermally coupled to the portion of the thermal conductive material extending approximately to the outer surface of a layer of the printed circuit board.
8. The optical waveguide circuit as recited in claim 1 , wherein the thermal conductive material comprises a film on the bottom surface of the electrical-to-optical transmitter and an interior wall of the cavity extending approximately to the outer surface of a layer of the printed circuit board.
9. The optical waveguide circuit as recited in claim 8 , wherein the film is approximately 30 μm in thickness.
10. The optical waveguide circuit as recited in claim 8 , wherein the film is approximately 10 to 50 μm in thickness.
11. The optical waveguide circuit as recited in claim 1 , wherein the thermal conductive material comprises copper, a thermal conductive paste, or copper and a paste.
12. The optical waveguide circuit as recited in claim 1 , wherein the thermal conductive material substantially fills the cavity from the bottom of the electrical-to-optical transmitter to approximately the outer surface of a layer of the printed circuit board.
13. The optical waveguide circuit as recited in claim 1 , wherein the electrical-to-optical transmitter is between 10 and 250 μm in thickness and the heat sink is between 30 and 250 μm in thickness.
14. The optical waveguide circuit as recited in claim 1 , wherein the electrical-to-optical transmitter is between 10 and 250 μm in thickness and the heat sink is between 10 and 490 μm in thickness.
15. The optical waveguide circuit as recited in claim 1 , wherein the electrical-to-optical transmitter disposed within the cavity of the printed circuit board comprises or a planarized signal communications system or an optoelectronic signal communications system.
16. An optical waveguide circuit disposed within a printed circuit board comprising:
a flexible optical waveguide film;
an electrical-to-optical transmitter connected to the flexible optical waveguide film;
a heat sink for the electrical-to-optical transmitter disposed within a cavity of the printed circuit board the heat sink comprising a thermal conductive material disposed within the cavity wherein the thermal conductive material is thermally coupled to a bottom surface of the electrical-to-optical transmitter and at least a portion of the thermal conductive material extends approximately to an outer surface of a layer of the printed circuit board;
a photoelectric detector connected to the flexible optical waveguide film; and
a first and second waveguide mirror couplers to optically couple the electrical-to-optical transmitter to the photoelectric detector via the flexible optical waveguide film, wherein the waveguide mirror couplers have an angle of 45 degrees plus or minus 1.5 degrees and a coupling efficiency greater than 90%.
17. The optical waveguide circuit as recited in claim 16 , wherein the flexible optical waveguide film comprises SU-8 photoresist.
18. The optical waveguide circuit as recited in claim 17 , wherein the first and second waveguide mirror couplers are fabricated using a microtome blade while the waveguide mirror couplers are greater than 100° C.