IP Library Granted Patent US 7,601,993
Granted Patent B2
US 7,601,993 · App. 11/636,430 · Granted Oct 13, 2009

Semiconductor device having ohmic recessed electrode

Assignee: Oki Electric Industry Co., Ltd.
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Quick Facts
Patent No.
US 7,601,993
App. No.
11/636,430
Granted
Oct 13, 2009
Kind
B2
Abstract

The present invention provides a semiconductor device having a recess-structured ohmic electrode, in which the resistance is small and variation in the resistance value caused by manufacturing irregularities is small. In the semiconductor device of the present invention, a two-dimensional electron gas layer is formed on the interface between a channel-forming layer and a Schottky layer by electrons supplied from the Schottky layer. The ohmic electrode comprises a plurality of side faces in ohmic contact with the two-dimensional electron gas layer. At least a part of side faces of the ohmic electrodes are non-parallel to a channel width direction. In a preferred embodiment of the present invention, the side faces have a saw tooth form or a comb tooth form. Since the contact area between the ohmic electrode and the two-dimensional electron gas layer is increased, ohmic resistance is reduced.

Claims (10)

1. A semiconductor device comprising:

a channel-forming layer formed on a semiconductor substrate;

a Schottky layer formed on said channel-forming layer;

a two-dimensional electron gas layer formed on an interface between said Schottky layer and said channel-forming layer by an electron supplied to said channel-forming layer from said Schottky layer;

a gate electrode formed on said Schottky layer via a cap layer; and

a recess-structured ohmic electrode containing a plurality of side faces which are in ohmic contact with said two-dimensional electron gas layer and non-parallel to a channel width direction;

wherein said ohmic electrode comprises a plurality of lower portion electrodes formed in a columnar shape, and an upper portion electrode formed so as to be electrically connected to all of said lower portion electrodes.

2. The semiconductor device according to claim 1 , wherein said lower portion electrodes are disposed in a matrix form.

3. The semiconductor device according to claim 1 , wherein said lower portion electrodes are square columns.

4. The semiconductor device according to claim 1 , wherein said lower portion electrodes are circular columns.

Assignments (1)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Dec 11, 2006
From: HOSHI, SHINICHI; ITOH, MASANORI
To: OKI ELECTRIC INDUSTRY CO. LTD.
Reel/Frame 018692/0084 →
Priority Claims (1)
JP 2005-357589 · Dec 12, 2005 · national
Continuity (1)
Related Publication 20070132037A1 · Jun 14, 2007