IP Library Granted Patent US 7,706,113
Granted Patent B1
US 7,706,113 · App. 11/668,360 · Granted Apr 27, 2010

Electrical overstress (EOS) and electrostatic discharge (ESD) protection circuit and method of use

View Patent ↗
Loading inventors, assignments & file history…
Monitor This Case
Get email alerts when status or documents change.
Order Certified Copies
Most orders are placed with the USPTO same day — all within 24 business hours.
Order via The Patent Place →
Pre-filled with this patent's details
Quick Facts
Patent No.
US 7,706,113
App. No.
11/668,360
Granted
Apr 27, 2010
Kind
B1
Abstract

A system and method are provided for electrostatic discharge (ESD) protection circuit having overshoot and undershoot voltage protection during a power supply ramp-up of the circuit. In a specific embodiment, the ESD protection circuit of the present invention includes an ESD discharge circuit coupled between a power supply node and a ground supply node, a trigger circuit coupled to the ESD discharge circuit, the trigger circuit to turn the ESD discharge circuit on in the presence of a voltage spike during the power supply ramp-up and to turn the ESD discharge circuit off in the absence of a voltage spike during the power supply ramp-up, and a delay circuit coupled between the discharge circuit and the trigger circuit, the delay circuit to slow down the turn-off of the discharge circuit to prevent an overshoot or undershoot voltage condition during the power supply ramp-up of the circuit.

Claims (33)

1. An electrostatic discharge (ESD) protection circuit for an integrated circuit device having overshoot and undershoot voltage protection during a power supply ramp-up of the integrated circuit device, the ESD protection circuit comprising a plurality of individual ESD protection circuits and each of the individual ESD protection circuits comprising:

an ESD discharge circuit coupled between a power supply node and a ground supply node;

a trigger circuit coupled to the ESD discharge circuit, the trigger circuit to transmit a turn-on signal to the ESD discharge circuit in the presence of a voltage spike during the power supply ramp-up and to transmit a turn-off signal to the ESD discharge circuit in the absence of a voltage spike during the power supply ramp-up;

a delay circuit coupled between the ESD discharge circuit and the trigger circuit, the delay circuit to slow down the turn-off of the ESD discharge circuit to prevent an overshoot or undershoot voltage condition during the power supply ramp-up of the integrated circuit device; and

a turn-off delay circuit coupled to the trigger circuit to establish a delay time for the transmission of the turn-off signal and wherein the delay time is different for each of the plurality of individual ESD protection circuits such that the turn-off signal transmission for each of the plurality of individual ESD protection circuits is staggered.

2. The ESD protection circuit of claim 1 , wherein the ESD discharge circuit is a MOSFET transistor and the gate of the MOSFET transistor is coupled to the delay circuit.

3. The ESD protection circuit of claim 1 , wherein the trigger circuit further comprises a drive circuit to actively drive the ESD discharge circuit.

4. The ESD protection circuit of claim 3 , where the drive circuit comprises at least one CMOS inverter.

5. The ESD protection circuit of claim 1 , wherein the trigger circuit is an RC trigger circuit.

6. The ESD protection circuit of claim 1 , wherein the trigger circuit is a voltage level sensing trigger circuit.

7. The ESD protection circuit of claim 1 , wherein the delay circuit further comprises an inverter having a pull-up transistor and a pull-down transistor and a resistive element positioned between an output of the inverter and a drain node of the pull-down transistor.

8. The ESD protection circuit of claim 1 , wherein the delay circuit further comprises:

a pull-up transistor having a gate node coupled to the trigger circuit, a source node coupled to the power supply node and a drain node coupled to the ESD discharge circuit;

a pull-down transistor having a gate node coupled to the trigger circuit and a source node coupled to a ground node; and

a resistive element coupled between the ESD discharge circuit and a drain node of the pull-down transistor.

