IP Library Granted Patent US 7,855,549
Granted Patent B2
US 7,855,549 · App. 11/553,574 · Granted Dec 21, 2010

Integrated process condition sensing wafer and data analysis system

Assignee: KLA-Tencor Corporation
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Quick Facts
Patent No.
US 7,855,549
App. No.
11/553,574
Granted
Dec 21, 2010
Kind
B2
Abstract

A process condition measuring device and a handling system may be highly integrated with a production environment where the dimensions of the process condition measuring device are close to those of a production substrate and the handling system is similar to a substrate carrier used for production substrates. Process conditions may be measured with little disturbance to the production environment. Data may be transferred from a process condition-measuring device to a user with little or no human intervention.

Claims (8)

1. In a battery powered portable measuring instrument including a substrate with a plurality of sensors of a parameter distributed across a surface thereof, a method of compressing the amount of data obtained from the sensors of the parameter by processing on the measuring instrument, comprising:

computing different sets of differences between values of the parameter from the same set of data by:

calculating a first set of differences between values of the parameter read at different times by individual sensors,

calculating a second set of differences between values of the parameter read at a given time by the plurality of sensors, and

selecting one of the first set or second set of differences that represents the values of the parameter read by the sensors with the lesser amount of data.

2. The method of claim 1 , wherein the values of the parameter are digital values.

3. The method of claim 2 , wherein the digital values contain a number of bits that represent the values measured by the sensors with a full resolution.

4. The method of claim 3 , wherein the differences between the values of the parameter comprise a fewer number of bits than the values with the full resolution.

Assignments (2)
MERGER Recorded Nov 2, 2010
From: SENSARRAY CORPORATION
To: KLA-TENCOR CORPORATION
Reel/Frame 025236/0716 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Oct 1, 2009
From: RENKEN, WAYNE GLENN; JENSEN, EARL M.; GORDON, ROY; PAQUETTE, BRIAN; SUN, MEI H.
To: SENSARRAY CORPORATION
Reel/Frame 023316/0026 →
Continuity (6)
Division 1083735900 · Apr 29, 2004
Continuation In Part 1071826900 · Nov 19, 2003
Provisional Application 6043085800 · Dec 3, 2002
Provisional Application 6049629400 · Aug 19, 2003
Provisional Application 6051224300 · Oct 17, 2003
Related Publication 20070046284A1 · Mar 1, 2007