IP Library Granted Patent US 8,004,049
Granted Patent B2
US 8,004,049 · App. 11/574,478 · Granted Aug 23, 2011

Power semiconductor device

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Quick Facts
Patent No.
US 8,004,049
App. No.
11/574,478
Granted
Aug 23, 2011
Kind
B2
Abstract

A device includes an array of cells, the source regions of the individual cells comprising a plurality of source region branches each extending towards a source region branch of an adjacent cell, the base regions of the individual cells comprising a corresponding plurality of base region branches merging together to form a single base region surrounding the source regions. The junctions between the merged base region and the drain region define rounded current conduction path areas for the on-state of the device between adjacent cells. Floating voltage regions of opposite conductivity type to the drain region are buried in the substrate beneath the merged base region. The features of the floating voltage regions define rings of the opposite conductivity type to the drain region that surround the current conduction paths of respective cells. The floating voltage regions include respective islands situated within the current conduction paths.

Claims (34)

1. A power semiconductor device comprising an array of cells, each cell of the array comprising

a source region formed at the substrate surface,

a base region surrounding said source region in the substrate,

a drain region underlying said source region and said base region, and a drain electrode contacting said drain region,

a plurality of branches each extending laterally outwards towards at least one branch of an adjacent cell, the source regions in the branches of adjacent cells presenting juxtaposed ends, the base regions in the branches of the individual cells of the array comprising a corresponding plurality of base region branches each extending laterally outwards towards at least one base region in a branch of an adjacent cell, and the base regions in the branches of adjacent cells merging together adjacent and between said juxtaposed ends to form a single base region surrounding said source regions of the individual cells of said array in the substrate, with junctions that laterally are solely concave between the merged base region and the drain region defining a portion of a rounded current conduction path for the on-state of the device between adjacent cells that are depleted in the off-state of the device to block flow of current between the source regions and the drain electrode, and

a floating voltage region of opposite conductivity type to said drain region, buried in the substrate, extending beneath said merged base region and presenting a portion of a floating voltage feature and a portion of a floating island, the floating voltage regions of adjacent cells merge together to define the floating voltage feature completely surrounding laterally said current conduction path, and wherein the floating island is situation within said conduction path.

2. A power semiconductor device as claimed in claim 1 , wherein said floating voltage regions extend adjacent an interface between two layers of said substrate.

3. A power semiconductor device as claimed in claim 2 , wherein each of said current conduction paths includes, adjacent said interface, a further layer that is more lightly doped than said two layers and is of a same conductivity type as said two layers.

4. A power semiconductor device as claimed in claim 2 , wherein said two layers are epitaxial layers.

5. A power semiconductor device as claimed in claim 3 , wherein said two layers are epitaxial layers.

6. A semiconductor device having a plurality of cells arranged in an array, the device comprising:

a portion of the plurality of cells form a two-dimensional array, each cell of the two-dimensional array adjacent to each other cell of the two-dimensional array of cells, and each cell of the two-dimensional array comprising:

a source region;

a base region surrounding said source region;

a drain region underlying the source region and the base region; and

a floating voltage region buried in said drain region and of opposite conductivity type to said drain region, said floating voltage region presenting a portion of a first floating voltage feature that along with first floating voltage regions of each other cell of the two-dimensional array completely surrounds laterally a first current conduction path of said device for an on state.

7. A semiconductor device as claimed in claim 6 , wherein said floating voltage region additionally presenting a portion of a first floating voltage island situated within said first current conduction path.

8. A semiconductor device as claimed in claim 7 , wherein said floating voltage region presenting a portion of a second floating voltage feature that completely surrounds laterally a second current conduction path of said device for the on state, and said floating voltage region additionally presenting a portion of a second floating voltage island situation within said second current conduction path.

9. A semiconductor device as claimed in claim 8 , wherein said floating voltage region is merged together with floating voltage regions of adjacent cells.

10. A device as claimed in claim 6 , wherein said source region is at a first major surface of a substrate.

11. A device as claimed in claim 6 , wherein said source region is at a first major surface of a substrate, and said drain region includes a drain contact at a second major surface of said substrate, said second major surface being located opposite and parallel to said first major surface.

