IP Library Assignment 025066/0719
Patent Assignment
Reel/Frame 025066/0719

Assignment of Assignor's Interest

Recorded: 2010-09-30 Pages: 8
Assignor
SCHOTT AG
Executed: 2007-07-25
Assignee
SCHOTT ELECTRONIC PACKAGING ASIA PTE. LTD.
BLOCK 209 WOODLANDS AVE 9, #01-57 / 58 WOODLANDS SPECTRUM II, SINGAPORE, 738959, SINGAPORE
Covered Properties (12)
Process for Making Contact with and Housing Integrated Circuits
Patent: 6,911,392 →
Application: 10/228,699 →
Publication: US 2003/0113979
Process for producing microelectromechanical components and a housed microelectromechanical component
Patent: 6,894,358 →
Application: 10/228,804 →
Publication: US 2004/0214380
Method for Producing Electronic Components
Patent: 7,160,478 →
Application: 10/487,604 →
Publication: US 2004/0256349
Process for Packaging Components, and Packaged Components
Patent: 7,700,397 →
Application: 10/580,284 →
Publication: US 2008/0038868
Process for Making Contact with and Housing Integrated Circuits
Patent: 7,700,957 →
Application: 10/947,974 →
Publication: US 2005/0042786
Process for Producing Microelectromechanical Components and a Housed Microelectromechanical Component
Patent: 7,071,521 →
Application: 10/994,659 →
Publication: US 2005/0064644
Process for Producing Microelectromechanical Components and a Housed Microelectromechanical Component
Patent: 7,285,834 →
Application: 11/378,962 →
Publication: US 2006/0160258
Method for Producing Electronic Components
Patent: 8,114,304 →
Application: 11/603,388 →
Publication: US 2007/0063202
Process for Making Contact with and Housing Integrated Circuits
Patent: 7,821,106 →
Application: 12/042,108 →
Publication: US 2008/0150063
Method for Packaging Electronic Devices and Integrated Circuits
Patent: 8,017,435 →
Application: 12/307,174 →
Publication: US 2010/0059877
Process for Making Contact with and Housing Integrated Circuits
Patent: 7,880,179 →
Application: 12/623,323 →
Publication: US 2010/0065883
Process for Packaging Components, and Packaged Components
Patent: 8,309,384 →
Application: 12/753,514 →
Publication: US 2010/0187669
Related Assignments (7)
Other recorded transfers of the patents in this record — the chain of ownership.
Assignment of Assignor's Interest Dec 26, 2002
From: BIECK, FLORIAN; LEIB, DR. JURGEN
To: SCHOTT GLAS
Reel/Frame 013605/0263 →
Assignment of Assignor's Interest Aug 13, 2004
From: LEIB, JURGEN; BIECK, FLORIAN
To: SCHOTT GLAS
Reel/Frame 015701/0873 →
Assignment of Assignor's Interest Mar 14, 2005
From: SCHOTT GLAS
To: SCHOTT AG
Reel/Frame 015766/0926 →
Assignment of Assignor's Interest Jun 25, 2007
From: LEIB, JUERGEN
To: SCHOTT AG
Reel/Frame 019540/0283 →
Assignment of Assignor's Interest May 5, 2009
From: LEIB, JUERGEN, DR.; YAMAMOTO, HIDEFUMI, DR.
To: SCHOTT AG
Reel/Frame 022638/0228 →
Assignment of Assignor's Interest Apr 2, 2010
From: LEIB, JUERGEN
To: SCHOTT AG
Reel/Frame 024181/0285 →
Assignment of Assignor's Interest Oct 1, 2010
From: SCHOTT ELECTRONIC PACKAGING ASIA PTE. LTD.
To: WAFER-LEVEL PACKAGING PORTFOLIO LLC
Reel/Frame 025077/0418 →