IP Library › Granted Patent US 7,615,446
Granted Patent B2
US 7,615,446 · App. 11/580,102 · Granted Nov 10, 2009

Charge trap flash memory device, fabrication method thereof, and write/read operation control method thereof

Assignee: Samsung Electronics Co., Ltd.
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Quick Facts
Patent No.
US 7,615,446
App. No.
11/580,102
Granted
Nov 10, 2009
Kind
B2
Abstract

In one aspect, a charge trap flash memory device is provided which includes a semiconductor substrate, source and drain regions which are spaced apart in an active region of the semiconductor substrate to define a channel region therebetween, a tunneling dielectric layer located on the channel region, an organic polymer thin film located on the tunneling dielectric layer, metal or metal oxide nano-crystals embedded in the organic polymer thin film, and a gate located on the organic polymer thin film.

Claims (41)

1. A method of fabricating a charge trap flash memory device, the method comprising:

forming a tunneling dielectric layer on a semiconductor substrate;

forming an organic polymer thin film on the tunneling dielectric layer, the organic polymer thin film comprising embedded metal or metal oxide nano-crystals for trapping charges;

forming a gate layer on the organic polymer thin film; and

patterning the gate layer, the organic polymer thin film and the tunneling dielectric layer, and forming source and drain regions in the semiconductor substrate.

2. The method of claim 1 , wherein the tunneling dielectric layer is formed of silicon oxide.

3. A method of fabricating a charge trap flash memory device, the method comprising:

forming a tunneling dielectric layer on a semiconductor substrate;

forming an organic polymer thin film on the tunneling dielectric layer, the organic polymer thin film comprising embedded metal or metal oxide nano-crystals;

forming a gate layer on the organic polymer thin film; and

patterning the gate layer, the organic polymer thin film and the tunneling dielectric layer, and forming source and drain regions in the semiconductor substrate,

wherein forming the organic polymer thin film comprises:

forming a metal film on the tunneling dielectric layer;

forming an acidic precursor film of organic polymer on the metal film to obtain a resultant product; and

annealing the resultant product to form the organic polymer thin film comprising the embedded metal or metal oxide nano-crystals.

4. The method of claim 3 , further comprising:

storing the acidic precursor film at room temperature prior to the annealing of the resultant product.

5. The method of claim 3 , further comprising:

prior to the forming of the metal film, forming the acidic precursor film of organic polymer and removing a solvent from the acidic precursor film.

6. The method of claim 3 , wherein the organic polymer thin film is a polyimide thin film.

7. The method of claim 3 , wherein the metal or metal oxide nano-crystals include at least one of zinc oxide, copper oxide and nickel iron.

8. The method of claim 3 , wherein the acidic precursor film is formed of a material prepared by dissolving biphenyltetracaboxylic dianhydide in a solvent selected from the group consisting of N-metyl-2-pyrrolidone (NMP), water, N-dimethylacetamide, and diglyme.

9. A method of fabricating a charge trap flash memory device, the method comprising:

forming a tunneling dielectric layer on a semiconductor substrate;

forming an organic polymer thin film on the tunneling dielectric layer, the organic polymer thin film comprising embedded multiple layers of metal or metal oxide nano-crystals for trapping charges;

forming a gate layer on the organic polymer thin film; and

patterning the gate layer and the organic polymer thin film, and forming source and drain regions in the semiconductor substrate.

10. The method of claim 9 , wherein forming the organic polymer thin film comprises:

forming an acidic precursor film of organic polymer on the tunneling dielectric layer and removing a solvent from the acidic precursor film;

forming a metal film on the acidic precursor film;

forming an acidic precursor film of organic polymer on the metal film to obtain a resultant product;

annealing the resultant product; and

repeatedly performing at least twice the forming of the metal film, the forming of the acidic precursor film, and the annealing of the resultant product.

11. The method of claim 10 , further comprising:

storing the resultant product at room temperature prior to the annealing of the resultant product.

12. The method of claim 10 , wherein the organic polymer thin film is a polyimide thin film.

13. The method of claim 10 , wherein the metal or metal oxide nano-crystals include at least one of zinc oxide, copper oxide and nickel iron.

14. The method of claim 10 , wherein the acidic precursor film is formed of a material prepared by dissolving biphenyltetracaboxylic dianhydide in a solvent selected from the group consisting of N-methyl-2-pyrrolidone (NMP), water, N-dimethylacetamide, and diglyme.

15. The method of claim 9 , wherein the nano-crystals are nickel iron nano-crystals.

16. The method of claim 1 , wherein the organic polymer thin film comprises a polyimide thin film.

17. The method of claim 16 , wherein the metal or metal oxide nano-crystals comprise at least one of zinc oxide, copper oxide and nickel iron.

Assignments (1)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jan 24, 2007
From: KIM, TAE-WHAN; KIM, YOUNG-HO; KIM, JAE-HO; JUNG, JAE-HUN
To: SAMSUNG ELECTRONICS CO., LTD.
Reel/Frame 018843/0555 →
Priority Claims (2)
KR 10-2005-0096552 · Oct 13, 2005 · national
KR 10-2005-0125643 · Dec 19, 2005 · national
Continuity (1)
Related Publication 20070102750A1 · May 10, 2007