IP Library › Assignment 022638/0228
Patent Assignment
Reel/Frame 022638/0228

Assignment of Assignor's Interest

Recorded: 2009-05-05 Pages: 3
Assignors
LEIB, JUERGEN, DR.
Executed: 2009-04-01
YAMAMOTO, HIDEFUMI, DR.
Executed: 2009-03-27
Assignee
SCHOTT AG
HATTENBERGSTRASSE 10, 55122 MAINZ, GERMANY
Covered Property (1)
Method for Packaging Electronic Devices and Integrated Circuits
Patent: 8,017,435 →
Application: 12/307,174 →
Publication: US 2010/0059877
Related Assignments (2)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest Sep 30, 2010
From: SCHOTT AG
To: SCHOTT ELECTRONIC PACKAGING ASIA PTE. LTD.
Reel/Frame 025066/0719 →
Assignment of Assignor's Interest Oct 1, 2010
From: SCHOTT ELECTRONIC PACKAGING ASIA PTE. LTD.
To: WAFER-LEVEL PACKAGING PORTFOLIO LLC
Reel/Frame 025077/0418 →