Method of producing a wiring board
A wiring board comprises a substrate; a resin layer which is selectively formed on one main surface of the substrate and has fine metal particles contained or adhered to its surface; and a conductive metal layer which is formed on the resin layer with the fine metal particles interposed between them.
1. A method of producing a wiring board, comprising:
selectively arranging resin particles, which have a resin as a main component and have fine metal particles with a particle diameter of 0.01 to 10 μm contained or adhered to their surfaces, on one main surface of a substrate;
fixing the resin particles to one main surface of the substrate; and
conducting electroless plating or electrolytic plating for the fixed resin layer by using the fine metal particles as plating nuclei so that a conductor metal layer can be formed to conform to a configuration of the fixed resin layer.
2. A method of producing a wiring board according to claim 1 , wherein the fine metal particles adhered to the surface of the resin layer are adhered to the surface of the resin layer by either adsorption of a metal complex or metal ion or direct adhesion of the fine metal particles.
3. A method of producing a wiring board according to claim 1 , further comprising a reducing step for reducing the adsorbed fine metal particles prior to the metal plating step when the resin particles which have the fine metal particles adhered to the surfaces of the particles by adsorption of a metal complex or metal ion are used.
4. A method of producing a wiring board according to claim 1 , further comprising an etching step for protruding at least the fine metal particles in part by an etching treatment prior to the metal plating step when the resin particles containing the fine metal particles are used.
5. A method of producing a wiring board according to claim 1 , wherein the resin particles are disposed on the substrate in the arranging step by a method selected from offset printing, relief printing, engraved printing, stencil printing and surface printing.
6. A method of producing a wiring board according to claim 1 , wherein the arranging step is comprised of disposing a solution, which has the resin particles dispersed into a solvent, on the substrate and drying to evaporate the solvent to remain the resin particles on the substrate.