IP Library Granted Patent US 7,612,363
Granted Patent B2
US 7,612,363 · App. 11/661,757 · Granted Nov 3, 2009

N-type group III nitride semiconductor stacked layer structure

Assignee: Showa Denko K.K.
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Quick Facts
Patent No.
US 7,612,363
App. No.
11/661,757
Granted
Nov 3, 2009
Kind
B2
Abstract

An n-type Group III nitride semiconductor stacked layer structure including a first n-type layer which includes a layer containing n-type impurity atoms at a high concentration and a layer containing n-type impurity atoms at a low concentration, a second n-type layer containing n-type impurity atoms at an average concentration smaller than that of the first n-type layer, the second n-type layer neighboring the layer containing n-type impurity atoms at a low concentration in the first n-type layer.

Claims (24)

1. An n-type Group III nitride semiconductor stacked layer structure comprising a first n-type layer which includes layers containing n-type impurity atoms at a high concentration and layers containing n-type impurity atoms at a low concentration, and a second n-type layer containing n-type impurity atoms at an average concentration smaller than that of the first n-type layer, wherein the layers containing n-type impurity atoms at a high concentration and the layers containing n-type impurities at a low concentration alternately and periodically exist in the first n-type layer and the second n-type layer neighbors the layer containing n-type impurity atoms at a low concentration in the first n-type layer.

2. An n-type Group III nitride semiconductor stacked layer structure according to claim 1 , wherein the second n-type layer has not been doped.

3. An n-type Group III nitride semiconductor stacked layer structure according to claim 1 , wherein the second n-type layer forms a layer that is homogeneously doped with n-type impurity atoms.

4. An n-type Group III nitride semiconductor stacked layer structure according to claim 1 , wherein the second n-type layer comprises a layer containing n-type impurity atoms at a high concentration and a layer containing n-type impurity atoms at a low concentration.

5. An n-type Group III nitride semiconductor stacked layer structure according to claim 4 , wherein the layers containing n-type impurity atoms at a high concentration and the layers containing n-type impurities at a low concentration alternately and periodically exist in the second n-type layer.

6. An n-type Group III nitride semiconductor stacked layer structure according to claim 4 , wherein the layer containing n-type impurity atoms at a high concentration in the second n-type layer has a concentration lower than that of the layer containing n-type impurity atoms at a high concentration in the first n-type layer.

7. An n-type Group III nitride semiconductor stacked layer structure according to claim 4 , wherein the layer containing n-type impurity atoms at a low concentration in the second n-type layer has a concentration lower than that of the layer containing n-type impurity atoms at a low concentration in the first n-type layer.

8. An n-type Group III nitride semiconductor stacked layer structure according to claim 4 , wherein a ratio (thd/tld) of the thickness (thd) of the layer containing n-type impurity atoms at a high concentration to the thickness (tld) of the layer containing n-type impurity atoms at a low concentration in the second n-type layer is smaller than that in the first n-type layer.

9. An n-type Group III nitride semiconductor stacked layer structure according to claim 4 , wherein the thickness of the layer containing n-type impurity atoms at a high concentration in the second n-type layer is smaller than that in the first n-type layer.

10. An n-type Group III nitride semiconductor stacked layer structure according to claim 4 , wherein the thickness of the layer containing n-type impurity atoms at a low concentration in the second n-type layer is greater than that in the first n-type layer.

11. An n-type Group III nitride semiconductor stacked layer structure according to claim 4 , wherein the layer containing n-type impurity atoms at a high concentration and the layer containing n-type impurity atoms at a low concentration in the second n-type layer have thicknesses which are 0.5 to 500 nm.

12. An n-type Group III nitride semiconductor stacked layer structure according to claim 4 , wherein, in the second n-type layer, the thickness of the layer containing n-type impurity atoms at a low concentration is equal to the thickness of the layer containing n-type impurity atoms at a high concentration or is greater than the thickness of the layer containing n-type impurity atoms at a high concentration.

13. An n-type Group III nitride semiconductor stacked layer structure according to claim 5 , wherein, in the second n-type layer, the layer containing n-type impurity atoms at a high concentration and the layer containing n-type impurity atoms at a low concentration have a recurring periodic number of 2 to 20.

14. An n-type Group III nitride semiconductor stacked layer structure according to claim 4 , wherein, in the second n-type layer, the layer containing n-type impurity atoms at a low concentration has not been intentionally doped with n-type impurity atoms.

15. An n-type Group III nitride semiconductor stacked layer structure according to claim 1 , wherein the thickness of the second n-type layer is 0.01 to 0.5 μm.

16. An n-type Group III nitride semiconductor stacked layer structure according to claim 1 , wherein an average concentration of n-type impurity atoms in the second n-type layer is not larger than 1/2 of an average concentration of n-type impurity atoms in the first n-type layer.

17. An n-type Group III nitride semiconductor stacked layer structure according to claim 1 , wherein the n-type impurity atoms contained in the first n-type layer and/or the second n-type layer are any one kind of, or a combination of two or more kinds of, those selected from the group consisting of silicon (Si), germanium (Ge), sulfur (S), selenium (Se), tin (Sn) and tellurium (Te).

18. An n-type Group III nitride semiconductor stacked layer structure according to claim 17 , wherein the n-type impurity atoms are any one kind of, or a combination of two or more kinds of, those selected from the group consisting of silicon (Si), germanium (Ge) and tin (Sn).

19. A Group III nitride semiconductor light-emitting device having a light-emitting layer comprising a Group III nitride semiconductor on a substrate, and having an n-type Group III nitride semiconductor stacked layer structure, according to claim 1 , between the substrate and the light-emitting layer.

20. A lamp comprising a Group III nitride semiconductor light-emitting device according to claim 19 .

21. A lamp comprising a Group III nitride semiconductor light-emitting device according to claim 19 and a fluorescent material.

22. An electronic device incorporating a lamp according to claim 20 .

23. A machine incorporating an electronic device according to claim 22 .

24. A toy incorporating an electronic device according to claim 22 .

Assignments (2)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Dec 18, 2012
From: SHOWA DENKO KABUSHIKI KAISHA
To: TOYODA GOSEI CO., LTD.
Reel/Frame 029489/0249 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Mar 2, 2007
From: TAKEDA, HITOSHI; MIKI, HISAYUKI
To: SHOWA DENKO K.K.
Reel/Frame 019014/0994 →
Priority Claims (1)
JP 2004-267294 · Sep 14, 2004 · national
Continuity (2)
Provisional Application 6061128500 · Sep 21, 2004
Related Publication 20080093621A1 · Apr 24, 2008