Manufacturing method of the active matrix substrate, and an electro-optical apparatus having the active matrix substrate
A manufacturing method of a thin film apparatus, includes: a first step for forming a separation layer on a heat resistant substrate; a second step for forming a thin film device on the separation layer; a third step for providing a surface layer on the thin film device; and a fourth step for generating a peeling phenomenon at the interface of the separation layer and the heat resistant substrate so as to peel the heat resistant substrate from a side of the thin film device.
1. An electro-optical apparatus, comprising:
an active matrix substrate,
the active matrix substrate comprising a thin film transistor as forming a matrix manufactured by a method comprising:
forming a separation layer on a heat resistant substrate;
forming the thin film transistor for pixel switching on the separation layer as forming the matrix;
providing a surface layer at a side of the thin film transistor opposite to another side that faces the heat resistant substrate; and
generating a peeling phenomenon at an interface of the separation layer and the heat resistant substrate so as to peel the heat resistant substrate from the other side of the thin film transistor,
wherein an organic layer is formed as the separation layer, the organic layer having a characteristic that generates a peeling phenomenon because of a reduction of an adhering force to the heat resistant substrate of the separation layer based on a liquid phase existing at the interface of the separation layer and the heat resistant substrate, and
the peeling phenomenon is generated by generating the liquid phase at the interface of the separation layer and the heat resistant substrate.
2. The electro-optical apparatus as claimed in claim 1 , wherein the separation layer comprises poly-para-xylylene or a derivative of poly-para-xylylene.
3. The electro-optical apparatus as claimed in claim 1 , wherein the separation layer has a film thickness greater than 10 μm.
4. The electro-optical apparatus as claimed in claim 1 , wherein the organic layer is made of the same material as the separation layer.
5. The electro-optical apparatus as claimed in claim 1 , wherein said peeling phenomenon is generated by introducing water or an organic solvent at the interface of the separation layer and the heat resistant substrate.
6. The electro-optical apparatus as claimed in claim 1 , wherein said peeling phenomenon is generated by introducing water at the interface of the separation layer and the heat resistant substrate.
7. The electro-optical apparatus as claimed in claim 1 , wherein said peeling phenomenon is generated by introducing an organic solvent at the interface of the separation layer and the heat resistant substrate.
8. The electro-optical apparatus as claimed in claim 1 , wherein said peeling phenomenon is generated by introducing an alcohol at the interface of the separation layer and the heat resistant substrate.
9. The electro-optical apparatus as claimed in claim 1 , which is a liquid crystal display apparatus.
10. The electro-optical apparatus as claimed in claim 1 , which is a organic EL display apparatus.
11. The electro-optical apparatus as claimed in claim 1 , which is a display apparatus wherein a reflection ration is changed based on an input of an electrical field.
12. An electro-optical apparatus, comprising:
an active matrix substrate,
the active matrix substrate comprising a driving circuit comprising a thin film transistor, manufactured by a method comprising:
forming a separation layer on a heat resistant substrate;
forming the thin film transistor for the driving circuit on the separation layer;
providing a surface layer at a side of the thin film transistor opposite to another side that faces the heat resistant substrate; and
generating a peeling phenomenon at an interface of the separation layer and the heat resistant substrate so as to peel the heat resistant substrate from a side of the thin film transistor,
wherein an organic layer is formed as the separation layer, the organic layer having a characteristic that generates a peeling phenomenon because of a reduction of an adhering force to the heat resistant substrate of the separation layer based on a liquid phase existing at the interface of the separation layer and the heat resistant substrate, and
the peeling phenomenon is generated by generating the liquid phase at the interface of the separation layer and the heat resistant substrate.
13. An electro-optical apparatus, comprising:
an active matrix substrate; and
a liquid crystal element or an electrophoresis display element,
the active matrix substrate comprising a thin film transistor as forming a matrix manufactured by a method comprising:
forming a separation layer on a heat resistant substrate;
forming the thin film transistor for pixel switching on the separation layer as forming the matrix;
providing a surface layer at a side of the thin film transistor opposite to another side that faces the heat resistant substrate; and
generating a peeling phenomenon at an interface of the separation layer and the heat resistant substrate so as to peel the heat resistant substrate from the other side of the thin film transistor,
wherein an organic layer is formed as the separation layer, the organic layer having a characteristic that generates a peeling phenomenon because of a reduction of an adhering force to the heat resistant substrate of the separation layer based on a liquid phase existing at the interface of the separation layer and the heat resistant substrate, and
the peeling phenomenon is generated by generating the liquid phase at the interface of the separation layer and the heat resistant substrate.
14. An electro-optical apparatus, comprising:
an active matrix substrate; and
a liquid crystal element or an electrophoresis display element,
the active matrix substrate comprising a driving circuit comprising a thin film transistor, manufactured by a method comprising:
forming a separation layer on a heat resistant substrate;
forming the thin film transistor for the driving circuit on the separation layer;
providing a surface layer at a side of the thin film transistor opposite to another that faces the heat resistant substrate; and
generating a peeling phenomenon at an interface of the separation layer and the heat resistant substrate so as to peel the heat resistant substrate from the other side of the thin film transistor,
wherein an organic layer is formed as the separation layer, the organic layer having a characteristic that generates a peeling phenomenon because of a reduction of an adhering force to the heat resistant substrate of the separation layer based on a liquid phase existing at the interface of the separation layer and the heat resistant substrate, and
the peeling phenomenon is generated by generating the liquid phase at the interface of the separation layer and the heat resistant substrate.