Seal for light emitting display device, method, and apparatus
A glass package is disclosed comprising a first substrate and a second substrate, where the substrates are attached in at least two locations, at least one attachment comprising a frit, and at least one attachment comprising a polymeric adhesive and wherein the frit comprises a glass portion comprising: a base component comprising and at least one absorbing component. Also disclosed is a method of sealing a light emitting display device comprising providing a light emitting layer, a first substrate and a second substrate, where a frit is deposited between the substrates and a polymeric adhesive is deposited either between the substrates or around the edge of the device, and where the frit is sealed with a radiation source and the polymeric adhesive is cured.
1. A glass package comprising:
a first substrate,
a second substrate,
a sealed frit coupling the first substrate and the second substrate, and
a polymeric adhesive further coupling the first substrate and the second substrate, wherein at least a portion of the first substrate is in overlying registration to at least a portion of the second substrate, the frit comprising:
a glass portion comprising:
a base component comprising:
from about 5 to about 75 mole % SiO 2 ;
from about 10 to about 40 mole % B 2 O 3 ;
from 0 to about 20 mole % Al 2 O 3 ; and
at least one absorbing component comprising:
a) from greater than 0 to about 25 mole % CuO; or
b) from greater than 0 to about 7 mole % Fe 2 O 3 ;
from greater than 0 to about 10 mole % V 2 O 5 ; and
from 0 to about 5 mole % TiO 2 ; and
wherein an unsealed frit is disposed between the sealed frit and the polymeric adhesive.
2. The glass package of claim 1 , wherein the sealed frit forms a sealed frit loop.
3. The glass package of claim 2 , wherein the polymeric adhesive forms an adhesive loop positioned outside of the sealed frit loop.
4. The glass package of claim 1 , further comprising a light emitting layer, wherein the sealed frit forms a loop, and the light emitting layer is positioned between the first and second substrates and within the sealed frit loop.
5. The glass package of claim 4 , wherein the light emitting layer comprises an organic light emitting diode.
6. The glass package of claim 1 , wherein the glass portion of the frit further comprises from greater than 0 to 60 mole percent ZnO.
7. The glass package of claim 1 , wherein the polymeric adhesive comprises an epoxy.
8. The glass package of claim 1 , wherein the first substrate and/or the second substrate comprise a borosilicate glass.
9. The glass package of claim 1 , wherein the sealed frit further comprises a coefficient of thermal expansion matching filler.
10. The glass package of claim 1 , wherein the sealed frit is a hermetic seal between the first substrate and the second substrate.
11. The glass package of claim 1 , wherein the sealed frit and the adhesive are in the form of a loop, and the unsealed fit is a loop disposed between the sealed frit loop and the adhesive loop.