Method of manufacturing semiconductor device
View Patent ↗A method of manufacturing a semiconductor device includes a first step of forming solder film on metal posts of a mother chip, a second step of forming solder balls after the first step by printing a solder paste on the mother chip and heating the mother chip so that the solder paste is ref lowed, a third step of bonding the metal posts of the mother chip and metal posts of a daughter chip to each other in a thermocompression bonding manner by means of the solder film after the second step, and a fourth step of flip-chip-connecting the mother chip on a circuit substrate by using the solder balls. In the second step, the mother chip is heated in a nitrogen atmosphere in which the oxygen concentration is 500 ppm or less.
1. A method of manufacturing a semiconductor device, comprising:
a first step of forming a solder film on metal posts of a mother chip;
a second step of forming solder balls after the first step by printing a solder paste on the mother chip and heating the mother chip so that the solder paste is reflowed;
a third step of bonding the metal posts of the mother chip and metal posts of a daughter chip to each other in a thermocompression bonding manner by means of the solder film after the second step; and
a fourth step of flip-chip-connecting the mother chip on a circuit substrate by using the solder balls,
wherein in the second step the mother chip is heated in a nitrogen atmosphere in which the oxygen concentration is 500 ppm or less, and
wherein when the metal posts of the mother chip and the metal posts of the daughter chip are bonded in a thermocompression bonding manner by means of the solder film, the daughter chip is heated to a temperature higher than a melting point of the solder film, and a temperature of the mother chip is set lower than a melting point of the solder balls.
2. A method of manufacturing a semiconductor device, comprising:
a first step of preparing first bumps having a solder film formed on a metal film on a mother chip;
a second step of reflowing the solder film of the first bumps by heating the mother chip; and
a third step of bonding the solder film on the mother chip and second bumps of a daughter chip to each other in a thermocompression bonding manner by means of the solder film after the second step,
wherein in the second step the mother chip is heated in a nitrogen atmosphere in which the oxygen concentration is 500 ppm or less, and
wherein when the first bumps of the mother chip and the second bumps of the daughter chip are bonded to each other in a thermocompression bonding manner by means of the solder film, the daughter chip is heated to a temperature higher than a melting point of the solder film, and the first bumps and the second bumps are brought into contact with each other in a state where a temperature of the mother chip is set lower than the melting point of the solder film.
3. A method of manufacturing a semiconductor device, comprising:
a first step of preparing first bumps having a solder film formed on a metal film on a mother chip;
a second step of reflowing the solder film of the first bumps by heating the mother chip; and
a third step of bonding the solder film on the mother chip and second bumps of a daughter chip to each other in a thermocompression bonding manner by means of the solder film after the second step,
wherein in the second step the mother chip is heated in a nitrogen atmosphere in which the oxygen concentration is 500 ppm or less, and
wherein the second bumps of the daughter chip have a metal film, and a diameter of a cross section of the metal film on the mother chip cut along a plane parallel to the mother chip and a diameter of a cross section of the metal film on the daughter chip cut along a plane parallel to the daughter chip are different from each other.
4. A method of manufacturing a semiconductor device, comprising:
a first step of preparing first bumps having a solder film formed on a metal film on a mother chip;
a second step of reflowing the solder film of the first bumps by heating the mother chip; and
a third step of bonding the solder film on the mother chip and second bumps of a daughter chip to each other in a thermocompression bonding manner by means of the solder film after the second step,
wherein in the second step the mother chip is heated in a nitrogen atmosphere in which the oxygen concentration is 500 ppm or less, and
wherein the second bumps of the daughter chip have a metal film, and in the step of bonding the first bumps of the mother chip and the second bumps of the daughter chip to each other in a thermocompression bonding manner by means of the solder film, the metal film on the mother chip and the metal film on the daughter chip are bridged by an alloy formed in the solder film.