IP Library Granted Patent US 8,024,014
Granted Patent B2
US 8,024,014 · App. 11/574,010 · Granted Sep 20, 2011

Wireless terminal, wireless module and method of manufacturing such a terminal

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Quick Facts
Patent No.
US 8,024,014
App. No.
11/574,010
Granted
Sep 20, 2011
Kind
B2
Abstract

A wireless terminal is described, which is formed from a module ( 20 ) comprising a substrate, RF components ( 32, 33 ), an antenna ( 25 ), notably of the PIFA type, and a linkage part ( 30 ) for linking the antenna to the substrate. The RF components are placed in the vicinity of the linkage part or even on the linkage part without degrading the operation of the antenna. By placing the RF components on this link, an area is made available for circuitry on the substrate.

Claims (26)

1. A wireless terminal formed from a module comprising a main board, RF components, an antenna placed on an antenna substrate and a linkage substrate for linking the antenna to the main board, characterized in that at least one RF component is mounted on the linkage substrate, wherein the antenna substrate comprises a planar structure and wherein the main board and the planar structure are separated by the linkage substrate.

2. A wireless terminal as claimed in claim 1 , characterized in that at least one RF component is mounted on the antenna substrate.

3. A wireless terminal as claimed in claim 1 , characterized in that the antenna substrate and the linkage substrate are made from the same malleable substrate in the form of a flexible PCB and the malleable substrate is folded to form the linkage substrate.

4. A wireless terminal as claimed in claim 1 , characterized in that the antenna is one of the PIFA type.

5. A wireless terminal as claimed in claim 4 , wherein the antenna is fed by way of a feed tab, characterized in that the feed tab is placed on the linkage substrate.

6. A wireless terminal as claimed in claim 4 , wherein the antenna placed on the antenna substrate is fed by way of a feed tab, characterized in that the feed tab is placed on the antenna substrate.

7. A wireless module comprising an antenna placed on an antenna substrate, a main board notably accommodating main circuits, RF components, and a linkage substrate for linking the antenna substrate to the main board, characterized in that at least one RF component is placed on the antenna substrate, wherein the linkage substrate comprises a shorting tab and wherein data and power lines run above or within the shorting tab.

8. A method of manufacturing a wireless terminal as claimed in claim 1 , characterized in that the method comprises the steps of:

starting from a PCB provided with a pattern of the antenna substrate, main circuits are at least one of the RF component,

splitting up the PCB into three parts, a first part being allocated to the main board, a second part being allocated to the antenna substrate, and a linkage part being allocated to the linkage substrate for linking the first part with the second part,

placing at least various main circuits on the first part, on the second part, and some RF components on the linkage part,

folding these parts in such a way that they can be placed in a housing suitable for the wireless terminal.

9. The wireless terminal of claim 1 wherein the planar structure of the antenna substrate is parallel to the main board.

10. The wireless module of claim 7 , characterized in that the antenna substrate and the linkage substrate are made from the same malleable substrate in the form of a flexible PCB and the malleable substrate is folded to form the linkage substrate.

11. A wireless terminal formed from a module comprising a main board, RF components, an antenna mounted on an antenna substrate and a linkage substrate for linking the antenna to the main board, characterized in that at least one RF component is mounted on the antenna substrate, characterized in that the antenna substrate and the linkage substrate are made from a malleable substrate in the form of a flexible PCB.

12. A wireless terminal as claimed in claim 11 , characterized in that the antenna is one of the PIFA type.

13. A method of manufacturing a wireless terminal as claimed in claim 11 , characterized in that the method comprises the steps of:

starting from a PCB provided with a pattern of the antenna substrate, the main circuits are at least one of the RF components,

splitting up the PCB into three parts, a first part being allocated to the main board, a second part being allocated to the antenna substrate, and a linkage part being allocated to the linkage substrate for linking the first part with the second part,

placing at least various main circuits on the first part and on the second part,

folding these parts in such a way that they can be placed in a housing suitable for the wireless terminal.

14. The wireless terminal of claim 11 wherein the antenna substrate comprises a planar structure and wherein the main board and the planar structure are separated by the linkage substrate.

15. The wireless terminal of claim 14 wherein the planar structure of the antenna substrate is parallel to the main board.

16. A wireless terminal formed from a module comprising a main board, RF components, an antenna placed on an antenna substrate and a linkage substrate for linking the antenna to the main board, characterized in that at least one RF component is mounted on the antenna substrate, wherein the antenna substrate comprises a planar structure and wherein the main board and the planar structure are separated by the linkage substrate.

