Support mount for electronic components
For the cushioned support of electronic components in a mounting enclosure of a miniaturized electronic device, an elastic and/or flexible retaining element ( 15 ) with inward-protruding support sections ( 17 ) extends along at least parts of the inner wall of the mounting enclosure ( 3 ), serving to position, support and retain the component ( 1 ).
1. Method for producing a system for cushioned support of an electronic component ( 1 ) in a multi-part mounting enclosure ( 3 ) of a miniaturized electronic device, the system comprising an elastic and/or flexible retaining element ( 15 ) that extends along a portion of an inner wall of a plurality of separate enclosure portions that collectively form an exterior periphery of the mounting enclosure ( 3 ) and are provided with inward-protruding support sections ( 17 ) serving to position and retain the electronic component ( 1 ) within the mounting enclosure ( 3 ), the method comprising forming a at least one of the enclosure portions of the mounting enclosure ( 3 ) for the electronic component ( 1 ) together with the retaining element ( 15 ) comprising the support sections ( 17 ) in a single molding operation by utilizing a two-component injection-molding technique to bond the retaining element to the at least one of the enclosure portions of the mounting enclosure ( 3 ), during which the retaining element ( 15 ) and the support sections ( 17 ) are molded from a thermoplastic elastomer.
2. Method for producing a system as in claim 1 , characterized in that a bond between the support sections ( 17 ) and the mounting enclosure ( 3 ) for the electronic component ( 1 ) couples at least two different materials together, each of said different materials comprising a different hardness.