Copper Containing Materials for Treating Wounds, Burns and Other Skin Conditions
The invention provides a method for treating and healing sores, cold sores, cutaneous openings, ulcerations, lesions, abrasions, burns and skin conditions comprising applying to a body surface exhibiting the same, a material incorporating water-in-soluble copper compounds which release cu + ions, cu ++ ions or combinations thereof upon contact with a fluid to effect the treatment and healing thereof.
1 . A method for treating and healing sores, cold sores, cutaneous openings, ulcerations, lesions, abrasions, burns and skin conditions comprising applying to a body surface exhibiting the same, a material incorporating water-insoluble copper compounds which release Cu+ ions, Cu++ ions or combinations thereof upon contact with a fluid to effect the treatment and healing thereof.
2 . A method according to claim 1 wherein said sore is an ulcerative sore.
3 . A method according to claim 1 wherein said sore is a bed sore.
4 . A method according to claim 1 wherein said sore is an ulcerative sore caused by diabetes.
5 . A method according to claim 1 wherein said lesion is a vascular lesion.
6 . A method according to claim 1 wherein said lesion is a mucosal lesion.
7 . A method according to claim 1 wherein said material is a fabric having fibers incorporating water-insoluble copper compounds which release Cu+ ions, Cu++ ions or combinations thereof upon contact with a fluid.
8 . A method according to claim 1 wherein said material is a polymeric film having microscopic water insoluble particles of ionic copper oxides in powdered form, embedded directly therein with a portion of said particles being exposed and protruding from surfaces thereof, which particles release Cu+ ions, Cu++ ions or combinations thereof upon contact with a fluid.
9 . A method according to claim 1 wherein said material is a polymeric fiber having microscopic water insoluble particles of ionic copper oxides in powdered form, embedded directly therein with a portion of said particles being exposed and protruding from surfaces thereof, which particles release Cu+ ions, Cu++ ions or combinations thereof upon contact with a fluid.
10 . A method according to claim 1 wherein said material is a polymeric filament having microscopic water insoluble particles of ionic copper oxides in powdered form, embedded directly therein with a portion of said particles being exposed and protruding from surfaces thereof, which particles release Cu+ ions, Cu++ ions or combinations thereof upon contact with a fluid.
11 . A method according to claim 1 wherein said material is a polymeric sheath having microscopic water insoluble particles of ionic copper oxides in powdered form, embedded directly therein with a portion of said particles being exposed and protruding from surfaces thereof, which particles release Cu+ ions, Cu++ ions or combinations thereof upon contact with a fluid.
12 . A method according to claim 1 for treating the outbreak of male genital herpes sores comprising providing underpants having fibers incorporating water-insoluble copper compounds which release Cu+ ions, Cu++ ions or combinations thereof upon contact with a fluid.
13 . A method according to claim 1 for treating acne sores comprising applying thereto a fabric having fibers incorporating water-insoluble copper compounds which release Cu+ ions, Cu++ ions or combinations thereof upon contact with a fluid.
14 . A method according to claim 1 for treating nipple sores on nursing women comprising providing a bra or nursing pad having fibers incorporating water-insoluble copper compounds which release Cu+ ions, Cu++ ions or combinations thereof upon contact with a fluid.
15 . A method according to claim 1 for treating burns, comprising providing a wound-healing fabric or an extruded wound-healing film, or filament incorporating water-insoluble copper compounds which release Cu+ ions, Cu++ ions or combinations thereof upon contact with a fluid for application to said burn surface.
16 - 51 . (canceled)
52 . A method for treating sores, cold sores, cutaneous openings, ulcerations, lesions, abrasions, burns and skin conditions comprising applying thereto a polymeric material formed from a polymeric component selected from the group consisting of a polyamide, a polyester, an acrylic and a polyalkylene, said material being in the form of a fiber, a yarn, a sheath, a filament, or a sheet, and having microscopic water insoluble particles of ionic copper oxides in powdered form, embedded directly therein with a portion of said particles being exposed and protruding from surfaces thereof, which particles release Cu+ ions, Cu++ ions or combinations thereof up on contact with a fluid.
53 . A method for preventing the formation of diabetic granulation, lesions and ulcers comprising applying, a material incorporating water-insoluble copper compounds which release Cu+ ions, Cu++ ions or combinations thereof upon contact with a fluid, to an area to be protected.
54 . A method for preventing the formation of diabetic granulation, lesions and ulcers comprising applying a polymeric material formed from a polymeric component selected from the group consisting of a polyamide, a polyester, an acrylic and a polyalkylene, said material being in the form of a fiber, a yarn, a sheath, a filament, or a sheet, and having microscopic water insoluble particles of ionic copper oxides in powdered form, embedded directly therein with a portion of said particles being exposed and protruding from surfaces thereof, which particles release Cu+ ions, Cu++ ions or combinations thereof upon contact with a fluid, to an area to be protected.
55 . A method according to claim 53 wherein said material is a fabric having fibers incorporating water-insoluble copper compounds which release Cu+ ions, Cu++ ions or combinations thereof upon contact with a fluid.
56 . A method according to claim 1 wherein said material is a polymeric film having microscopic water insoluble particles of ionic copper oxides in powdered form, embedded directly therein with a portion of said particles being exposed and protruding from surfaces thereof, which particles release Cu+ ions, Cu++ ions or combinations thereof upon contact with a fluid wherein said film has the ability to disperse liquid through osmosis.
57 . A method according to claim 1 wherein said material is a polymeric film having microscopic water insoluble particles of ionic copper oxides in powdered form, embedded directly therein with a portion of said particles being exposed and protruding from surfaces thereof, which particles release Cu+ ions, Cu++ ions or a combination thereof upon contact with a fluid wherein said film has micro pores perforated throughout to allow for the escape of excess liquids.
58 - 63 . (canceled)