9. The ESD protection circuit of claim 8 , wherein the pull-up transistor is a PMOS transistor.

10. The ESD protection circuit of claim 8 , wherein the pull-down transistor is an NMOS transistor.

11. The ESD protection circuit of claim 8 , wherein the resistive element is a resistor.

12. The ESD protection circuit of claim 8 , wherein the resistive element is a transistor.

13. The ESD protection circuit of claim 1 , wherein the turn-off delay circuit further comprises at least one inverter and at least one NOR gate coupled between a triggering input to the turn-off delay circuit and the delay circuit, the at least one inverter and the at least one NOR gate to delay the transmission of the turn-off signal to the delay circuit but not to delay the transmission of the turn-on signal to the delay circuit.

14. An electrostatic discharge (ESD) protection circuit for an integrated circuit device, the ESD protection circuit comprising a plurality of individual ESD protection circuits and each of the individual ESD protection circuits comprising:

a first NMOS transistor having a drain node coupled to a power supply node and a source node coupled to a ground supply node;

a trigger circuit coupled to a gate node of the first NMOS transistor, the trigger circuit to transmit a turn-on signal to the first NMOS transistor in the presence of a voltage spike during the power supply ramp-up and to transmit a turn-off signal to the first NMOS transistor in the absence of a voltage spike during the power supply ramp-up;

a delay circuit comprising a PMOS transistor having a source node coupled to the power supply node, a drain node coupled to the gate node of the first NMOS transistor and a gate node coupled to the gate node of a second NMOS transistor, a source node of the second NMOS transistor coupled to the ground supply node, a resistive element coupled between a drain node of the second NMOS transistor and the gate node of the first NMOS transistor; and

a turn-off delay circuit coupled to the trigger circuit to establish a delay time for the transmission of the turn-off signal and wherein the delay time is different for each of the plurality of individual ESD protection circuits such that the turn-off signal transmission for each of the plurality of individual ESD protection circuits is staggered.

15. The ESD protection circuit of claim 14 , wherein the trigger circuit is an RC trigger circuit.

16. The ESD protection circuit of claim 14 , wherein the trigger circuit is a voltage level sensing trigger circuit.

17. The ESD protection circuit of claim 14 , wherein the resistive element is a resistor.

18. The ESD protection circuit of claim 14 , wherein the resistive element is a transistor.

19. A method for preventing damage to an electrostatic discharge (ESD) protection circuit of an integrated circuit device when the ESD circuit is unintentionally turned-on during power-up of the ESD protection circuit, the ESD protection circuit comprising a plurality of individual ESD protection circuits and each of the individual ESD protection circuits comprising an ESD discharge circuit, the method comprising the step of:

delaying the turn-off of the ESD discharge circuit to prevent an overshoot or undershoot voltage condition thereby preventing damage to the ESD protection circuit; and

delaying the transmission of a turn-off signal to the ESD discharge circuit for each of the plurality of ESD protection circuits such that the turn-off of each of the plurality of ESD discharge circuits is staggered.

20. The method of claim 19 , wherein the unintentional turn-on of the ESD discharge circuit is a result of noise on a power supply bus coupled to the ESD protection circuit.

Assignments (3)
RELEASE OF SECURITY INTEREST Recorded Mar 29, 2019
From: JPMORGAN CHASE BANK, N.A.
To: INTEGRATED DEVICE TECHNOLOGY, INC.; GIGPEAK, INC.; CHIPX, INCORPORATED; ENDWAVE CORPORATION; MAGNUM SEMICONDUCTOR, INC.
Reel/Frame 048746/0001 →
SECURITY AGREEMENT Recorded Apr 5, 2017
From: INTEGRATED DEVICE TECHNOLOGY, INC.; GIGPEAK, INC.; MAGNUM SEMICONDUCTOR, INC.; ENDWAVE CORPORATION; CHIPX, INCORPORATED
To: JPMORGAN CHASE BANK, N.A., AS COLLATERAL AGENT
Reel/Frame 042166/0431 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jan 29, 2007
From: LIEN, CHUEN-DER, MR.; TIEN, TA-KE, MR.
To: INTEGRATED DEVICE TECHNOLOGY, INC.
Reel/Frame 018819/0626 →