IP Library Granted Patent US 7,763,919
Granted Patent B2
US 7,763,919 · App. 11/612,647 · Granted Jul 27, 2010

CMOS image sensor and manufacturing method thereof

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Quick Facts
Patent No.
US 7,763,919
App. No.
11/612,647
Granted
Jul 27, 2010
Kind
B2
Abstract

A CMOS image sensor capable of improving characteristics of the image sensor by preventing damage to a photodiode region and a method for manufacturing the same are provided. The CMOS image sensor includes: a semiconductor substrate on which a device isolation region and an active region are defined; a photodiode region formed at the active region; a conductive plug formed on the photodiode region for connecting the photodiode region to a metal wiring; and a transistor formed enclosing the conductive plug.

Claims (16)

1. A CMOS (complementary metal oxide semiconductor) image sensor comprising:

a semiconductor substrate on which a device isolation region and an active region are defined;

a photodiode region formed on the active region;

a conductive plug formed at the photodiode region for connecting the photodiode region to a metal wiring; and

a transistor formed enclosing the conductive plug, wherein the perimeter of the conductive plug is completely surrounded by the transistor.

2. The CMOS image sensor according to claim 1 , wherein the perimeter of the conductive plug has a square shape.

3. A CMOS (complementary metal oxide semiconductor) image sensor comprising:

a semiconductor substrate on which a device isolation region and an active region are defined;

a photodiode region formed on the active region;

a transistor region formed on the active region, wherein the transistor region is horizontally arranged with the photodiode region;

a conductive plug making a contact with a top surface of the photodiode region;

a transistor formed on the transistor region wherein a portion of the transistor extends into the photodiode region around the perimeter of the conductive plug to provide an enclosing portion of the transistor on the photodiode region; and

an interlayer dielectric formed on the semiconductor substrate including the transistor, wherein the conductive plug is formed in a contact hole in the interlayer dielectric.

4. The CMOS image sensor according to claim 3 , wherein the perimeter of the conductive plug has a square shape.

5. The CMOS image sensor according to claim 3 , wherein the transistor comprises a gate insulating layer, a gate electrode, and an insulating layer sidewall.

6. The CMOS image sensor according to claim 5 , wherein a part of the conductive plug is enclosed by the interlayer dielectric, and another part of the conductive plug is enclosed by the insulating layer sidewall of the transistor.

Assignments (2)
CHANGE OF NAME Recorded Nov 30, 2017
From: DONGBU HITEK CO., LTD.
To: DB HITEK CO., LTD
Reel/Frame 044555/0913 →
MERGER AND CHANGE OF NAME Recorded Nov 29, 2017
From: DONGBU ELECTRONICS CO., LTD.; DONGBU HITEK CO., LTD.
To: DONGBU HITEK CO., LTD.
Reel/Frame 044533/0523 →