METHOD OF MAKING SEMICONDUCTOR PACKAGE WITH REDUCED MOISTURE SENSITIVITY
A method of making a semiconductor package ( 10 ) includes placing an integrated circuit (IC) die ( 12 ) on a first side ( 14 ) of a substrate ( 16 ) and electrically connecting the IC die ( 12 ) to the first side ( 14 ) of the substrate ( 16 ). First solder balls ( 22 ) are attached to a second side ( 24 ) of the substrate ( 16 ). An interposer ( 28 ) is attached to the IC die ( 12 ). A molding operation is performed to encapsulate the IC die ( 12 ), the substrate ( 16 ), at least a portion of the interposer ( 28 ) and at least a portion of the first solder balls ( 22 ).
1 . A method of making a semiconductor package, comprising:
placing an integrated circuit (IC) die on a first side of a substrate;
electrically coupling the IC die to the first side of the substrate;
attaching a plurality of first conductive balls to a second side of the substrate;
attaching an interposer to the IC die; and
performing a molding operation to encapsulate the IC die, the substrate, at least a portion of the interposer and at least a portion of the first conductive balls.
2 . The method of making a semiconductor package of claim 1 , further comprising curing the substrate before performing the molding operation.
3 . The method of making a semiconductor package of claim 2 , further comprising pre-baking the substrate before performing the molding operation.
4 . The method of making a semiconductor package of claim 1 , wherein a molding compound having a moisture absorption rate of about 0.16 or less by weight percent (wt %) is used to encapsulate the IC die, the substrate, the interposer and the first solder balls.
5 . The method of making a semiconductor package of claim 1 , wherein the interposer is a heat sink.
6 . The method of making a semiconductor package of claim 5 , wherein the heat sink is made of copper.
7 . The method of making a semiconductor package of claim 5 , wherein a conductive epoxy is used to attach the heat sink to the IC die.
8 . The method of making a semiconductor package of claim 1 , wherein the first conductive balls are compressed during the molding operation.
9 . The method of making a semiconductor package of claim 8 , further comprising attaching respective ones of a plurality of second conductive balls to respective ones of the compressed first conductive balls.
10 . The method of making a semiconductor package of claim 9 , wherein the first and second conductive balls comprise C5 solder balls.
11 . The method of making a semiconductor package of claim 1 , further comprising disposing an underfill material beneath the IC die after attaching the IC die to the substrate.
12 . The method of making a semiconductor package of claim 11 , wherein the IC die comprises a flip-chip die and the IC die is electrically coupled to the substrate with C4 solder balls.
13 . A method of making a plurality of semiconductor packages, comprising:
placing a plurality of integrated circuit (IC) dice on a first side of a substrate;
electrically coupling the IC dice to the first side of the substrate;
attaching a plurality of first solder balls to a second side of the substrate;
attaching an interposer to the IC dice;
performing a molding operation to encapsulate the IC dice, the substrate, at least a portion of the interposer and at least a portion of the first conductive balls; and
performing a singulating operation to separate adjacent ones of the IC dice, thereby forming the plurality of semiconductor packages.
14 . The method of making a plurality of semiconductor packages of claim 13 , further comprising curing the substrate before performing the molding operation.
15 . The method of making a plurality of semiconductor packages of claim 14 , further comprising pre-baking the substrate before performing the molding operation.
16 . The method of making a plurality of semiconductor packages of claim 13 , wherein the IC die comprise flip-chip IC dice and the IC die are electrically coupled to the substrate with C4 solder balls.
17 . The method of making a plurality of semiconductor packages of claim 16 , further comprising disposing an underfill material beneath the IC die and around the C4 solder balls.
18 . The method of making a plurality of semiconductor packages of claim 13 , wherein the first conductive balls are compressed during the molding operation.
19 . The method of making a plurality of semiconductor packages of claim 13 , further comprising attaching respective ones of a plurality of second conductive balls to respective ones of the compressed first conductive balls.
20 . A method of making a semiconductor package, comprising:
placing a flip-chip integrated circuit (IC) die on a first side of a substrate, wherein the flip-chip die includes a plurality of conductive bumps on a first side thereof that electrically couple the IC die to the substrate;
disposing an underfill material around the flip-chip die conductive bumps;
attaching a plurality of first conductive balls to a second side of the substrate, wherein the first conductive balls are electrically coupled to the flip-chip die by way of the substrate;
attaching a heat sink to a second side of the flip-chip die with a conductive epoxy material;
performing a molding operation to encapsulate the IC die, the substrate, at least a portion of the heat sink and at least a portion of the first conductive balls, wherein the first conductive balls are compressed and deformed by a mold press during the molding operation; and
attaching respective ones of a plurality of second conductive balls to respective ones of the compressed first conductive balls.