Composition for conductive layers in electronic devices
A composition for conductive materials comprises a compound represented by the following general formula (A1): wherein: R 1 is the same or different and each independently represents a C 2 -C 8 straight-chain alkyl group; R 2 is the same or different and each independently represents a hydrogen atom, a methyl group or an ethyl group; Y represents a group containing at least one substituted or unsubstituted aromatic hydrocarbon ring, or substituted or unsubstituted heterocyle; and X 1 is the same or different and each represents a substituent represented by the following general formula (A2): wherein n 1 is an integer of from 2 to 8.
1. A composition for conductive materials, comprising a compound represented by the following general formula (A1):
wherein two R 1 s may be the same or different and each independently represents a straight-chain alkyl group having 2 to 8 carbon atoms, four R 2 s may be the same or different and each independently represents a hydrogen atom, a methyl group or an ethyl group, Y represents a group containing at least one substituted or unsubstituted aromatic hydrocarbon ring or substituted or unsubstituted heterocycle, and two X 1 s may be the same or different and each independently represents a substituent represented by the following general formula (A2):
wherein n 1 is an integer of 2 to 8.
2. The composition for conductive materials as claimed in claim 1 , wherein the group Y contains at least one substituted or unsubstituted aromatic hydrocarbon ring.
3. The composition for conductive materials as claimed in claim 2 , wherein the two substituents X 1 are identical with each other.
4. The composition for conductive materials as claimed in claim 2 , wherein each substituent X 1 is bonded to the 3-, 4- or 5-position of the benzene ring.
5. The composition for conductive materials as claimed in claim 2 , wherein the two substituents R 1 are identical with each other.
6. The composition for conductive materials as claimed in claim 2 , wherein each substituent R 1 is bonded to the 4-position of the benzene ring.
7. The composition for conductive materials as claimed in claim 2 , wherein the group Y consists of carbon atoms and hydrogen atoms.
8. The composition for conductive materials as claimed in claim 2 , wherein the group Y contains 6 to 30 carbon atoms in total.
9. The composition for conductive materials as claimed in claim 2 , wherein the group Y contains 1 to 5 aromatic hydrocarbon rings.
10. The composition for conductive materials as claimed in claim 2 , wherein the group Y is a biphenylene group or a derivative thereof.
11. The composition for conductive materials as claimed in claim 2 , further comprising an epoxy-based cross-linking agent.
12. The composition for conductive materials as claimed in claim 11 , wherein the epoxy-based cross-linking agent contains a (meth)acrylic ester-based epoxy cross-linking agent.
13. The composition for conductive materials as claimed in claim 11 , wherein the epoxy based cross-linking agent contains a bisphenol epoxy cross-linking agent.
14. The composition for conductive materials as claimed in claim 11 , wherein the epoxy-based cross-linking agent contains at least one cross-linking agent selected from the group comprising a glycidyl ester-based epoxy cross-linking agent, an alicyclic epoxy cross-linking agent, an urethane modified epoxy cross-linking agent and a silicon-containing epoxy cross-linking agent.
15. The composition for conductive materials as claimed in claim 11 , wherein the epoxy-based cross-linking agent contains at least one of a polyfunctional phenol-based epoxy cross-linking agent and a glycidyl amine epoxy cross-linking agent.
16. The composition for conductive materials as claimed in claim 11 , wherein the two substituents X 1 are identical with each other.
17. The composition for conductive materials as claimed in claim 11 , wherein each substituent X 1 is bonded to the 3-, 4- or 5-position of the benzene ring.
18. The composition for conductive materials as claimed in claim 11 , wherein the two substituents R 1 are identical with each other.
19. The composition for conductive materials as claimed in claim 12 , wherein each substituent R 1 is bonded to the 4-position of the benzene ring.
20. The composition for conductive materials as claimed in claim 11 , wherein the group Y consists of carbon atoms and hydrogen atoms.
21. The composition for conductive materials as claimed in claim 11 , wherein the group Y contains 6 to 30 carbon atoms in total.
22. The composition for conductive materials as claimed in claim 11 , wherein the group Y contains 1 to 5 aromatic hydrocarbon rings.
23. The composition for conductive materials as claimed in claim 11 , wherein the group Y is a biphenylene group or a derivative thereof.
24. The composition for conductive materials as claimed in claim 1 , wherein the group Y contains at least one substituted or unsubstituted heterocycle.
25. The composition for conductive materials as claimed in claim 24 , wherein the two substituents X 1 are identical with each other.
26. The composition for conductive materials as claimed in claim 24 , wherein each substituent X 1 is bonded to the 3-, 4- or 5-position of the benzene ring.
27. The composition for conductive materials as claimed in claim 24 , wherein the two substituents R 1 are identical with each other.
28. The composition for conductive materials as claimed in claim 24 , wherein each substituent R 1 is bonded to the 4-position of the benzene ring.
29. The composition for conductive materials as claimed in claim 24 , wherein the heterocycle contains at least one heteroatom selected from the group comprising nitrogen, oxygen, sulfur, selenium and tellurium.
30. The composition for conductive materials as claimed in claim 24 , wherein the heterocycle is an aromatic heterocycle.
