IP Library Granted Patent US 7,288,764
Granted Patent B2
US 7,288,764 · App. 11/651,498 · Granted Oct 30, 2007

Pattern measuring method

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Quick Facts
Patent No.
US 7,288,764
App. No.
11/651,498
Granted
Oct 30, 2007
Kind
B2
Abstract

A pattern measuring method calculates an average pattern shape from a plurality of the same patterns appearing within an image captured using an electron microscope, and compares pattern information at each measuring position with average pattern information to determine roughness.

Claims (29)

1. A method of measuring a shape of repetition patterns using a scanning electron microscope, comprising the steps of:

setting a scaling factor of said scanning electron microscope which permits a plurality of repetition patterns to appear within a field of view;

measuring shape of the repetition patterns included in the field of view and calculating an average value of the measured shape; and

comparing the average value with shape roughness for the repetition patterns.

2. A pattern measuring method according to claim 1 , wherein:

said patterns under measurement include a line or a space pattern, and

said step of measuring the shape includes:

measuring width of a line or a space from the shape; and

determining an average width of the line or the space from the average value to determine width roughness as the shape roughness.

3. A pattern measuring method according to claim 2 , wherein said step of measuring the shape includes:

accumulating luminance values in a shape measuring area for each of the patterns under measurement in a direction along the line or the space to create an accumulated profile, and

averaging the accumulated profiles.

4. A pattern measuring method according to claim 1 , wherein said average value to be calculated in said step of measuring the shape is determined by calculating an average value of values measured at a plurality of positions in a shape measuring area corresponding to each of the plurality of patterns under measurement.

5. A scanning electron microscope comprising:

an electron source;

a deflector for two-dimensionally scanning an electron beam emitted from said electron source; and

a processing unit for measuring dimension of patterns on a sample;

wherein said processing unit measures a shape of a plurality of repetition patterns included in a scanning area of the electron beam, calculates an average value of the measured shapes, and compares the average value with shape roughness for the repetition patterns.

6. A scanning electron microscope according to claim 5 , wherein:

said patterns under measurement include a line or a space pattern, and

said processing unit measures width of the line or the space from the shape, and determines an average width of the line or the space from the average value to determine width roughness as the shape roughness.

7. A scanning electron microscope according to claim 6 , wherein said processing unit accumulates luminance values in the scanning area of the electron beam for each of the patterns under measurement in a direction along the line or the space to create an accumulated profile and to average the accumulated profiles.

8. A scanning electron microscope according to claim 5 , wherein said processing unit determines the average value by calculating an average value of values measured at a plurality of positions in the scanning area of the electron beam corresponding to each of the plurality of patterns under measurement.

9. A scanning electron microscope comprising:

an electron source;

a deflector for two-dimensionally scanning an electron beam emitted from said electron source; and

a processing unit for measuring dimension of patterns on a sample;

wherein said processing unit determines measurement values of a plurality of repetition patterns included in a scanning area of the electron beam and calculates an average value of the measurement values on the basis of design width of the plurality of patterns or forming condition of the plurality of patterns.

10. A scanning electron microscope according to claim 9 , wherein said processing unit compares the average value with roughness for the repetition patterns.

Assignments (1)
CHANGE OF NAME AND ADDRESS Recorded Mar 30, 2020
From: HITACHI HIGH-TECHNOLOGIES CORPORATION
To: HITACHI HIGH-TECH CORPORATION
Reel/Frame 052259/0227 →