IP Library Patent Application 11541734
Patent Application Utility
App. No. 11/541,734 · Confirmation No. 2903

Structure and method of making interconnect element having metal traces embedded in surface of dielectric

Abandoned -- Incomplete Application (Pre-examination)
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Code Description Pages PDF
2007-06-27 ABN Abandonment 2 View
2007-05-23 XT/ Extension of Time 1 View
2006-10-23 PEFN Pre-Exam Formalities Notice 2 View
2006-10-02 TRNA Transmittal of New Application 2 View
2006-10-02 SPEC Specification 36 View
2006-10-02 CLM Claims 4 View
2006-10-02 ABST Abstract 1 View
2006-10-02 DRW Drawings-only black and white line drawings 13 View
2006-10-02 WFEE Fee Worksheet (SB06) 1 View
2006-10-02 WFEE Fee Worksheet (SB06) 1 View
2006-10-02 ADS Application Data Sheet 4 View
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Quick Facts
App. No.
11/541,734
Filed
2006-10-02
Art Unit
1765