Methods for fabricating image sensor devices

1. An image sensor device, comprising:

a support substrate;

a passivation structure formed over the support substrate;

an interconnect structure formed over the passivation structure;

a first semiconductor layer formed over the interconnect structure, having a first and second surfaces, wherein the first and second surfaces are opposing surfaces and the second surface contacts the interconnect structure;

at least one light-sensing device formed over/in the first semiconductor layer from the first surface thereof;

a second semiconductor layer formed over the first semiconductor layer;

a color filter layer formed over the second semiconductor layer; and

at least one micro lens formed over the color filter layer.

2. The image sensor device as claimed in claim 1 , wherein the first semiconductor layer comprises a first doping concentration and the second layer comprises a second doping concentration different from the first doping concentration.

3. The image sensor device as claimed in claim 2 , wherein the second doping concentration is greater than the first doping concentration.

4. The image sensor device as claimed in claim 2 , wherein the first doping concentration is about 1E13˜1E16 atoms/cm 2 and the second doping concentration is about 1E16˜1.5E20 atoms/cm 2 .

5. The image sensor device as claimed in claim 1 , further comprising an insulating layer and an anti-reflection layer formed between the second semiconductor layer and the color filter layer.

6. The image sensor device as claimed in claim 1 , further comprising a surface coating layer formed between the color filter layer and the at least one micro lens.

7. The image sensor device as claimed in claim 1 , wherein the image sensor device is fabricated by the following steps, comprising:

providing the first semiconductor layer;

forming the at least one light-sensing device over/in the first semiconductor layer from the first surface thereof;

forming the interconnect structure over of the first semiconductor layer from the first surface thereof, covering the at least one light-sensing device;

forming the passivation structure over the interconnect structure, covering the interconnect structure;

bonding the support substrate with the passivation structure;

forming the color filter layer over the second semiconductor layer; and

forming the at least one micro lens over the color filter layer.

8. The image sensor device as claimed in claim 7 , further comprising formation of a buffer layer and an anti-reflection layer over the second surface of the first semiconductor layer prior to formation of the color filter layer over the second semiconductor layer.

9. The image sensor device as claimed in claim 7 , prior to forming the at least one microlens over the color filter layer, further comprising the step of forming a surface coating layer over the color filter layer.

10. The image sensor device as claimed in claim 1 , wherein the image sensor device is fabricated by the following steps:

forming a composite structure comprising the following steps:

providing a first substrate having the first and second semiconductor layers sequentially stacked on the substrate, wherein the first substrate, and the first and second semiconductor layers are formed with same conductivity but different doping concentrations and the first semiconductor layer has the first surface contacting the second semiconductor layer and the second surface contacting the first substrate;

forming the at least one light-sensing device over/in the first semiconductor layer;

forming the interconnect structure over the first substrate, covering the light-sensing device;

forming the passivation structure over the interconnect structure;

bonding the support substrate with the passivation structure;

thinning the first substrate and exposing the second surface of the first semiconductor layer;

inverting the above-formed composite structure, before performing the following steps:

forming the color filter layer over the second semiconductor layer; and

forming the at least one microlens over the color filter layer.

11. The image sensor device as claimed in claim 10 , further comprising formation of a buffer layer and an anti-reflection layer over the second surface of the first semiconductor layer prior to formation of the color filter layer over the second semiconductor layer.

12. The image sensor device as claimed in claim 10 , prior to formation of the at least one microlens over the color filter layer, further comprising the step of forming a surface coating layer over the color filter layer.

13. The image sensor device as claimed in claim 5 , wherein the image sensor device is fabricated by following steps, comprising:

providing a film stack of the insulating layer, the second semiconductor layer, and the first semiconductor layer, wherein the first and second semiconductor layers are formed with same conductivity but different doping concentrations, and the insulating layer contacts the second semiconductor layer;

forming the at least one light-sensing device over/in the first semiconductor layer from the first surface thereof;

forming the interconnect structure over the first semiconductor layer, covering the light-sensing device;

forming the passivation structure over the interconnect structure,

bonding the support substrate with the passivation structure;

forming the color filter layer over the insulating layer; and

forming the at least one microlens over the color filter layer.

14. The image sensor device as claimed in claim 13 , further comprising formation of the anti-reflection layer over the insulating layer prior to formation of the color filter layer over the insulating layer from the second surface thereof.

15. The image sensor device as claimed in claim 13 , prior to formation of the at least one micro lens over the color filter layer, further comprising the step of forming a surface coating layer over the color filter layer.

16. The image sensor device as claimed in claim 1 , wherein the light-sensing device is a CCD, CIS or optical MEMS device.