IP Library Patent Application 11629665
Patent Application
App. No. 11/629,665

Thermoelectric Conversion Module

Loading inventors, assignments & file history…
Monitor This Case
Get email alerts when status or documents change.
Order Certified Copies
Most orders are placed with the USPTO same day — all within 24 business hours.
Order via The Patent Place →
Pre-filled with this patent's details
Quick Facts
Patent No.
US None
App. No.
11/629,665
Abstract

A thermoelectric conversion module which includes a good thermally conductive substrate that is inexpensive, and which secures the electrical insulating property between the good thermally conductive substrate and the electrode. The thermoelectric conversion element unit is constituted of a P-type semiconductor and an N-type semiconductor which are connected to form a π-shape. Electrodes are connected to both end faces of the thermoelectric conversion element units. The good thermally conductive substrates are brought in contact with the electrodes. The good thermally conductive substrates consist of aluminum or an aluminum alloy, and an anode oxide film is provided between the good thermally conductive substrates and the electrodes.

Claims (8)

1 . A thermoelectric conversion module comprising:

a thermoelectric conversion element unit constructed with a P-type semiconductor and an N-type semiconductor connected to form a π-shape, an electrode connected to each end face of the thermoelectric conversion element unit, and a good thermally conductive substrate which is in contact with the electrode, wherein

the good thermally conductive substrate comprises aluminum or an aluminum alloy, and an anode oxide film is provided between the good thermally conductive substrate and the electrode.

2 . The thermoelectric conversion module according to claim 1 wherein the anode oxide film is formed on the good thermally conductive substrate consisting of the aluminum or the aluminum alloy.

3 . The thermoelectric conversion module according to claim 2 wherein the anode oxide film is formed to have a film thickness of 0.1 to 0.5 μm.

4 . The thermoelectric conversion module according to claim 1 , wherein multiple thermoelectric conversion element units provided in parallel are sandwiched between the good thermally conductive substrates.

5 . The thermoelectric conversion module according to claim 2 , wherein multiple thermoelectric conversion element units provided in parallel are sandwiched between the good thermally conductive substrates.

6 . The thermoelectric conversion module according to claim 3 , wherein multiple thermoelectric conversion element units provided in parallel are sandwiched between the good thermally conductive substrates.

Assignments (2)
CHANGE OF NAME Recorded Mar 6, 2012
From: ARUZE CORP.
To: UNIVERSAL ENTERTAINMENT CORPORATION
Reel/Frame 027819/0129 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Mar 15, 2007
From: TAKAHASHI, KOH
To: ARUZE CORP.
Reel/Frame 019045/0260 →