Solar cell structure with localized doping in cap layer
View Patent ↗A solar cell includes a semiconductor substrate and a sequence of semiconductor layers disposed over the substrate. The sequence of semiconductor layers includes a semiconductor window layer. The solar cell also includes a semiconductor silicon-containing cap layer over the window layer. The cap layer is spatially separated from the window layer by a semiconductor barrier layer that either includes no silicon or has a silicon concentration that is significantly lower than the silicon concentration of the cap layer.
1. A solar cell comprising:
a semiconductor substrate;
a sequence of semiconductor layers disposed over the substrate to form a plurality of subcell structures including a top subcell structure and a bottom subcell structure, wherein the top subcell structure includes a back surface field layer, a base layer directly over the back surface field layer, an emitter layer directly over the base layer, and a semiconductor window layer directly over the emitter layer;
a semiconductor barrier layer over the window layer of the top subcell structure, wherein the semiconductor barrier layer does not constitute a base or emitter of any subcell structure; and
a semiconductor silicon-containing cap layer over the barrier layer, wherein the semiconductor barrier layer either includes no silicon or has a silicon concentration that is at least 50% lower than the silicon concentration of the cap layer.
2. The solar cell of claim 1 wherein the concentration of silicon in the barrier layer is at least two orders of magnitude less than the silicon concentration of the cap layer.
3. The solar cell of claim 1 wherein the barrier layer is thicker than the cap layer.
4. The solar cell of claim 3 wherein the barrier layer is at least several times thicker than the cap layer.
5. The solar cell of claim 1 wherein each of the barrier layer and the cap layer comprises a III-V semiconductor compound.
6. The solar cell of claim 5 wherein the window layer comprises a III-V semiconductor compound containing aluminum.
7. The solar cell of claim 1 wherein the window layer comprises a III-V semiconductor compound containing aluminum, each of the barrier layer and cap layer comprises a III-V semiconductor compound, and the barrier layer has a silicon concentration that is at least two orders of magnitude less than the silicon concentration of the cap layer.
8. The solar cell of claim 7 wherein the sequence of semiconductor layers comprises a multi-junction solar cell structure having a plurality of sub-cells stacked one above the other, wherein the window layer is near the top of the stack of sub-cells.
9. The solar cell of claim 7 wherein the concentration of silicon in the cap layer is in a range of about 1×10 18 cm −3 to about 1×10 19 cm −3 .
10. The solar cell of claim 7 wherein the concentration of silicon in the cap layer is in a range of about 5×10 18 cm −3 to about 6×10 18 cm −3 .
11. The solar cell of claim 7 wherein the barrier and cap layers comprise InGaAs.
12. A method of fabricating a solar cell comprising:
depositing a sequence of semiconductor layers to form a solar cell structure over a semiconductor substrate, wherein the sequence of semiconductor layers includes a base layer, an emitter layer directly over the base layer, and a window layer directly over the emitter layer;
depositing a semiconductor barrier layer directly over the window layer; and
depositing a semiconductor silicon-containing cap layer directly over the barrier layer, wherein the barrier layer either includes no silicon or has a silicon concentration that is at least 50% lower than the silicon concentration of the cap layer.
13. The method of claim 12 wherein the barrier layer has a silicon concentration that is at least two orders of magnitude less than the silicon concentration of the cap layer.
14. The method of claim 12 including depositing the cap layer to have a thickness less than the barrier layer.
15. The method of claim 14 including depositing the cap layer to have a thickness at least several times less than the barrier layer.
16. The method of claim 12 wherein each of the barrier and cap layers comprises a III-V semiconductor compound.
17. The method of claim 16 wherein the window comprises a III-V semiconductor compound containing aluminum.
18. The method of claim 12 wherein the window comprises a III-V semiconductor compound containing aluminum, each of the barrier and cap layers comprises a III-V semiconductor compound, and the barrier layer has a silicon concentration that is at least two orders of magnitude less than the silicon concentration of the cap layer.
19. The method of claim 18 wherein including depositing the sequence of semiconductor layers to form a multi junction solar cell structure having a plurality of sub-cells stacked one above the other, wherein the window is near the top of the stack of sub-cells.
20. The method of claim 18 wherein the concentration of silicon in the cap layer is in a range of about 1×10 18 cm −3 to about 1×10 19 cm −3 .
21. The method of claim 18 wherein the concentration of silicon in the cap layer is in a range of about 5×10 18 cm −3 to about 6×10 18 cm −3 .
22. The method of claim 18 wherein the barrier and cap layers comprise InGaAs.
23. The method of claim 12 including depositing layers for an integral active device over at least a portion of the cap layer.
24. The method of claim 12 including depositing layers for an integral bypass diode over at least a portion of the cap layer.
25. The method of claim 24 including depositing an etch-stop layer over the cap layer before depositing the layers for the integral bypass diode.
26. The method of claim 25 wherein the etch stop layer comprises AlGaAs.
27. A solar cell comprising:
a semiconductor substrate;
a sequence of semiconductor layers disposed over the substrate, wherein the sequence of semiconductor layers includes a top subcell structure and a bottom subcell structure, and wherein the top subcell structure-includes a base layer, an emitter layer directly over the base layer, and a window layer directly over the emitter layer; and
a semiconductor silicon-containing cap layer over the window layer of the top subcell structure, wherein the cap layer is spatially separated from the window layer of the top subcell structure by a semiconductor barrier layer to prevent diffusion of silicon from the cap layer into the window layer.
28. A method of fabricating a solar cell comprising:
depositing a sequence of semiconductor layers including a top subcell structure and a bottom subcell structure to form a solar cell structure over a semiconductor substrate, wherein the top subcell structure includes a base layer, an emitter layer directly over the base layer, and a window layer directly over the emitter layer;
depositing a semiconductor barrier layer directly over the window layer; and
depositing a semiconductor silicon-containing cap layer over the barrier layer, wherein the barrier layer prevents diffusion of silicon from the cap layer into the window layer of the top subcell structure.
29. The method of claim 28 , wherein the semiconductor barrier layer is an undoped or unintentionally doped layer that does not constitute a base or emitter layer of any subcell structure.
30. The solar cell of claim 27 , wherein the semiconductor barrier layer is an undoped or unintentionally doped layer that does not constitute a base or emitter layer of any subcell structure.