31. The composition for conductive materials as claimed in claim 24 , wherein the group Y contains 1 to 5 heterocycles.
32. The composition for conductive materials as claimed in claim 24 , wherein the group Y contains at least one substituted or unsubstituted aromatic hydrocarbon ring in addition to the heterocycle.
33. The composition for conductive materials as claimed in claim 32 , wherein the group Y contains two aromatic hydrocarbon rings respectively bonded to each N in the general formula (A1) directly and at least one heterocycle existing between these aromatic hydrocarbon rings.
34. The composition for conductive materials as claimed in claim 24 , wherein the group Y contains 2 to 75 carbon atoms in total.
35. The composition for conductive materials as claimed in claim 27 , further comprising an epoxy based cross-linking agent.
36. The composition for conductive materials as claimed in claim 35 , wherein the epoxy-based cross-linking agent contains a (meth)acrylic ester-based epoxy cross-linking agent.
37. The composition for conductive materials as claimed in claim 35 , wherein the epoxy based cross-linking agent contains a bisphenol epoxy cross-linking agent.
38. The composition for conductive materials as claimed in claim 35 , wherein the epoxy-based cross-linking agent contains at least one cross-linking agent selected from the group comprising a glycidyl ester-based epoxy cross-linking agent, an alicyclic epoxy cross-linking agent, an urethane modified epoxy cross-linking agent and a silicon-containing epoxy cross-linking agent.
39. The composition for conductive materials as claimed in claim 35 , wherein the epoxy-based cross-linking agent contains at least one of a polyfunctional phenol-based epoxy cross-linking agent and a glycidyl amine epoxy cross-linking agent.
40. The composition for conductive materials as claimed in claim 35 , wherein the two substituents X 1 are identical with each other.
41. The composition for conductive materials as claimed in claim 35 , wherein each substituent X 1 is bonded to the 3-, 4- or 5-position of the benzene ring.
42. The composition for conductive materials as claimed in claim 35 , wherein the two substituents R 1 are identical with each other.
43. The composition for conductive materials as claimed in claim 35 , wherein each substituent R 1 is bonded to the 4-position of the benzene ring.
44. The composition for conductive materials as claimed in claim 35 , wherein the heterocycle contains at least one heteroatom selected from the group comprising nitrogen, oxygen, sulfur, selenium and tellurium.
45. The composition for conductive materials as claimed in claim 35 , wherein the heterocycle is an aromatic heterocycle.
46. The composition for conductive materials as claimed in claim 35 , wherein the group Y contains 1 to 5 heterocycles.
47. The composition for conductive materials as claimed in claim 35 , wherein the group Y contains at least one substituted or unsubstituted aromatic hydrocarbon ring in addition to the heterocycle.
48. The composition for conductive materials as claimed in claim 47 , wherein the group Y contains two aromatic hydrocarbon rings respectively bonded to each N in the general formula (A1) directly and at least one heterocycle existing between these aromatic hydrocarbon rings.
49. The composition for conductive materials as claimed in claim 35 , wherein the group Y contains 2 to 75 carbon atoms in total.
50. A conductive material obtained by direct polymerization or polymerization via an epoxy-based cross-linking agent of substituents X of compounds each represented by the following general formula (A1), each compound being contained in the composition for conductive materials defined in claim 1 :
wherein two R 1 s may be the same or different and each independently represents a straight-chain alkyl group having 2 to 8 carbon atoms, four R 1 s may be the same or different and each independently represents a hydrogen atom, a methyl group, or an ethyl group, Y represents a group containing at least one substituted or unsubstituted aromatic hydrocarbon ring or substituted or unsubstituted heterocycle, and two X 1 s may be the same or different and each independently represents a substituent represented by the following general formula (A2):
wherein n 1 is an integer of 2 to 8.
51. The conductive material as claimed in claim 50 , wherein the compounds are polymerized by light irradiation.
52. The conductive material as claimed in claim 50 , wherein the compounds and the epoxy-based cross-linking agent are polymerized by light irradiation.
53. A conductive layer mainly comprising the conductive material defined in claim 50 .
54. The conductive layer as claimed in claim 53 , wherein the conductive layer is a hole transport layer.
55. The conductive layer as claimed in claim 54 , wherein the average thickness of the hole transport layer is in the range of 10 to 150 nm.
56. The conductive layer as claimed in claim 53 , wherein the conductive layer is an electron transport layer.
57. The conductive layer as claimed in claim 56 , wherein the average thickness of the electron transport layer is in the range of 1 to 100 nm.
58. The conductive layer as claimed in claim 53 , wherein the conductive layer is an organic semiconductor layer.
59. The conductive layer as claimed in claim 58 , wherein the average thickness of the organic semiconductor layer is in the range of 0.1 to 1,000 nm.
60. An electronic device comprising a laminated body which includes the conductive layer defined in claim 53 .
61. The electronic device as claimed in claim 60 , which is a light emitting device or a photoelectric transducer.
62. The electronic device as claimed in claim 61 , wherein the light emitting device is an organic electroluminescent device.
63. The electronic device as claimed in claim 60 , wherein the electronic device is a switching element.
64. The electronic device as claimed in claim 63 , wherein the switching element is an organic thin film transistor.
65. Electronic equipment comprising the electronic device as claimed in claim 60 .