Microelectronic connection component
A microelectronic connection component includes a substrate having a first surface, a second surface and a peripheral edge. First and second terminals are exposed at the first surface of the substrate. Wire bond pads are exposed proximate the peripheral edge of the substrate at the first surface. First conductive paths couple the first terminals to the wire bond pads. Bonding leads extend beyond the peripheral edge of the substrate. Second conductive paths couple the second terminals to the bonding leads.
1. A microelectronic connection component comprising:
a substrate having a first surface, a second surface and a peripheral edge;
first terminals and second terminals, the first and second terminals being exposed at the first surface of the substrate;
wire bond pads exposed proximate the peripheral edge of the substrate at the first surface;
first conductive paths that couple the first terminals to the wire bond pads;
a plurality of bonding leads extending along the substrate and extending beyond the peripheral edge of the substrate; and
second conductive paths that couple the second terminals to the bonding leads, the second conductive paths including a plurality of spaced apart conductive traces extending along the second surface of the substrate, conductive traces being connected to the bonding leads.
2. The microelectronic connection component of claim 1 wherein the bonding leads are disposed on and extend from the second surface of the substrate.
3. The microelectronic connection component of claim 2 ,
wherein the second terminals are disposed on the first surface,
wherein the second conductive paths further comprise vertical conductors coupled to the second terminals and extending through the substrate; and
wherein the plurality of conductive traces extend between the vertical conductors and the bonding leads.
4. The microelectronic connection component of claim 2 , wherein the second terminals are disposed on the second surface of the substrate and wherein the second conductive paths comprise conductive traces that extend along the second surface of the substrate from the second terminals to the bonding leads.
5. The microelectronic connection component of claim 1 wherein the second conductive paths comprise conductive traces disposed on the second surface of the substrate.
6. The microelectronic connection component of claim 1 wherein the first conductive paths comprise conductive traces disposed on the first surface of the substrate.
7. The microelectronic connection component of claim 1 wherein at least some of the first terminals are disposed on the first surface at a position between at least some of the second terminals and at least some of the wire bond pads.
8. The microelectronic connection component of claim 1 wherein a plurality of the second terminals and at least some of the first terminals surround at least some of the second terminals on the first surface of the substrate.
9. The microelectronic connection component of claim 8 wherein at least some of the wire bond pads surround at least some of the first terminals on the first surface of the substrate.
10. The microelectronic connection component of claim 1 wherein the substrate comprises a dielectric material.
11. The microelectronic connection component of claim 1 wherein the bonding leads are adapted to flex in a direction transverse to the surfaces of the substrate.
12. The microelectronic connection component of claim 1 wherein the first and second terminals are arranged so as to align with and be coupled to mating contacts exposed at a surface of a circuit board coupled to the microelectronic connection component.
13. A microelectronic assembly comprising:
the microelectronic connection component as claimed in claim 1 ;
a microelectronic element coupled to the microelectronic connection component, the microelectronic element comprising:
wire bond contacts; and
bonding lead contacts adjacent the wire bond contacts;
wherein the wire bond pads are electrically coupled to the wire bond contacts and the bonding leads are electrically coupled to the bonding lead contacts.
14. The microelectronic assembly of claim 13 further comprising wire bonds coupling the wire bond pads to the wire bond contacts.
15. The microelectronic assembly of claim 13 wherein the bonding leads are disposed on and extend from the second surface of the substrate and are bent to touch the bonding lead contacts.
16. The microelectronic assembly of claim 13 wherein the wire bond contacts and the bonding lead contacts respectively form rows that are substantially parallel.
17. The microelectronic assembly of claim 13 wherein the microelectronic element is a semiconductor device.
18. The microelectronic assembly of claim 13 further comprising:
a circuit board coupled to the microelectronic connection component,
wherein the first and second terminals are aligned with and coupled to mating contacts exposed at a surface of the circuit board.
19. A microelectronic connection component of claim 1 , wherein the substrate includes a dielectric material.
20. A microelectronic connection component of claim 1 , wherein the bonding leads are spaced apart from each other.
21. A microelectronic connection component of claim 1 , wherein at least portions of the bonding leads extend along the second surface.