IP Library Granted Patent US 7,592,629
Granted Patent B2
US 7,592,629 · App. 11/544,006 · Granted Sep 22, 2009

Gallium nitride thin film on sapphire substrate having reduced bending deformation

View Patent ↗
Loading inventors, assignments & file history…
Monitor This Case
Get email alerts when status or documents change.
Order Certified Copies
Most orders are placed with the USPTO same day — all within 24 business hours.
Order via The Patent Place →
Pre-filled with this patent's details
Quick Facts
Patent No.
US 7,592,629
App. No.
11/544,006
Granted
Sep 22, 2009
Kind
B2
Abstract

A gallium nitride thin film on sapphire substrate having reduced bending deformation and a method for manufacturing the same. An etching trench structure is formed on a sapphire substrate by primary nitradation and HCl treatment and a gallium nitride film is grown thereon by secondary nitradation. The gallium nitride thin film on sapphire substrate comprises an etching trench structure formed on a sapphire substrate, wherein a function graph of a curvature radius Y according to a thickness X of a gallium nitride film satisfies Equation 1 below, and corresponds to or is located above a function graph drawn when Y 0 is 6.23±1.15, A is 70.04 ±1.92, and T is 1.59±0.12: Y=Y 0 +A·e −(X−1)/T ,  [Equation 1] where Y is the curvature radius m, X is the thickness of the gallium nitride film, and Y 0 , A, and T are positive numbers.

Claims (8)

1. A gallium nitride thin film on sapphire substrate comprising:

an etching trench structure formed on a sapphire substrate,

wherein a function graph of a curvature radius Y according to a thickness X of a gallium nitride film satisfies the following Equation 1 and corresponds to or is located above a function graph drawn when Y 0 is 6.23±1.15, A is 70.04±1.92, and T is 1.59±0.12:

Y=Y 0 +A·e −(X−1)/T   [Equation 1]

where Y is the curvature radius m, X is the thickness of the gallium nitride film, and Y.sub.0, A, and T are positive numbers.

2. The gallium nitride thin film on sapphire substrate of claim 1 , wherein the etching trench structure has a height less than 0.5 μm, a width in the range of 50 μm to 60 μm, and the frequency in the range of 500 to 900 per 1mm 2 .

3. An electric or electronic device comprising a gallium nitride thin film on sapphire substrate according to claim 1 or 2 .

4. A single crystalline gallium nitride film obtained by being separated from a gallium nitride thin film on sapphire substrate according to claim 1 or 2 .

Assignments (4)
CHANGE OF NAME Recorded Aug 6, 2010
From: SAMSUNG CORNING PRECISION GLASS CO., LTD.
To: SAMSUNG CORNING PRECISION MATERIALS CO., LTD.
Reel/Frame 024804/0238 →
CORRECTIVE ASSIGNMENT TO CORRECT THE ASSIGNEE/ASSIGNOR PREVIOUSLY RECORDED ON REEL 020624 FRAME 0240. ASSIGNOR(S) HEREBY CONFIRMS THE MERGER. Recorded May 16, 2008
From: SAMSUNG CORNING CO., LTD.
To: SAMSUNG CORNING PRECISION GLASS CO., LTD.
Reel/Frame 020956/0832 →
MERGER Recorded Mar 10, 2008
From: SAMSUNG CORNING PRECISION GLASS CO., LTD.
To: SAMSUNG CORNING CO., LTD.
Reel/Frame 020624/0240 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Dec 26, 2006
From: LEE, CHANG HO; KONG, SUN HWAN
To: SAMSUNG CORNING CO., LTD.
Reel/Frame 018715/0110 →