Packaged semiconductor chips
View Patent ↗A chip-sized wafer level packaged device including a portion of a semiconductor wafer including a device, a packaging layer formed over the portion of the semiconductor wafer, the packaging layer including a material having thermal expansion characteristics similar to those of the semiconductor wafer and a ball grid array formed over a surface of the packaging layer and being electrically connected to the device.
1. A method of making microelectronic packages comprising:
providing a silicon wafer including a first surface having bond pads and a second surface opposite the first surface;
providing a silicon packaging layer having a top surface, a bottom surface and an adhesive layer overlying the bottom surface of silicon packaging layer, and abutting said adhesive layer against the first surface of said silicon wafer for attaching said silicon packaging layer to said silicon wafer;
after the abutting step, forming openings in said silicon packaging layer and said adhesive layer for exposing said bond pads on said silicon wafer;
after the forming openings step, selectively electrophoreticaily depositing a compliant layer covering the top surface and surfaces of said silicon packaging layer within said openings while leaving the bond pads exposed, wherein said electrophoretically deposited compliant layer at least partially protects said microelectronic packages from alpha particles.
2. The method as claimed in claim 1 , further comprising:
forming electrically conductive elements having first ends in contact with said bond pads on said silicon wafer and second ends overlying the top surface of said silicon packaging layer;
providing conductive masses atop the second ends of said electrically conductive elements.
3. The method as claimed in claim 2 , wherein said conductive masses comprise solder.
4. The method as claimed in claim 1 , wherein said silicon wafer and said silicon packaging layer have coefficients of thermal expansion that are substantially similar.
5. The method as claimed in claim 4 , wherein said adhesive layer has a coefficient of thermal expansion that is substantially similar to the coefficients of thermal expansion of said silicon wafer and said silicon packaging layer.
6. The method as claimed in claim 1 , further comprising machining the second surface of said silicon wafer for thinning said silicon wafer.
7. The method as claimed in claim 1 , wherein the forming openings step comprises etching said silicon packaging layer and said adhesive layer to expose said bond pads.
8. The method as claimed in claim 1 , wherein said electrophoretic compliant layer is electrically insulative.