12. A device as claimed in claim 6 , wherein each one of said base regions comprise a plurality of base branches, each base branch extending laterally outwards towards a base branch of an adjacent cell and surrounding a corresponding source branch of said source region.

13. A device as claimed in claim 12 , wherein each base branch is merged together with a corresponding base branch of an adjacent cell.

14. A device as claimed in claim 6 , wherein a first portion of said drain region that is lateral to said floating voltage region has a lighter doping concentration than a second portion and a third portion of said drain region, said first portion being located between said second portion and said third portion.

15. A device as claimed in claim 6 , wherein each cell has a pitch of at least approximately 8 micrometers.

16. A method of forming a semiconductor device comprising a plurality of cells arranged in an array the method comprising:

forming a two-dimensional array of cells from a portion of the plurality of cells, each cell of the two-dimensional array of cells adjacent to each other cell of the two-dimensional array, and each cell of the two-dimensional array further formed by:

forming a source region;

forming a base region surrounding said source region;

forming a drain region underlying the source region; and

forming a floating voltage region buried in said drain region and of opposite conductivity type to said drain region, said floating voltage region presenting a portion of a first floating voltage feature that along with first floating voltage regions of each other cell of the two-dimensional array completely surrounds laterally a first current conduction path of said device for an on state.

17. A method as claimed in claim 16 wherein said floating voltage region additionally presenting a portion of a first floating voltage island situated within said first current conduction path.

