Low stress conductive polymer bump
View Patent ↗Disclosed is a laminated (or non-laminated) conductive interconnection for joining an integrated circuit device to a device carrier, where the conductive interconnection comprises alternating metal layers and polymer layers. In addition, the polymer can include dendrites, metal projections from the carrier or device, and/or micelle brushes on the outer portion of the polymer. The polymer layers include metal particles and the alternating metal layers and polymer layers form either a cube-shaped structure or a cylinder-shaped structure.
1. A conductive interconnection for joining an integrated circuit device to a device carrier, said conductive interconnection comprising:
a polymer having a spherical shape between said integrated circuit device and said device carrier; and
patterned metal projections extending towards said polymer from at least one of said integrated circuit device and said device carrier,
wherein said patterned metal projections each have a same height and extend partially into said polymer across the width of said polymer.
2. The conductive interconnection according to claim 1 , all the limitations of which are incorporated by reference, wherein said patterned metal projections have a triangular shape in cross-section.
3. The conductive interconnection according to claim 1 , all the limitations of which are incorporated by reference, wherein said patterned metal projections have a cone-shape.
4. The conductive interconnection according to claim 1 , all the limitations of which are incorporated by reference, wherein said patterned metal projections extend from both said integrated circuit device and said carrier.
5. The conductive interconnection according to claim 1 , all the limitations of which are incorporated by reference, wherein said polymer includes metal particles.
6. The conductive interconnection according to claim 1 , all the limitations of which are incorporated by reference, wherein said polymer comprises a thermoset polymer.
7. The conductive interconnection according to claim 1 , all the limitations of which are incorporated by reference, wherein said polymer comprises a thermoplastic conductive adhesive.
8. A conductive interconnection for joining an integrated circuit device to a device carrier, said conductive interconnection comprising:
a polymer having a spherical shape between said integrated circuit device and said device carrier;
metal particles encapsulated within said polymer; and
dendrites comprising a plated coating on said metal particles.
9. The conductive interconnection according to claim 8 , all the limitations of which are incorporated by reference, wherein said dendrites comprise a plated coating of palladium on said metal particles.
10. The conductive interconnection according to claim 8 , all the limitations of which are incorporated by reference, wherein said dendrites have an irregular pattern within said polymer.
11. The conductive interconnection according to claim 8 , all the limitations of which are incorporated by reference, wherein said polymer comprises a thermoset polymer.
12. The conductive interconnection according to claim 8 , all the limitations of which are incorporated by reference, wherein said polymer comprises a thermoplastic conductive adhesive.
13. A conductive interconnection for joining an integrated circuit device to a device carrier, said conductive interconnection comprising:
a polymer having a spherical shape between said integrated circuit device and said device carrier; and
patterned metal projections extending towards said polymer from said integrated circuit device and from said device carrier,
wherein said patterned metal projections each have a same height and extend partially into said polymer across the width of said polymer, and
wherein said patterned metal projections have a cone-shape and a triangular shape in cross-section.
14. The conductive interconnection according to claim 13 , all the limitations of which are incorporated by reference, wherein said polymer includes metal particles.
15. The conductive interconnection according to claim 13 , all the limitations of which are incorporated by reference, wherein said polymer comprises a thermoset polymer.
16. The conductive interconnection according to claim 13 , all the limitations of which are incorporated by reference, wherein said polymer comprises a thermoplastic conductive adhesive.