Method for producing electronic components
View Patent ↗In order to achieve an integration of functional structures into the housing of electronic components, provision is made of a method for producing an electronic component comprising at least one semiconductor element having at least one sensor-technologically active and/or emitting device on at least one side, the method comprising the following steps: provision of at least one die on a wafer, production of at least one patterned support having at least one structure which is functional for the sensor-technologically active and/or emitting device, joining together of the wafer with the at least one support, so that that side of the die which has the sensor-technologically active and/or emitting device faces the support, separation of the die.
1. A multilayer patterned wafer composite, comprising:
a first non transparent semiconductor wafer having a top and a bottom surface;
a sensor-technologically active device and/or an emitting device located on the top surface of the first wafer;
a layer having at least one optical element; and
a second non transparent semiconductor wafer having a cavity extending between a second wafer top surface and a second wafer bottom surface, the second semiconductor wafer acting as a spacer between said at least one optical element and said first semiconductor wafer;
wherein said cavity is filed with a material selected from a group consisting of a gas, a fluid, and a low-k material.
2. A multilayer patterned wafer composite, comprising:
a first non transparent semiconductor wafer having a top and a bottom surface;
a sensor-technologically active device and/or an emitting device located on the top surface of the first wafer;
a layer having at least one optical element; and
a second non transparent semiconductor wafer having a cavity extending between a second wafer top surface and a second wafer bottom surface, the second semiconductor wafer acting as a spacer between said at least one optical element and said first semiconductor wafer;
wherein said cavity is a resonator.
3. The multilayer patterned wafer composite of claim 2 , wherein said cavity is adapted to generate or detect RF waves, microwaves or ultrasound.