IP Library Granted Patent US 7,901,508
Granted Patent B2
US 7,901,508 · App. 11/626,387 · Granted Mar 8, 2011

Method, system, and apparatus for the growth of SiC and related or similar material, by chemical vapor deposition, using precursors in modified cold-wall reactor

Assignee: Widetronix, Inc.
View Patent ↗
Loading inventors, assignments & file history…
Monitor This Case
Get email alerts when status or documents change.
Order Certified Copies
Most orders are placed with the USPTO same day — all within 24 business hours.
Order via The Patent Place →
Pre-filled with this patent's details
Quick Facts
Patent No.
US 7,901,508
App. No.
11/626,387
Granted
Mar 8, 2011
Kind
B2
Abstract

An approach for the growth of high-quality epitaxial silicon carbide (SiC) films and boules, using the Chemical Vapor Deposition (CVD) technique is described here. The method comprises modifications in the design of the typical cold-wall CVD reactors, providing a better temperature uniformity in the reactor bulk and a low temperature gradient in the vicinity of the substrate, and an approach to increase the silicon carbide growth rate and to improve the quality of the growing layers, using halogenated carbon-containing precursors (carbon tetrachloride CCl 4 or halogenated hydrocarbons, CHCl 3 , CH 2 Cl 2 , CH 3 Cl, etc.), or introducing other chlorine-containing species in the gas phase in the growth chamber. The etching effect, proper ranges, and high temperature growth are also examined.

Claims (18)

1. A chemical vapor deposition system, said system comprising:

an enclosure with walls;

a substrate holder;

a heating element near said substrate holder;

an inlet for one or more gasses;

a shower-head, located near said inlet;

a cooled insert located near said shower-head and said inlet;

a water cooling unit around said enclosure;

a heat-shielding insert, attached to said cooled insert, at two ends of said heat-shielding insert;

wherein said heat-shielding insert is located near said shower-head and said inlet.

2. The chemical vapor deposition system as recited in claim 1 , wherein said heat-shielding insert is made of graphite.

3. A system as recited in claim 1 , wherein said substrate holder holds a wafer or substrate of at least 3 inch in diameter.

4. A system as recited in claim 1 , wherein said system comprises at least a refractory metal.

5. A system as recited in claim 4 , wherein said at least a refractory metal is made of one or more of the following materials, or their alloys or mixtures: tantalum, niobium, titanium, tungsten, molybdenum, zirconium, or hafnium.

6. The chemical vapor deposition system as recited in claim 1 , wherein said shower-head is made of one or more of the following materials, or their alloys or mixtures: graphite, SiC-coated graphite, graphite coated with carbides of refractory metals, carbides of refractory metals, quartz, quartz coated with refractory metals, or pure refractory metals.

7. A system as recited in claim 1 , wherein said system is a semiconductor growth apparatus.

8. A system as recited in claim 1 , wherein said system is a SiC growth apparatus.

9. A system as recited in claim 1 , wherein said system holds multiple substrates.

Assignments (3)
RELEASE OF SECURITY INTEREST Recorded Jan 20, 2026
From: YOUNG, JOHN F.; BARNETT, SUSAN M.; F.J. YOUNG COMPANY
To: WIDETRONIX INC.
Reel/Frame 073512/0684 →
SECURITY INTEREST Recorded Apr 16, 2015
From: WIDETRONIX INC.
To: YOUNG, JOHN F.; BARNETT, SUSAN M.; F.J. YOUNG COMPANY
Reel/Frame 035428/0906 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jul 30, 2011
From: MAKAROV, YURI; SPENCER, MICHAEL
To: WIDETRONIX INC
Reel/Frame 026676/0600 →
Continuity (1)
Related Publication 20080173242A1 · Jul 24, 2008