18. The device of claim 6 , wherein the two-dimensional array is a two-by-two array.

19. The method of claim 16 , wherein the two-dimensional array is a two-by-two array.

Assignments (32)
CORRECTIVE ASSIGNMENT TO CORRECT THE REMOVE APPLICATION 11759915 AND REPLACE IT WITH APPLICATION 11759935 PREVIOUSLY RECORDED ON REEL 040925 FRAME 0001. ASSIGNOR(S) HEREBY CONFIRMS THE RELEASE OF SECURITY INTEREST. Recorded Feb 17, 2020
From: MORGAN STANLEY SENIOR FUNDING, INC.
To: NXP, B.V. F/K/A FREESCALE SEMICONDUCTOR, INC.
Reel/Frame 052917/0001 →
CORRECTIVE ASSIGNMENT TO CORRECT THE REMOVE APPLICATION 11759915 AND REPLACE IT WITH APPLICATION 11759935 PREVIOUSLY RECORDED ON REEL 040928 FRAME 0001. ASSIGNOR(S) HEREBY CONFIRMS THE RELEASE OF SECURITY INTEREST. Recorded Jan 17, 2020
From: MORGAN STANLEY SENIOR FUNDING, INC.
To: NXP B.V.
Reel/Frame 052915/0001 →
CORRECTIVE ASSIGNMENT TO CORRECT THE REMOVE APPLICATION 11759915 AND REPLACE IT WITH APPLICATION 11759935 PREVIOUSLY RECORDED ON REEL 037486 FRAME 0517. ASSIGNOR(S) HEREBY CONFIRMS THE ASSIGNMENT AND ASSUMPTION OF SECURITY INTEREST IN PATENTS. Recorded Dec 10, 2019
From: CITIBANK, N.A.
To: MORGAN STANLEY SENIOR FUNDING, INC.
Reel/Frame 053547/0421 →
CORRECTIVE ASSIGNMENT TO CORRECT THE REMOVE APPLICATION 12298143 PREVIOUSLY RECORDED ON REEL 042985 FRAME 0001. ASSIGNOR(S) HEREBY CONFIRMS THE SECURITY AGREEMENT SUPPLEMENT. Recorded Oct 22, 2019
From: NXP B.V.
To: MORGAN STANLEY SENIOR FUNDING, INC.
Reel/Frame 051029/0001 →
CORRECTIVE ASSIGNMENT TO CORRECT THE REMOVE APPLICATION 12298143 PREVIOUSLY RECORDED ON REEL 039361 FRAME 0212. ASSIGNOR(S) HEREBY CONFIRMS THE SECURITY AGREEMENT SUPPLEMENT. Recorded Oct 22, 2019
From: NXP B.V.
To: MORGAN STANLEY SENIOR FUNDING, INC.
Reel/Frame 051029/0387 →
CORRECTIVE ASSIGNMENT TO CORRECT THE REMOVE APPLICATION 12298143 PREVIOUSLY RECORDED ON REEL 042762 FRAME 0145. ASSIGNOR(S) HEREBY CONFIRMS THE SECURITY AGREEMENT SUPPLEMENT. Recorded Oct 22, 2019
From: NXP B.V.
To: MORGAN STANLEY SENIOR FUNDING, INC.
Reel/Frame 051145/0184 →
CORRECTIVE ASSIGNMENT TO CORRECT THE REMOVE APPLICATION 12298143 PREVIOUSLY RECORDED ON REEL 038017 FRAME 0058. ASSIGNOR(S) HEREBY CONFIRMS THE SECURITY AGREEMENT SUPPLEMENT. Recorded Oct 22, 2019
From: NXP B.V.
To: MORGAN STANLEY SENIOR FUNDING, INC.
Reel/Frame 051030/0001 →
RELEASE OF SECURITY INTEREST Recorded Sep 10, 2019
From: MORGAN STANLEY SENIOR FUNDING, INC.
To: NXP B.V.
Reel/Frame 050745/0001 →
RELEASE OF SECURITY INTEREST Recorded Sep 10, 2019
From: MORGAN STANLEY SENIOR FUNDING, INC.
To: NXP B.V.
Reel/Frame 050744/0097 →
CORRECTIVE ASSIGNMENT TO CORRECT THE TO CORRECT THE APPLICATION NO. FROM 13,883,290 TO 13,833,290 PREVIOUSLY RECORDED ON REEL 041703 FRAME 0536. ASSIGNOR(S) HEREBY CONFIRMS THE THE ASSIGNMENT AND ASSUMPTION OF SECURITY INTEREST IN PATENTS.. Recorded Feb 20, 2019
From: MORGAN STANLEY SENIOR FUNDING, INC.
To: SHENZHEN XINGUODU TECHNOLOGY CO., LTD.
Reel/Frame 048734/0001 →
CORRECTIVE ASSIGNMENT TO CORRECT THE REMOVE APPLICATION 12681366 PREVIOUSLY RECORDED ON REEL 039361 FRAME 0212. ASSIGNOR(S) HEREBY CONFIRMS THE SECURITY AGREEMENT SUPPLEMENT. Recorded May 9, 2017
From: NXP B.V.
To: MORGAN STANLEY SENIOR FUNDING, INC.
Reel/Frame 042762/0145 →
CORRECTIVE ASSIGNMENT TO CORRECT THE REMOVE APPLICATION 12681366 PREVIOUSLY RECORDED ON REEL 038017 FRAME 0058. ASSIGNOR(S) HEREBY CONFIRMS THE SECURITY AGREEMENT SUPPLEMENT. Recorded May 9, 2017
From: NXP B.V.
To: MORGAN STANLEY SENIOR FUNDING, INC.
Reel/Frame 042985/0001 →
