No lead package with heat spreader
A no-lead electronic package including a heat spreader and method of manufacturing the same. This method includes the steps of selecting a matrix or mapped no-lead lead frame with die receiving area and leads for interconnect; positioning an integrated circuit device within the central aperture and electrically interconnecting the integrated circuit device to the leads; positioning a heat spreader in non-contact proximity to the integrated circuit device such that the integrated circuit device is disposed between the leads and the heat spreader; and encapsulating the integrated device and at least a portion of the heat spreader and leads in a molding resin.
1. A semiconductor package comprising:
a plurality of leads having inner lead ends and outer lead ends disposed about a centrally disposed die pad;
a plurality of die pad tie bars extending outward from the die pad and having outer tie bar ends;
an integrated circuit device having an electrically inactive face bonded to said die pad and an electrically active face electrically interconnected to said inner ends by wires or TAB bonds;
a heat spreader corresponding to each die pad, the heat spreader in non-contact proximity to said electrically active face whereby said integrated circuit device is disposed between said die pad and said heat spreader, the heat spreader having
a central portion having a planar first surface opposite and substantially parallel to said electrically active face, and
an outer portion in contact with at least one of
the outer lead ends of leads on opposite sides of the die pad and
the outer tie bar ends of die pad tie bars at opposite ends of the die pad,
wherein
the outer portion includes a first thinned portion at an end thereof in contact with said outer lead ends or said outer tie bar ends and
the central portion includes a full thickness portion having a planar surface opposite the first surface, and a second thinned portion spaced apart from the die pad and having a lower surface integral with said first surface and an upper surface parallel to said first surface; and
a molding resin encapsulating said integrated circuit device, at least a portion of said heat spreader, at least a portion of said leads, and at least a portion of said die pad tie bars, leaving exposed a portion of each of said outer lead ends and said outer tie bar ends and forming a planar side surface with the exposed portion of an outer lead end,
wherein
said molding resin encapsulates all of the second thinned portion and leaves exposed part of the first thinned portion,
said planar side surface includes said exposed part of the first thinned portion, and
the package has a bottom surface and a planar sidewall substantially perpendicular thereto, said sidewall including said planar side surface.
2. A semiconductor package according to claim 1 wherein said heat spreader is selected from the group consisting of copper, aluminum, copper-base alloys, and aluminum-base alloys.
3. A semiconductor package according to claim 2 wherein said heat spreader is an aluminum-base alloy coated with a black anodization and a surface of said heat spreader is exposed in planar relationship with said molding resin.
4. A semiconductor package according to claim 2 wherein said heat spreader is a copper-base alloy coated with nickel.
5. A semiconductor package according to claim 1 , wherein the outer portion of the heat spreader is affixed to the outer ends of the leads by an adhesive.