IP Library Granted Patent US 7,420,200
Granted Patent B2
US 7,420,200 · App. 11/649,389 · Granted Sep 2, 2008

Damascene phase change memory

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Quick Facts
Patent No.
US 7,420,200
App. No.
11/649,389
Granted
Sep 2, 2008
Kind
B2
Abstract

A phase change material may include a pore formed of a relatively smaller phase change material and a relatively larger resistance heater. As a result, the relatively smaller portion of phase change material may have improved properties.

Claims (22)

1. A memory comprising:

an insulator over a substrate, said insulator including a pore having a lower electrode over the substrate, said lower electrode having an upper surface;

a phase change material over the lower electrode, wherein the phase change material fills a portion of the pore and completely covers the upper surface of said lower electrode; and

a planar electrode over said phase change material, said phase change material being substantially metal free.

2. The memory of claim 1 wherein said phase change material fills less than 25 percent of the pore, said phase change material including Antimony.

3. The memory of claim 1 wherein said phase change material fills about 10 percent or less of the pore.

4. The memory of claim 1 wherein said phase change material is entirely contained within the pore.

5. The memory of claim 1 wherein said phase change material is a chalcogenide.

6. The memory of claim 1 , said lower electrode to act as a heater to heat said phase change material.

7. The memory of claim 1 wherein the phase change material is substantially co-planar with the upper surface of said insulator.

8. The memory of claim 1 including a select device coupled to said electrode.

9. The memory of claim 1 including a conductive line formed over said insulator and said phase change material.

10. The memory of claim 9 wherein said phase change material is in contact with said conductive line.

11. The memory of claim 9 wherein said conductive line and the upper surface of said electrode are substantially parallel.

12. The method of claim 1 wherein said phase change material fills less of said pore than said lower electrode.

13. A system comprising:

a processor-based device;

a semiconductor memory coupled to said device, said memory including an insulator over a substrate, said insulator including a pore having a lower electrode over the substrate, said lower electrode having an upper surface, and a phase change material over the lower electrode wherein the phase change material fills a portion of the pore and completely covers the upper surface of said lower electrode; and

a planar electrode over said phase change material, said phase change material being substantially metal free.

14. The system of claim 13 wherein said phase change material fills less than 25 percent of the pore.

15. The system of claim 13 wherein said phase change material fills about 10 percent or less of the pore.

16. The system of claim 13 wherein said phase change material fills less of said pore than said lower electrode.

Assignments (2)
CHANGE OF NAME Recorded Jul 18, 2016
From: CARLOW INNOVATIONS, LLC
To: OVONYX MEMORY TECHNOLOGY, LLC
Reel/Frame 039379/0077 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Dec 8, 2015
From: OVONYX, INC.
To: CARLOW INNOVATIONS LLC
Reel/Frame 037244/0954 →