IP Library › Patent Application 11542303
Patent Application
App. No. 11/542,303

Ethylene terephthalate polymer retaining ring for a chemical mechanical polishing head

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Quick Facts
Patent No.
US None
App. No.
11/542,303
Abstract

Embodiments of a retaining ring for use with a chemical mechanical polishing process with a body including a polyethylene terephthalate polymer or polymer including ethylene terephthalate monomers are disclosed.

Claims (36)

1 . A retaining ring for use in a chemical mechanical polishing process, a body of the retaining ring comprises a PET polymer, wherein the PET polymer is free or substantially free of inorganic particles.

2 . The retaining ring of claim 1 , wherein the inorganic particles comprise filler particles, nucleating agents, or both.

3 . The retaining ring of claim 1 , wherein a portion of the body of the retaining ring comprises the PET polymer.

4 . The retaining ring of claim 1 , wherein all or a majority of the body of the retaining ring comprises the PET polymer.

5 . The retaining ring of claim 1 , wherein the body of the retaining ring comprises at least one additional polymer blended with the PET polymer.

6 . The retaining ring of claim 1 , wherein the body of the retaining ring further comprises organic filler particles dispersed within the PET polymer in an amount less than or equal to 2% by weight.

7 . The retaining ring of claim 6 , wherein the organic particles comprise TEFLON particles.

8 . A retaining ring for use in a chemical mechanical polishing process, a body of the retaining ring comprises a polymer, the polymer comprising ethylene terephthalate monomers, wherein the polymer is free or substantially free of inorganic particles.

9 . The retaining ring of claim 8 , wherein the inorganic particles comprise filler particles, nucleating agents, or both.

10 . The retaining ring of claim 8 , wherein all or a majority of the body of the retaining ring comprises the polymer including the ethylene terephthalate monomer.

11 . The retaining ring of claim 8 , wherein a portion of the body of the retaining ring comprises the polymer including the ethylene terephthalate monomers.

12 . The retaining ring of claim 8 , wherein the polymer is a copolymer, the copolymer comprising one or more additional monomers.

13 . The retaining ring of claim 12 , wherein the additional monomers are selected from the group consisting of phenylene sulfide and etherketone.

14 . The retaining ring of claim 8 , wherein a majority of the polymer comprises ethylene terephthalate monomers.

15 . The retaining ring of claim 8 , wherein the body of the retaining ring comprises at least one additional polymer blended with the polymer.

16 . The retaining ring of claim 8 , wherein the body of the retaining ring further comprises organic filler particles dispersed within the polymer in an amount less than or equal to 2.0 % by weight.

17 . The retaining ring of claim 16 , wherein the organic particles comprise TEFLON particles.

18 . A method of polishing a substrate comprising:

providing a chemical mechanical polishing apparatus comprising a retaining ring having a body, the body including a polymer including a PET polymer, wherein the polymer is free or substantially free of inorganic particles;

retaining the substrate using the retaining ring; and

polishing the substrate including the step of placing the body in contact with a polishing pad surface.

19 . The method of claim 18 , wherein the body of the retaining ring is free of organic particles.

20 . The method of claim 18 , wherein all or a majority of the body of the retaining ring comprises the PET polymer.

21 . The method of claim 18 , wherein the body of the retaining ring further comprises organic filler particles dispersed within the PET polymer.

22 . A method of polishing a substrate comprising the step of:

providing a chemical mechanical polishing apparatus, the apparatus comprising a retaining ring having a body, the body comprising ethylene terephthalate monomer, wherein the polymer is free or substantially free of inorganic particles;

retaining the substrate using the retaining ring; and

polishing the substrate including the step of placing the body in contact with a polishing pad surface.

23 . The method of claim 22 , wherein the body of the retaining ring is free of organic particles.

24 . The method of claim 22 , wherein a majority of the polymer comprises ethylene terephthalate monomers.

25 . The method of claim 22 , wherein the polymer is a copolymer, the copolymer comprising one or more additional monomers.

26 . The method of claim 22 , wherein the body of the retaining ring further comprises organic filler particles dispersed within the polymer.

27 . A retaining ring for use in a chemical mechanical polishing process, a body of the retaining ring comprises a PET polymer, wherein the PET polymer has organic filler particles dispersed therein and the PET polymer is free or substantially free of inorganic particles.

28 . The retainer ring of claim 27 , wherein the PET polymer has less than 0.1% organic particles dispersed therein.

29 . A retaining ring for use in a chemical mechanical polishing process, a body of the retaining ring comprises a polymer, the polymer comprising ethylene terephthalate monomers, wherein the polymer has organic filler particles dispersed therein and the polymer is free or substantially free of inorganic particles.

30 . The retainer ring of claim 29 , wherein the polymer has less than 0.1% organic particles dispersed therein.

Assignments (2)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jan 29, 2007
From: MOLONEY, GERARD STEPHEN; LAO, PETER
To: EBARA TECHNOLOGIES, INC.
Reel/Frame 018821/0376 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Nov 29, 2006
From: MOLONEY, GERARD STEPHEN; LAO, PETER
To: EBARA TECHNOLOGIES, INC.
Reel/Frame 018582/0718 →