17. The wireless terminal of claim 16 wherein the planar structure is parallel to the main board.

18. The wireless terminal of claim 1 wherein the main board, the linkage substrate, and the antenna substrate are formed from the same PCB.

Assignments (13)
CORRECTIVE ASSIGNMENT TO CORRECT THE REMOVE APPLICATION 12298143 PREVIOUSLY RECORDED ON REEL 042985 FRAME 0001. ASSIGNOR(S) HEREBY CONFIRMS THE SECURITY AGREEMENT SUPPLEMENT. Recorded Oct 22, 2019
From: NXP B.V.
To: MORGAN STANLEY SENIOR FUNDING, INC.
Reel/Frame 051029/0001 →
CORRECTIVE ASSIGNMENT TO CORRECT THE REMOVE APPLICATION 12298143 PREVIOUSLY RECORDED ON REEL 042762 FRAME 0145. ASSIGNOR(S) HEREBY CONFIRMS THE SECURITY AGREEMENT SUPPLEMENT. Recorded Oct 22, 2019
From: NXP B.V.
To: MORGAN STANLEY SENIOR FUNDING, INC.
Reel/Frame 051145/0184 →
CORRECTIVE ASSIGNMENT TO CORRECT THE REMOVE APPLICATION 12298143 PREVIOUSLY RECORDED ON REEL 038017 FRAME 0058. ASSIGNOR(S) HEREBY CONFIRMS THE SECURITY AGREEMENT SUPPLEMENT. Recorded Oct 22, 2019
From: NXP B.V.
To: MORGAN STANLEY SENIOR FUNDING, INC.
Reel/Frame 051030/0001 →
CORRECTIVE ASSIGNMENT TO CORRECT THE REMOVE APPLICATION 12298143 PREVIOUSLY RECORDED ON REEL 039361 FRAME 0212. ASSIGNOR(S) HEREBY CONFIRMS THE SECURITY AGREEMENT SUPPLEMENT. Recorded Oct 22, 2019
From: NXP B.V.
To: MORGAN STANLEY SENIOR FUNDING, INC.
Reel/Frame 051029/0387 →
RELEASE OF SECURITY INTEREST Recorded Sep 10, 2019
From: MORGAN STANLEY SENIOR FUNDING, INC.
To: NXP B.V.
Reel/Frame 050745/0001 →
CHANGE OF NAME Recorded Sep 22, 2017
From: PHILIPS SEMICONDUCTORS INTERNATIONAL B.V.
To: NXP B.V.
Reel/Frame 043951/0436 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Sep 22, 2017
From: KONINKLIJKE PHILIPS ELECTRONICS N.V.
To: PHILIPS SEMICONDUCTORS INTERNATIONAL B.V.
Reel/Frame 043955/0001 →
CORRECTIVE ASSIGNMENT TO CORRECT THE REMOVE APPLICATION 12681366 PREVIOUSLY RECORDED ON REEL 038017 FRAME 0058. ASSIGNOR(S) HEREBY CONFIRMS THE SECURITY AGREEMENT SUPPLEMENT. Recorded May 9, 2017
From: NXP B.V.
To: MORGAN STANLEY SENIOR FUNDING, INC.
Reel/Frame 042985/0001 →
CORRECTIVE ASSIGNMENT TO CORRECT THE REMOVE APPLICATION 12681366 PREVIOUSLY RECORDED ON REEL 039361 FRAME 0212. ASSIGNOR(S) HEREBY CONFIRMS THE SECURITY AGREEMENT SUPPLEMENT. Recorded May 9, 2017
From: NXP B.V.
To: MORGAN STANLEY SENIOR FUNDING, INC.
Reel/Frame 042762/0145 →
CORRECTIVE ASSIGNMENT TO CORRECT THE REMOVE APPLICATION 12092129 PREVIOUSLY RECORDED ON REEL 038017 FRAME 0058. ASSIGNOR(S) HEREBY CONFIRMS THE SECURITY AGREEMENT SUPPLEMENT. Recorded Jul 14, 2016
From: NXP B.V.
To: MORGAN STANLEY SENIOR FUNDING, INC.
Reel/Frame 039361/0212 →
SECURITY AGREEMENT SUPPLEMENT Recorded Mar 7, 2016
From: NXP B.V.
To: MORGAN STANLEY SENIOR FUNDING, INC.
Reel/Frame 038017/0058 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Aug 17, 2007
From: KONINKLIJKE PHILIPS ELECTRONICS N.V.
To: NXP B.V.
Reel/Frame 019719/0843 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Mar 12, 2007
From: BOYLE, KEVIN
To: KONINKLIJKE PHILIPS ELECTRONICS N.V.
Reel/Frame 018999/0162 →