Integrated circuit (IC) package stacking and IC packages formed by same
Methods, systems, and apparatuses for integrated circuit (IC) package vertical interconnection are described herein. In an aspect of the invention, an IC package includes an IC die with contact pads. The IC package also includes interconnect members which are coupled to the die at the contact pads. An encapsulating material encapsulates the IC die and the interconnect members such that a contact surface of each interconnect member is accessible at a surface of the encapsulating material. A second IC package is coupled to the first IC package through the plurality of interconnect members of the first IC package. In an example, solder balls attached to a bottom of the second IC package are coupled to the contact surfaces of the interconnect members to couple the first IC package and the second IC package.
1. An integrated circuit (IC) package, comprising:
an IC die having opposing first and second surfaces and having a plurality of contact pads located on the first surface of the IC die;
a substrate having opposing first and second surfaces, wherein the second surface of the IC die is coupled to the first surface of the substrate;
a plurality of interconnect members attached to the plurality of contact pads;
a plurality of conductive elements coupled to the second surface of the substrate and coupled through the substrate to the IC die; and
an encapsulating material that encapsulates the IC die and the plurality of interconnect members,
wherein each interconnect member of the plurality of interconnect members is configured to physically contact a respective conductive element of a second IC package, the respective conductive element of the second IC package being attached to a substrate of the second IC package, wherein a gap is present between an outer surface of the encapsulation material and a surface of the substrate of the second IC package, and wherein the second IC package is entirely contained in a footprint of the IC die.
2. The IC package of claim 1 , wherein each interconnect member of the plurality of interconnect members is a truncated solder ball.
3. The IC package of claim 1 , further comprising:
a second plurality of interconnect members;
wherein the first surface of the substrate has a plurality of contact pads;
wherein the second plurality of interconnect members are coupled to a corresponding contact pad of the plurality of contact pads on the first surface of the substrate; and
wherein the second plurality of interconnect members are encapsulated by the encapsulating material such that a contact surface of each interconnect member of the second plurality of interconnect members is accessible at the surface of the encapsulating material.
4. The IC package of claim 1 , wherein each interconnect member of the plurality of interconnect members comprises a metal.
5. The IC package of claim 4 , wherein the metal is gold, copper, aluminum, silver, nickel, tin, or a metal alloy.
6. The IC package of claim 1 , wherein each interconnect member of the plurality of interconnect members comprises a thermally conductive epoxy.
7. The IC package of claim 1 , wherein each interconnect member of the plurality of interconnect members comprises a core material coated with a bonding material.
8. The IC package of claim 1 , wherein each interconnect member of the plurality of interconnect members comprises a post.
9. The IC package of claim 1 , wherein the plurality of conductive elements comprises a plurality of solder balls.
10. The IC package of claim 1 , wherein the encapsulating material includes a first portion and a second portion, wherein the first portion and the second portion are non-planar with respect to each other, wherein the first portion exposes at least a portion of each interconnect member of the plurality of interconnect members, and wherein an exposed surface of each interconnect member of the plurality of interconnect members is substantially planar and is substantially coplanar with a surface of the first portion.
11. The IC package of claim 10 , wherein the first portion comprises a cavity in which the contact surface of each of the plurality of interconnect members is accessible.
12. A stacked integrated circuit (IC) packaging device, comprising:
a first IC package, comprising:
an IC die having opposing first and second surfaces and having a plurality of contact pads located on the first surface of the IC die,
a first substrate having opposing first and second surfaces, wherein the second surface of the IC die is coupled to the first surface of the first substrate,
a plurality of interconnect members attached to the plurality of contact pads,
a first plurality of conductive elements coupled to the second surface of the first substrate and coupled through the first substrate to the IC die, and
an encapsulating material that encapsulates the IC die and the first plurality of interconnect members; and
a second IC package, comprising:
a second substrate; and
a second plurality of conductive elements attached to a surface of the second substrate, wherein each conductive element of the second plurality of conductive elements of the second IC package physically contacts a respective one of the plurality of interconnect members, wherein a gap is present between the surface of the second substrate and an outer surface of the encapsulation material, and wherein the second IC package is entirely contained in a footprint of the IC die.
13. The stacked IC packaging device of claim 12 , wherein each interconnect member of the plurality of interconnect members is a truncated solder ball.
14. The stacked IC packaging device of claim 12 , wherein the first IC package further comprises:
a second plurality of interconnect members;
wherein the first surface of the first substrate has a plurality of contact pads;
wherein the second plurality of interconnect members are coupled to a corresponding contact pad of the plurality of contact pads on the first surface of the first substrate;
wherein each of the second plurality of interconnect members are encapsulated by the encapsulating material such that a contact surface of each interconnect member of the second plurality of interconnect members is accessible at the surface of the encapsulating material; and
wherein the second IC package is coupled to the first IC package through the second plurality of interconnect members.
15. The stacked IC packaging device of claim 12 , wherein the second IC package further comprises a plurality of solder balls attached to a bottom surface of the second IC package; and
wherein each solder ball of the plurality of solder balls is coupled to a corresponding contact surface of an interconnect member of the plurality of interconnect members.
16. The stacked IC packaging device of claim 12 , wherein each interconnect member of the plurality of interconnect members comprises a metal and wherein the metal is gold, copper, aluminum, silver, nickel, tin, or a metal alloy.
17. The stacked IC packaging device of claim 12 , wherein each interconnect member of the plurality of interconnect members comprises a thermally conductive epoxy.
18. The stacked IC packaging device of claim 12 , wherein each interconnect member of the plurality of interconnect members comprises a core material coated with a bonding material.
19. The stacked IC packaging device of claim 12 , wherein each interconnect member of the plurality of interconnect members comprises a post.
20. The IC packaging device of claim 12 , wherein the first plurality of conductive elements comprises a plurality of solder balls.
21. The stacked IC packaging device of claim 12 , wherein the encapsulating material includes a first portion and a second portion, wherein the first portion and the second portion are non-planar with respect to each other, wherein the first portion exposes at least a portion of each interconnect member of the plurality of interconnect members, and wherein an exposed surface of each interconnect member of the plurality of interconnect members is substantially planar and is substantially coplanar with a surface of the first portion.
22. The stacked IC packaging device of claim 21 ,
wherein the first portion comprises a cavity in which the contact surface of each interconnect member of the plurality of interconnect members is accessible, and
wherein the second IC package is disposed at least partially in the cavity.
23. The stacked IC packaging device of claim 22 , wherein the second IC package resides entirely in the cavity.