Liquid cooled DUT card interface for wafer sort probing

1. A system comprising:

a probe card interface;

at least one probe card interface connector on the probe card interface, wherein the at least one probe card interface connector is configured to mate with at least one connector on a probe card; and

at least one water block on the probe card interface, wherein the water block is configured to dissipate heat from one or more devices on a probe card requiring heat dissipation when the probe card is mounted on the probe card interface.

2. A system as recited in claim 1 , wherein the water block comprises a loop of cooling fluid.

3. A system as recited in claim 1 , wherein the water block comprises a cooling fluid loop pattern that is configured to be in close proximity with the one or more devices on the probe card requiring heat dissipation.

4. A system as recited in claim 1 , further comprising a thermal pad between the probe card and the water block.

5. A system as recited in claim 1 , further comprising one or more thermal vias between one or more components on the probe card and the water block.

6. A system as recited in claim 4 , further comprising one or more thermal vias between one or more components on the probe card and the water block.

7. A system comprising:

a probe card interface;

at least one probe card interface connector on the probe card interface;

a probe card;

at least one device requiring heat dissipation on the probe card

at least one probe card connector on the probe card, wherein the at least one probe card interface connector and the at least one probe card connector are configured to mate together when the probe card is mounted on the probe card interface; and

at least one water block on the probe card interface configured to dissipate heat from the at least one device requiring heat dissipation on the probe card.

8. A system as recited in claim 7 , wherein the at least one water block on the probe card interface is configured in a loop that comes into close proximity with the at least one device requiring heat dissipation on the probe card.

9. A system as recited in claim 7 , wherein the probe card has a first side and a second side, wherein the at least one probe card connector is on a first side and at least one device requiring heat dissipation is on a second side of the probe card.

10. A system as recited in claim 9 , wherein the probe card has one or more thermal vias in close proximity to the at least one device requiring heat dissipation and configured to enhance heat dissipation.

11. A system as recited in claim 9 , further comprising a thermal pad between the probe card and the water block.

12. A system as recited in claim 11 , further comprising one or more thermal vias in the probe card in close proximity to the at least one device requiring heat dissipation and the thermal pad.

13. A test system for use with a probe card that carries an electrical connector, the system comprising:

a test support having an electrical connector complemental to the electrical connector carried by the probe card; and

a cooling block carried by the test support, the cooling block shaped complementally to the probe card and disposed such that the cooling block comes into thermally-conductive contact with a portion of the probe card when the electrical connectors of the probe card and the test support are connected together,

whereby the cooling block dissipates heat from the probe card when the probe card is connected to the test support.

14. A test system as in claim 13 and further comprising a thermal conductor between the cooling block and the probe card.

15. A test system as in claim 14 wherein the thermal conductor comprises a thermal pad.

16. A test system as in claim 14 and further comprising a probe card and an electrical connector carried by the probe card and complemental to the electrical connector carried by the test support, and wherein the thermal conductor comprises a thermal via formed in the probe card.