CORRECTIVE ASSIGNMENT TO CORRECT THE REMOVE PATENTS 8108266 AND 8062324 AND REPLACE THEM WITH 6108266 AND 8060324 PREVIOUSLY RECORDED ON REEL 037518 FRAME 0292. ASSIGNOR(S) HEREBY CONFIRMS THE ASSIGNMENT AND ASSUMPTION OF SECURITY INTEREST IN PATENTS. Recorded Feb 1, 2017
From: CITIBANK, N.A.
To: MORGAN STANLEY SENIOR FUNDING, INC.
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CORRECTIVE ASSIGNMENT TO CORRECT THE NATURE OF CONVEYANCE LISTED CHANGE OF NAME SHOULD BE MERGER AND CHANGE PREVIOUSLY RECORDED AT REEL: 040652 FRAME: 0180. ASSIGNOR(S) HEREBY CONFIRMS THE MERGER AND CHANGE OF NAME. Recorded Jan 12, 2017
From: FREESCALE SEMICONDUCTOR INC.
To: NXP USA, INC.
Reel/Frame 041354/0148 →
CHANGE OF NAME Recorded Nov 8, 2016
From: FREESCALE SEMICONDUCTOR INC.
To: NXP USA, INC.
Reel/Frame 040652/0180 →
RELEASE OF SECURITY INTEREST Recorded Nov 7, 2016
From: MORGAN STANLEY SENIOR FUNDING, INC.
To: NXP B.V.
Reel/Frame 040928/0001 →
RELEASE OF SECURITY INTEREST Recorded Sep 21, 2016
From: MORGAN STANLEY SENIOR FUNDING, INC.
To: NXP, B.V., F/K/A FREESCALE SEMICONDUCTOR, INC.
Reel/Frame 040925/0001 →
CORRECTIVE ASSIGNMENT TO CORRECT THE REMOVE APPLICATION 12092129 PREVIOUSLY RECORDED ON REEL 038017 FRAME 0058. ASSIGNOR(S) HEREBY CONFIRMS THE SECURITY AGREEMENT SUPPLEMENT. Recorded Jul 14, 2016
From: NXP B.V.
To: MORGAN STANLEY SENIOR FUNDING, INC.
Reel/Frame 039361/0212 →
SUPPLEMENT TO THE SECURITY AGREEMENT Recorded Jun 16, 2016
From: FREESCALE SEMICONDUCTOR, INC.
To: MORGAN STANLEY SENIOR FUNDING, INC.
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SECURITY AGREEMENT SUPPLEMENT Recorded Mar 7, 2016
From: NXP B.V.
To: MORGAN STANLEY SENIOR FUNDING, INC.
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ASSIGNMENT AND ASSUMPTION OF SECURITY INTEREST IN PATENTS Recorded Jan 13, 2016
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ASSIGNMENT AND ASSUMPTION OF SECURITY INTEREST IN PATENTS Recorded Jan 12, 2016
From: CITIBANK, N.A.
To: MORGAN STANLEY SENIOR FUNDING, INC.
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PATENT RELEASE Recorded Dec 21, 2015
From: CITIBANK, N.A., AS COLLATERAL AGENT
To: FREESCALE SEMICONDUCTOR, INC.
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PATENT RELEASE Recorded Dec 21, 2015
From: CITIBANK, N.A., AS COLLATERAL AGENT
To: FREESCALE SEMICONDUCTOR, INC.
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PATENT RELEASE Recorded Dec 21, 2015
From: CITIBANK, N.A., AS COLLATERAL AGENT
To: FREESCALE SEMICONDUCTOR, INC.
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SECURITY AGREEMENT Recorded Nov 6, 2013
From: FREESCALE SEMICONDUCTOR, INC.
To: CITIBANK, N.A., AS NOTES COLLATERAL AGENT
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ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Sep 10, 2013
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SECURITY AGREEMENT Recorded Jun 18, 2013
From: FREESCALE SEMICONDUCTOR, INC.
To: CITIBANK, N.A., AS NOTES COLLATERAL AGENT
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SECURITY AGREEMENT Recorded May 13, 2010
From: FREESCALE SEMICONDUCTOR, INC.
To: CITIBANK, N.A., AS COLLATERAL AGENT
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SECURITY AGREEMENT Recorded Mar 15, 2010
From: FREESCALE SEMICONDUCTOR, INC.
To: CITIBANK, N.A.
Reel/Frame 024085/0001 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jan 26, 2010
From: REYNES, JEAN-MICHEL; ALVES, STEPHANE; DERAM, IVANA; LOPES, BLANDINO; MARGHERITTA, JOEL; MORANCHO, FREDERIC
To: FREESCALE SEMICONDUCTOR, INC.
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SECURITY AGREEMENT Recorded Sep 19, 2007
From: FREESCALE SEMICONDUCTOR, INC.
To: CITIBANK, N.A.
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