IP Library Granted Patent US 7,713,809
Granted Patent B2
US 7,713,809 · App. 11/580,013 · Granted May 11, 2010

Image sensor for reduced dark current

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Quick Facts
Patent No.
US 7,713,809
App. No.
11/580,013
Granted
May 11, 2010
Kind
B2
Abstract

A method and structure for reducing dark current in an image sensor includes preventing unwanted electrons from being collected in the photosensitive region of the image sensor. In one embodiment, dark current is reduced by providing a deep n-type region having an n-type peripheral sidewall formed in a p-type substrate region underlying a pixel array region to separate the pixel array region from a peripheral circuitry region of the image sensor. The method and structure also provide improved protection from blooming.

Claims (10)

1. A method of forming a structure for isolating a pixel imaging area, said method comprising:

forming a second conductivity type region, and a first conductivity type region over said second conductivity type region, in a substrate;

forming an isolation structure having at least one sidewall of a second conductivity type in said substrate to contact said second conductivity type region and define a separated pixel array region and peripheral circuit region; and

forming at least one first conductivity type wall for contacting said first conductivity type region, said first conductivity type wall being formed entirely between said at least one second conductivity type sidewall and said pixel array region.

2. The method of claim 1 wherein forming said second conductivity type region comprises forming a well under said pixel array region and in electrical communication with said sidewall.

3. The method of claim 2 wherein forming said well comprises forming the second conductivity type region to separate said first conductivity type region from another first conductivity type region.

4. The method of claim 1 wherein forming said sidewall comprises forming said sidewall around a perimeter of said pixel array region.

5. The method of claim 1 wherein forming said first conductivity type region comprises forming an epitaxial layer.

6. The method of claim 1 wherein said first conductivity type comprises a p-type conductivity and said second conductivity type comprises an n-type conductivity.

7. The method of claim 1 wherein forming said sidewall comprises forming a contiguous structure.

Assignments (2)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Dec 6, 2016
From: MICRON TECHNOLOGY, INC.
To: APTINA IMAGING CORPORATION
Reel/Frame 040823/0001 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Nov 14, 2016
From: RHODES, HOWARD E.; COLE, STEVE
To: MICRON TECHNOLOGY, INC.
Reel/Frame 040304/0065 →