IP Library Granted Patent US 7,573,076
Granted Patent B2
US 7,573,076 · App. 11/634,112 · Granted Aug 11, 2009

Vertical gallium-nitride based light emitting diode

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Quick Facts
Patent No.
US 7,573,076
App. No.
11/634,112
Granted
Aug 11, 2009
Kind
B2
Abstract

A vertical GaN-based LED and a method of manufacturing the same are provided. The vertical GaN-based LED can prevent the damage of an n-type GaN layer contacting an n-type electrode, thereby stably securing the contact resistance of the n-electrode. The vertical GaN-based LED includes: a support layer; a p-electrode formed on the support layer; a p-type GaN layer formed on the p-electrode; an active layer formed on the p-type GaN layer; an n-type GaN layer for an n-type electrode contact, formed on the active layer; an etch stop layer formed on the n-type GaN layer to expose a portion of the n-type GaN layer; and an n-electrode formed on the n-type GaN layer exposed by the etch stop layer.

Claims (16)

1. A vertical gallium-nitride (GaN)-based light emitting diode (LED) comprising:

a support layer;

a p-electrode formed on the support layer;

a p-type GaN layer formed on the p-electrode;

an active layer formed on the p-type GaN layer;

an n-type GaN layer for an n-type electrode contact, formed on the active layer;

an etch stop layer formed on the n-type GaN layer to expose a portion of the n-type GaN layer; and

an n-electrode formed on the n-type GaN layer exposed by the etch stop layer.

2. The vertical GaN-based LED according to claim 1 ,

wherein the etch stop layer is formed of material having an etching selectivity different from that of the n-type GaN layer.

3. The vertical GaN-based LED according to claim 2 ,

wherein the etch stop layer is formed of at least one material selected from the group consisting of group III-V semiconductor compounds, group III-VI semiconductor compounds, and group III-VII semiconductor compounds.

4. The vertical GaN-based LED according to claim 1 ,

wherein the etch stop layer has an uneven surface.

5. The vertical GaN-based LED according to claim 1 , further comprising:

an n-type transparent electrode and an n-type reflective electrode sequentially formed between the n-type GaN layer including the etch stop layer and the n-electrode.

Assignments (2)
MERGER Recorded Aug 7, 2012
From: SAMSUNG LED CO., LTD.
To: SAMSUNG ELECTRONICS CO., LTD.
Reel/Frame 028744/0272 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded May 12, 2010
From: SAMSUNG ELECTRO-MECHANICS CO., LTD.
To: SAMSUNG LED CO., LTD.
Reel/Frame 024375/0448 →