Method for fine pattern formation
View Patent ↗In a method of effectively miniaturizing a resist pattern, a super fine pattern-forming method of restricting a film thickness of a crosslinked film and also preventing developing defects is provided using a super fine pattern-forming material which contains a solvent composed of a water-soluble resin, a water-soluble crosslinking agent, and water or a mixing solution of water and a water-soluble organic solvent, and an amine compound-containing developing solution. The amine compound-containing developing solution is preferably a primary amine compound such as polyallylamine, monomethanolamine, and monoethanolamine, a secondary amine compound such as dimethylamine, diethylamine, dimethanolamine, and diethanolamine, a tertiary amine compound such as trimethylamine, triethylamine, trimethanolamine, and triethanolamine, or a quartenary amine compound such as hydrated tetramethylamine.
1. A super fine pattern-forming method, comprising the steps of:
coating a super fine pattern-forming material composition on a resist pattern containing a substance which supplies acid by heating to form a coated layer;
dispersing the acid from the resist pattern by the heating;
generating a crosslinking reaction in a portion contacting the resist pattern of the coated layer to form a crosslinked film in the coated layer;
eliminating a non-crosslinked portion of the coated layer with a developing solution; and
thereby developing the coated layer, wherein:
the super fine pattern-forming material composition contains a water-soluble resin, a water-soluble crosslinking agent, an amine compound selected from polyallylamine derivatives and glucosamine derivatives, and a solvent selected from the group consisting water and a mixing solution of water and a water-soluble organic solvent; and elimination of the non-crosslinked portion of the coated layer is made with a developing solution containing an amine compound wherein the concentration of amine compound in the super fine pattern-forming material composition by weight per the solvent in the composition x% and the concentration of the amine compound in the second developing solution Y% meet the relation 0.1≦x+y≦5.
2. The super fine pattern-forming method according to claim 1 , wherein:
the super fine pattern-forming material composition further includes a surface active agent.
3. The super fine pattern-forming method according to claim 1 , wherein:
the developing solution includes at least one compound selected from groups consisting of a primary amine compound, a secondary amine compound, a tertiary compound, and a quaternary amine compound.
4. The super fine pattern-forming method according to claim 1 , wherein:
the concentration of an amine compound in the developing solution is in the range of 0.1 to 2.0%.
5. The super fine pattern-forming method according to claim 1 , wherein:
the developing step is performed at a temperature of 15 to 30° C.
6. A pattern formed in the super fine pattern-forming method according to claim 1 .
7. A semiconductor element manufactured using the super fine pattern-forming method according to claim 1 .
8. A liquid crystal display surface of an LCD panel manufactured using the super fine pattern-forming method according to claim 1 .
9. The super fine pattern-forming method according to claim 1 , where the amine compound in the developing solution is selected from polyallylamine, monomethanolamine, monoethanolamine, dimethylamine, diethylamine, dimethanolamine, diethanolamine, trimethylamine, triethylamine, trimethanolamine, triethanolamine, and hydrated tetramethyamine.
10. The super fine pattern-forming method according claim 1 , wherein:
the concentration of an amine compound in the developing solution is in the range of 0.05 to 2.5%.
11. The super fine pattern-forming method according to claim 2 , wherein:
the developing solution includes at least one compound selected from groups consisting of a primary amine compound, a secondary amine compound, a tertiary compound, and a quarternary amine compound.