IP Library Granted Patent US 7,899,103
Granted Patent B2
US 7,899,103 · App. 11/545,546 · Granted Mar 1, 2011

Side light emitting type semiconductor laser diode having dielectric layer formed on active layer

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Quick Facts
Patent No.
US 7,899,103
App. No.
11/545,546
Granted
Mar 1, 2011
Kind
B2
Abstract

Provided is a side light emitting type semiconductor laser diode in which a dielectric layer is formed on an active layer. The side light emitting type semiconductor laser diode includes an n-clad layer, an n-light guide layer, an active layer and a p-light guide layer sequentially formed on a substrate, and a dielectric layer with a ridge structure formed on the p-light guide layer.

Claims (27)

1. A side light emitting type semiconductor laser diode comprising:

a substrate;

an n-clad layer disposed on the substrate;

an n-light guide layer disposed on the n-clad layer;

an active layer disposed on the n-light guide layer;

a p-light guide layer disposed on the active layer; and

a dielectric layer with a ridge structure disposed directly on the p-light guide layer,

wherein the p-light guide layer and the dielectric layer are sequentially disposed on the active layer, and

wherein the dielectric layer is located directly above a light mode generation region of the active layer.

2. A side light emitting type semiconductor laser diode comprising:

a substrate;

an n-clad layer disposed on the substrate;

an n-light guide layer disposed on the n-clad layer;

an active layer disposed on the n-light guide layer;

a p-light guide layer disposed on the active layer;

a p-contact layer directly disposed on the p-light guide layer; and

a dielectric layer with a ridge structure directly disposed on the p-contact layer.

3. The side light emitting type semiconductor laser diode of claim 2 , further comprising a p-electrode layer disposed on sides of the dielectric layer.

4. The side light emitting type semiconductor laser diode of claim 1 , further comprising:

an n-semiconductor layer interposed between the substrate and the n-clad layer; and

an n-electrode layer disposed on one portion of the n-semiconductor layer.

5. The side light emitting type semiconductor laser diode of claim 1 , wherein the n-clad layer is formed of Al x GaN (x≧0).

6. The side light emitting type semiconductor laser diode of claim 1 , wherein the n-light guide layer is formed of In x GaN (x≧0).

7. The side light emitting type semiconductor laser diode of claim 1 , wherein the active layer has a Multi Quantum Wall (MQW) structure formed of In x GaN (x≧0).

8. The side light emitting type semiconductor laser diode of claim 1 , wherein the p-light guide layer is formed of In x GaN (x≧0).

9. The side light emitting type semiconductor laser diode of claim 1 , wherein the dielectric layer includes at least one material selected from the group consisting of Si0 2 , SiN x , HfOx, AIN, Al 2 O 3 , TiO 2 , ZrO 2 , MnO, and Ta 2 0 5 .

10. The side light emitting type semiconductor laser diode of claim 2 , wherein the p-contact layer is formed of In x GaN (x≧0).

Assignments (3)
MERGER Recorded Aug 7, 2012
From: SAMSUNG LED CO., LTD.
To: SAMSUNG ELECTRONICS CO., LTD.
Reel/Frame 028744/0272 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Apr 15, 2010
From: SAMSUNG ELECTRONICS CO., LTD.
To: SAMSUNG LED CO., LTD.
Reel/Frame 024239/0782 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Oct 11, 2006
From: RYU, HAN-YOUL; HA, KYOUNG-HO
To: SAMSUNG ELECTRONICS CO., LTD.
Reel/Frame 018401/0826 →