IP Library Granted Patent US 8,795,624
Granted Patent B2
US 8,795,624 · App. 11/663,887 · Granted Aug 5, 2014

Monocrystalline silicon carbide ingot, monocrystalline silicon carbide wafer and method of manufacturing the same

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Quick Facts
Patent No.
US 8,795,624
App. No.
11/663,887
Granted
Aug 5, 2014
Kind
B2
Abstract

Provided is a monocrystalline silicon carbide ingot containing a dopant element, wherein a maximum concentration of the dopant element is less than 5×10 17 atoms/cm 3 and the maximum concentration is 50 times or less than that of a minimum concentration of the dopant element. Also provided is a monocrystalline silicon carbide wafer made by cutting and polishing the monocrystalline silicon carbide ingot, wherein a electric resistivity at room temperature of the wafer is 5×10 3 Ωcm or more. Further provided is a method for manufacturing the monocrystalline silicon carbide including growing the monocrystalline silicon carbide on a seed crystal from a sublimation material by a sublimation method. The sublimation material includes a solid material containing a dopant element, and the specific surface of the solid material containing the dopant element is 0.5 m 2 /g or less.

Claims (11)

1. A monocrystalline silicon carbide ingot having a diameter of 50 mm or more and containing a dopant element, wherein a maximum concentration of the dopant element is less than 5×10 17 atoms/cm 3 and the maximum concentration is not more than two times the minimum concentration of the dopant element,

wherein the maximum concentration of the dopant element is measured at a central portion of the ingot and the minimum concentration of the dopant element is measured at a peripheral portion about 2 mm from the edge of the ingot.

2. The monocrystalline silicon carbide ingot according to claim 1 , wherein the minimum concentration of the dopant element is 5×10 14 atoms/cm 3 or more.

3. The monocrystalline silicon carbide ingot according to claim 1 , wherein the minimum concentration of the dopant element is 1×10 15 atoms/cm 3 or more.

4. The monocrystalline silicon carbide ingot according to claim 1 , wherein the minimum concentration of the dopant element is 1×10 16 atoms/cm 3 or more.

5. The monocrystalline silicon carbide ingot according to claim 1 , wherein the dopant element is vanadium.

6. The monocrystalline silicon carbide ingot according to claim 5 , wherein a conductivity type of the monocrystalline silicon carbide is n-type.

7. The monocrystalline silicon carbide ingot according to claim 1 , wherein a primary polytype of the monocrystalline silicon carbide is any one of 3C, 4H, 6H or 15R.

8. The monocrystalline silicon carbide ingot according to claim 1 , wherein a primary polytype of the monocrystalline silicon carbide is 4H.

9. A monocrystalline silicon carbide ingot having a diameter of 50 mm or more and containing a dopant element,

wherein a concentration of the dopant element measured at a central portion of the ingot is less than 5×10 17 atoms/cm 3 , and not more than two times a concentration of the dopant element measured at a peripheral portion about 2 mm from the edge of the ingot.

Assignments (5)
CHANGE OF ADDRESS Recorded Feb 14, 2024
From: RESONAC CORPORATION
To: RESONAC CORPORATION
Reel/Frame 066599/0037 →
CHANGE OF NAME Recorded Jun 23, 2023
From: SHOWA DENKO K.K.
To: RESONAC CORPORATION
Reel/Frame 064082/0513 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Apr 20, 2018
From: NIPPON STEEL & SUMITOMO METAL CORPORATION
To: SHOWA DENKO K.K.
Reel/Frame 045991/0704 →
MERGER Recorded Feb 25, 2013
From: NIPPON STEEL CORPORATION
To: NIPPON STEEL & SUMITOMO METAL CORPORATION
Reel/Frame 029866/0762 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Apr 20, 2007
From: NAKABAYASHI, MASASHI; FUJIMOTO, TATSUO; SAWAMURA, MITSURU; OHTANI, NOBORU
To: NIPON STEEL CORPORATION
Reel/Frame 019188/0516 →