IP Library Granted Patent US 7,394,202
Granted Patent B2
US 7,394,202 · App. 11/647,801 · Granted Jul 1, 2008

Ion implantation system and control method

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Quick Facts
Patent No.
US 7,394,202
App. No.
11/647,801
Granted
Jul 1, 2008
Kind
B2
Abstract

An ion implantation is disclosed that includes an ionization chamber having a restricted outlet aperture and configured so that the gas or vapor in the ionization chamber is at a pressure substantially higher than the pressure within an extraction region into which the ions are to be extracted external to the ionization chamber. The vapor is ionized by direct electron impact ionization by an electron source that is in a region adjacent the outlet aperture of the ionization chamber to produce ions from the molecules of the gas or vapor to a density of at least 10 10 cm −3 at the aperture while maintaining conditions that limit the transverse kinetic energy of the ions to less than about 0.7 eV. The beam is transported to a target surface and the ions of the transported ion beam are implanted into the target.

Claims (8)

1. A method of ion implantation by producing a high brightness ion beam that extends along an axis by ionizing molecules of a gas or vapor, the molecules containing an implantable species, the method comprising:

providing an ionization chamber having a restricted outlet aperture,

providing in said ionization chamber said gas or vapor at a pressure substantially higher than the pressure within an extraction region into which the ions are to be extracted external to the ionization chamber,

by direct electron impact ionization by primary electrons, ionizing the gas or vapor in a region adjacent the outlet aperture of the ionization chamber in a manner to produce ions from the molecules of the gas or vapor to a density of at least about 10 10 cm −3 at the aperture while maintaining conditions that limit the transverse kinetic energy of the ions to less than about 0.7 eV,

the width of the ionization volume adjacent the aperture, in which said density of ions is formed, being limited to a width less than about three times the corresponding width of the outlet aperture; and conditions within the ionization chamber being maintained to prevent formation of an arc discharge,

by an extraction system, extracting ions formed within the ionization chamber via the outlet aperture into the extraction region downstream of the aperture,

thereafter, with ion beam optics, transporting the beam to a target surface, and

implanting the ions of the transported ion beam into the target.

Assignments (4)
RELEASE OF SECURITY INTEREST Recorded Aug 13, 2008
From: TUNA INVESTMENTS, LLC, AS COLLATERAL AGENT
To: SEMEQUIP, INC.
Reel/Frame 021380/0018 →
SECURITY AGREEMENT Recorded Jul 28, 2008
From: SEMEQUIP, INC.
To: TUNA INVESTMENTS, LLC, AS COLLATERAL AGENT
Reel/Frame 021301/0023 →
CORRECTIVE ASSIGNMENT TO CORRECT THE INCORRECT ASSIGNMENT WAS FILED. PREVIOUSLY RECORDED ON REEL 018762 FRAME 0238. ASSIGNOR(S) HEREBY CONFIRMS THE INFORMATION ON PREVIOUS ASSIGNMENT IS INCORRECT. Recorded May 4, 2007
From: HORSKY, THOMAS N.; COHEN, BRIAN C.; KRULL, WADE A.; SACCO, JR., GEORGE P.
To: SEMEQUIP, INC.
Reel/Frame 019250/0489 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Dec 29, 2006
From: HORSKY, THOMAS N.
To: SEMEQUIP, INC.
Reel/Frame 018762/0238 →