GaN-based semiconductor light-emitting device and method of manufacturing the same
A GaN-based semiconductor light-emitting device is provided having an improved structure in which the optical output and luminous efficiency are improved. The GaN-based semiconductor light-emitting device includes an n-electrode, a p-electrode, and an n-type semiconductor layer, an active layer and a p-type semiconductor layer, which are disposed between the n-electrode and the p-electrode, wherein the p-electrode includes a first electrode layer formed of Zn or a Zn-based alloy on the p-type semiconductor layer, a second electrode layer formed of Ag or an Ag-based alloy on the first electrode layer, and a third electrode layer formed of a transparent conductive oxide on the second electrode layer.
1 . A GaN-based semiconductor light-emitting device comprising:
an n-electrode;
a p-electrode; and
an n-type semiconductor layer, an active layer, and a p-type semiconductor layer which are disposed between the n-electrode and the p-electrode,
wherein the p-electrode comprises:
a first electrode layer formed of Zn or a Zn-based alloy on the p-type semiconductor layer;
a second electrode layer formed of Ag or an Ag-based alloy on the first electrode layer; and
a third electrode layer formed of a transparent conductive oxide on the second electrode layer.
2 . The device of claim 1 , wherein the Zn-based alloy comprises Zn and at least one metal selected from the group consisting of Ag, Mg, Sc, Hf, Zr, Te, Se, Ta, W, Nb, Cu, Si, Ni, Co, Mo, Cr, Mn, Hg, Pr, and La.
3 . The device of claim 2 , wherein the Zn-based alloy is an alloy selected from the group consisting of Zn—Ni, Zn—Mg, and Zn—Cu.
4 . The device of claim 1 , wherein the Ag-based alloy comprises Ag and at least one metal selected from the group consisting of Zn, Mg, Sc, Hf, Zr, Te, Se, Ta, W, Nb, Cu, Si, Ni, Co, Mo, Cr, Mn, Hg, Pr, and La.
5 . The device of claim 4 , wherein the Ag-based alloy is an alloy selected from the group consisting of Ag—Cu, Ag—Ni, Ag—Zn, and Ag—Mg.
6 . The device of claim 1 , wherein the transparent conductive oxide is an oxide of at least one metal selected from the group consisting of In, Sn, Zn, Ga, Cd, Mg, Be, Ag, Mo, V, Cu, Ir, Rh, Ru, W, Co, Ni, Mn, and La.
7 . The device of claim 6 , wherein the transparent conductive oxide is indium tin oxide (ITO) or zinc oxide (ZnO).
8 . The device of claim 1 , wherein the first electrode layer is formed in a thickness of approximately 0.1 nm to 500 nm.
9 . The device of claim 1 , wherein the second electrode layer is formed in a thickness of approximately 0.1 nm to 500 nm.
10 . The device of claim 1 , wherein the third electrode layer is formed in a thickness of approximately 10 nm to 1000 nm.
11 . A method of manufacturing a GaN-based semiconductor light-emitting device comprising:
sequentially forming an n-type semiconductor layer, an active layer and a p-type semiconductor layer on a substrate;
forming an n-electrode on the n-type semiconductor layer; and
forming a p-elecitrnde on the p-type semiconductor layer,
wherein the forming of the p-electrode comprises:
forming a first electrode layer using Zn or a Zn-based alloy on the p-type semiconductor layer;
forming a second electrode layer using Ag or an Ag-based alloy on the first electrode layer;
forming a third electrode layer using a transparent conductive oxide on the second electrode layer; and
annealing the first, second and third electrode layers.
12 . The method of claim 11 , wherein the annealing is performed at a temperature of approximately 200° C. to 700° C.
13 . The method of claim 12 , wherein the annealing is performed for approximately 10 seconds to 2 hours.
14 . The method of claim 12 , wherein the annealing is performed in a gaseous atmosphere including oxygen.
15 . The method of claim 14 , wherein the gaseous atmosphere further comprises at least one gas selected from the group consisting of nitrogen, argon, helium, oxygen, and air.
16 . The method of claim 11 , wherein each of the first, second and third electrode layers are formed using an e-beam and thermal evaporator.
17 . The method of claim 11 , wherein the Zn-based alloy comprises Zn and at least one metal selected from the group consisting of Ag, Mg, Sc, Hf, Zr, Te, Se, Ta, W, Nb, Cu, Si, Ni, Co, Mo, Cr, Mn, Hg, Pr, and La.
18 . The method of claim 17 , wherein the Zn-based alloy is an alloy selected from the group consisting of Zn—Ni, Zn-Ma, and Zn—Cu.
19 . The method of claim 11 , wherein the Ag-based alloy comprises Ag and at least one metal selected from the group consisting of Zn, Mg, Sc, Hf, Zr, Te, Se, Ta, W, Nb, Cu, Si, Ni, Co, Mo, Cr, Mn, Hg, Pr, and La.
20 . The method of claim 19 , the Ag-based alloy is an alloy selected from the group consisting of Ag—Cu, Ag—Ni, Ag—Zn, and Ag—Mg.
21 . The method of claim 11 , wherein the transparent conductive oxide is an oxide of at least one metal selected from the group consisting of In, Sn, Zn, Ga, Cd, Mg, Be, Ag, Mo, V, Cu, Ir, Rh, Ru, W, Co, Ni, Mo, and La.
22 . The method of claim 21 , wherein the transparent conductive oxide is indium tin oxide (ITO) or zinc oxide (ZnO).
23 . The method of claim 11 , wherein the first electrode layer is formed to a thickness of 0.1 nm to 500 nm.
24 . The method of claim 11 , wherein the second electrode layer is formed in a thickness of approximately 0.1 nm to 500 nm.
25 . The method of claim 11 , wherein the third electrode layer is formed in a thickness of approximately 10 nm to 1000 nm.