Method for forming barrier layer
View Patent ↗A method for forming barrier layers comprises steps of providing a conductive layer, forming a first dielectric layer on the conductive layer, the first dielectric layer having a via therein, forming a first metal layer covering the first dielectric layer and the conductive layer, forming a layer of metallized materials on the first metal layer, removing the layer of metallized materials above the via bottom in the first dielectric layer, and leaving the layer of metallized materials remaining on a sidewall of the via in the first dielectric layer; and forming a second metal layer covering the layer of metallized materials. The accomplished barrier layers will have lower resistivity in the bottom via of the first dielectric layer and they are capable of preventing copper atoms from diffusing into the dielectric layer.
1. A method for forming a barrier layer, comprising:
providing a conductive layer;
forming a first dielectric layer on said conductive layer, said first dielectric layer having a via therein;
forming a first barrier metal layer covering said first dielectric layer and said conductive layer;
forming a barrier layer of metallized materials on said first barrier metal layer;
removing said barrier layer of metallized materials above said first barrier metal layer on said via bottom in said first dielectric layer, and leaving said barrier layer of metallized materials remaining on a whole sidewall of said via in said first dielectric layer without removing said first barrier metal on said via bottom; and
forming a second barrier metal layer covering said barrier layer of metallized materials,
wherein the first barrier metal layer and the second barrier metal layer are formed on the via bottom and the first barrier metal layer, the barrier layer of metallized materials and the second barrier metal layer are placed on the whole sidewall of the via.
2. The method for forming a barrier layer according to claim 1 , wherein said layer of metallized materials above said via bottom in said first dielectric layer is removed by an ion- bombardment process.
3. The method for forming a barrier layer according to claim 2 , wherein metal atoms bombarded out from said layer of metallized materials are deposited on said sidewall of said via in said first dielectric layer.
4. The method for forming a barrier layer according to claim 2 , wherein said ion-bombardment process employs argon ions.
5. The method for forming a barrier layer according to claim 1 , further comprising forming a second dielectric layer on said first dielectric layer before forming said first metal layer, wherein a trench is in said second dielectric layer and said trench in said second dielectric layer is connected to said via in said first dielectric layer.
6. The method for forming a barrier layer according to claim 1 , wherein said first metal layer is a tantalum layer.
7. The method for forming a barrier layer according to claim 1 , wherein said layer of metallized materials is a tantalum nitride layer.
8. The method for forming a barrier layer according to claim 1 , wherein said second metal layer is a tantalum layer.
9. The method for forming a barrier layer according to claim 1 , wherein said conductive layer is a copper layer.
10. The method for forming a barrier layer according to claim 1 , wherein said first metal layer is formed by physical vapor deposition processes.
11. The method for forming a barrier layer according to claim 1 , wherein said first metal layer is formed by chemical vapor deposition processes.
12. The method for forming a barrier layer according to claim 1 , wherein said layer of metallized materials is formed by physical vapor deposition processes.
13. The method for forming a barrier layer according to claim 1 , wherein said layer of metallized materials is formed by chemical vapor deposition processes.
14. The method for forming a barrier layer according to claim 1 , wherein said second metal layer is formed by physical vapor deposition processes.
15. The method for forming a barrier layer according to claim 1 , wherein said second metal layer is formed by chemical vapor deposition processes.
16. A method for forming a barrier layer, comprising:
providing a conductive layer;
forming a first dielectric layer on said conductive layer, said first dielectric layer having a via therein;
forming a first barrier metal layer covering the surface of said first dielectric layer and said conductive layer;
forming a barrier layer of metallized materials on said first barrier metal layer;
removing said barrier layer of metallized materials above said first barrier metal layer on said via bottom in said first dielectric layer, and leaving said barrier layer of metallized materials remaining on a whole sidewall of said via in said first dielectric layer without removing said first barrier metal on said via bottom; and
forming a second barrier metal layer covering said barrier layer of metallized materials and said first barrier metal layers,
wherein the first barrier metal layer and the second barrier metal layer are formed on the via bottom and the first barrier metal layer, the barrier layer of metallized materials and the second barrier metal layer are placed on the whole sidewall of the via.