Power supply line for cryogenic electrical systems
A power supply line for connecting a superconducting consumer system to a current delivery point, which is at a higher temperature than the consumer system, includes a carrier and a plurality of band-shaped, mechanically and electrically parallel high-temperature superconductors (HTSL). To achieve a high critical current density with simultaneously low heat-conducting capacity of the power supply line, the carrier includes at least one elongated plate that includes a sparingly (low) heat-conducting material, with a ratio of width to thickness of at least 3:1 and band-shaped HTSL that are arranged parallel adjacent to one another on the carrier. Each band-shaped HTSL also has a normally conducting current path.
1. A power supply line for connecting a superconducting consumer system to a current delivery point, which is at a higher temperature than the consumer system, comprising:
a carrier with first and second connectors respectively disposed on first and second ends of the carrier, the carrier comprising at least one elongated plate that includes a low heat-conducting material, wherein a top side of the plate forms a flush surface with top sides of the connectors; and
a plurality of band-shaped, mechanically and electrically parallel high-temperature superconductors (HTSL) arranged parallel adjacent to one another on the carrier, each band-shaped high-temperature superconductor comprising a normally conducting current path.
2. The power supply line according to claim 1 , wherein the carrier further comprises a second plate, the band-shaped HTSL being arranged between the plate and the second plate.
3. The power supply line according to claim 1 , the first and second connectors are electrically conducting and are mechanically connected to the plate such that the band-shaped HTSL are in electrical contact with the first and second connectors.
4. The power supply line according to claim 3 , wherein at least one of the first and second connectors comprises a BCS or HTSL material.
5. The power supply line according to claim 3 , wherein the electric contact between the band-shaped HTSL and at least one of the first and second connector is a solder joint.
6. The power supply line according to claim 1 , wherein the power supply line is connected on a warmer end to a first cooling device that keeps the warmer end at a temperature in the range of about 50 to 100 K, and on a cooler end to a second cooling device that keeps the warmer end at a temperature of <35 K.
7. The power supply line according to claim 1 , wherein the power supply line is connected on a warmer end to a first cooling device that keeps the warmer end at a temperature in the range of about 50 to 100 K, and on a cooler end to a second cooling device that keeps the warmer end at a temperature of <12 K.
8. The power supply line according to claim 1 , wherein each of the band-shaped HTSL comprises a multifilament conductor produced according to the PIT process.
9. The power supply line according to claim 1 , wherein the band-shaped HTSL are thin-layer coated conductors.
10. The power supply line according to claim 1 , wherein the power supply line is coated at least on one side with a polymerizing plastic.
11. The power supply line according to claim 10 , wherein the polymerizing plastic includes at least one of: PE, PU, and PP.
12. The power supply line according to claim 1 , wherein the normally conducting current path comprises a band-shaped HTSL including a metal or a metal alloy with a heat conductivity that decreases with decreasing temperature.
13. The power supply line according to claim 1 , wherein the normally conducting current path comprises a band-shaped HTSL including a metal or a metal alloy.