IP Library Granted Patent US 7,560,745
Granted Patent B2
US 7,560,745 · App. 11/674,493 · Granted Jul 14, 2009

LED package and backlight assembly for LCD comprising the same

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Quick Facts
Patent No.
US 7,560,745
App. No.
11/674,493
Granted
Jul 14, 2009
Kind
B2
Abstract

The LED package includes a substrate, one LED or more separated from each other by designated intervals and arranged in a line on the substrate, and a molding portion, for sealing the upper surface of the substrate including the LEDs, provided with an upper surface including two curved surfaces having circular circumferential shapes, wherein each of the curved surfaces has a curvature for totally reflecting light emitted from the LEDs. The LED package assures a sufficient optical traveling route therein without requiring a separate light guide plate, thereby emitting a white ray having uniform luminance.

Claims (21)

1. An LED package comprising:

a substrate;

an LED structure including at least one LED placed at a point on the substrate; and

a molding portion, for sealing the upper surface of the substrate including the LED structure, provided with an upper surface including four curved surfaces having semispherical shapes and meeting at one intersection point,

wherein each of the curved surfaces has a curvature for totally reflecting light emitted from the said at least one LED.

2. The LED package as set forth in claim 1 ,

wherein the LED structure comprises at least a pair of LEDs for respectively emitting complementary colored rays.

3. The LED package as set forth in claim 1 ,

wherein the LED structure is arranged just below an intersection point where the four curved surfaces meet.

4. The LED package as set forth in claim 1 ,

further comprising a cup placed on the upper surface of the substrate for receiving the LED structure.

5. The LED package as set forth in claim 1 ,

wherein the molding portion is made of a transparent epoxy having a refractivity higher than that of air.

6. The LED package as set forth in claim 1 ,

wherein the upper surface of the substrate is coated with a material, which does not absorb light.

7. The LED package as set forth in claim 1 ,

wherein a plurality of light scattering means are protruded from the upper surface of the substrate.

8. The LED package as set forth in claim 7 ,

wherein the light scattering means have dot shapes or concentrically circular shapes centering on the LED structure.

9. The LED package as set forth in claim 7 ,

wherein the light scattering means are aligned such that the intervals between the light scattering means distant from the LED structure are narrower than the intervals between the light scattering means close to the LED structure.

Assignments (1)
CHANGE OF NAME Recorded Oct 24, 2012
From: SAMSUNG ELECTRO-MECHANICS CO., LTD.
To: SAMSUNG ELECTRONICS CO., LTD.
Reel/Frame 029179/0874 →