Multi-layer source/drain stressor
A method for forming a semiconductor device includes forming a recess in a source region and a recess in a drain region of the semiconductor device. The method further includes forming a first semiconductor material layer in the recess in the source region and a second semiconductor material layer in the recess in the drain region, wherein each of the first semiconductor material layer and the second semiconductor material layer are formed using a stressor material having a first ratio of an atomic concentration of a first element and an atomic concentration of a second element, wherein the first element is silicon and a first level of concentration of a doping material. The method further includes forming additional semiconductor material layers overlying the first semiconductor material layer and the second semiconductor material layer that have a different ratio of the atomic concentration of the first element and the second element.
1. A method for forming a semiconductor device comprising:
forming a recess in a source region and a recess in a drain region of the semiconductor device;
forming a first semiconductor material layer in the recess in the source region and a second semiconductor material layer in the recess in the drain region, wherein each of the first semiconductor material layer and the second semiconductor material layer are formed using a stressor material having a first ratio of an atomic concentration of a first element and an atomic concentration of a second element, wherein the first element is silicon and a first level of concentration of a doping material;
forming a third semiconductor material layer overlying the first semiconductor material layer and a fourth semiconductor material layer overlying the second semiconductor material layer, wherein each of the third semiconductor material layer and the fourth semiconductor material layer have a second ratio of the atomic concentration of the first element and the atomic concentration of the second element, wherein the second ratio is higher than the first ratio and wherein each of the third semiconductor material layer and the fourth semiconductor material layer have a second level of concentration of the doping material, wherein the second level of concentration of the doping material is higher than the first level of concentration of the doping material; and
forming a fifth semiconductor material layer overlying the third semiconductor material layer and a sixth semiconductor material layer overlying the fourth semiconductor material layer, wherein each of the fifth semiconductor material layer and the sixth semiconductor material layer have a third ratio of the atomic concentration of the first element and the atomic concentration of the second element, wherein the third ratio is lower than the second ratio and wherein each of the fifth semiconductor material layer and the sixth semiconductor material layer have a third level of concentration of the doping material, wherein the third level of concentration of the doping material is higher than the second level of concentration of the doping material.
2. The method of claim 1 , wherein the stressor material is an alloy of silicon and germanium such that the second element is germanium.
3. The method of claim 1 , wherein the doping material is one or more of a group V element.
4. The method of claim 3 , wherein the first ratio of the atomic concentration of the first element to the atomic concentration of the second element is about 2.3 to 1.
5. The method of claim 3 , wherein the doping material is boron and the first level of concentration of the doping material is from about 5e19 atoms per cm 3 to about 2e20 atoms per cubic centimeter.
6. The method of claim 3 , wherein the second ratio of the atomic concentration of the first element to the atomic concentration of the second element is about 3.0 to 1.
7. The method of claim 3 , wherein the doping material is boron and the second level of concentration of the doping material is from about 2e20 atoms per cm 3 to 5e20 atoms per cubic centimeter.
8. The method of claim 3 , wherein the third ratio of the atomic concentration of the first element to the atomic concentration of the second element is about 2.3 to 1.
9. The method of claim 3 , wherein the doping material is boron and the third level of concentration of the doping material is in a range from about 5e20 atoms per cm 3 to 1e21 atoms per cm 3 .
10. A method for forming a semiconductor device comprising:
forming a recess in a source region and a recess in a drain region of the semiconductor device;
forming a first semiconductor material layer in the recess in the source region and a second semiconductor material layer in the recess in the drain region, wherein each of the first semiconductor material layer and the second semiconductor material layer are formed using a stressor material having a first ratio of an atomic concentration of a first element and an atomic concentration of a second element, wherein the first element is silicon and wherein each of the first semiconductor material layer and the second semiconductor material layer have a first level of concentration of a doping material;
forming a third semiconductor material layer overlying the first semiconductor material layer and a fourth semiconductor material layer overlying the second semiconductor material layer, wherein each of the third semiconductor material layer and the fourth semiconductor material layer have a second level of concentration of the doping material, wherein the second level of concentration of the doping material is higher than the first level of concentration of the doping material; and
forming a fifth semiconductor material layer overlying the third semiconductor material layer and a sixth semiconductor material layer overlying the fourth semiconductor material layer, wherein each of the fifth semiconductor material layer and the sixth semiconductor material layer have a third level of concentration of the doping material, wherein the third level of concentration of the doping material is higher than the second level of concentration of the doping material.
11. The method of claim 10 , wherein the doping material is one or more of a group V element.
12. The method of claim 11 , wherein the doping material is boron and the first level of concentration of the doping material is from about 5e19 atoms per cm 3 to about 2e20 atoms per cm 3 .
13. The method of claim 11 , wherein the second level of concentration of the doping material is from about 2e20 atoms per cm 3 to 5e20 atoms per cm 3 .
14. The method of claim 11 , wherein the third level of concentration of the doping material is in a range from about 5e20 atoms per cm 3 to 1e21 atoms per cm 3 .
15. A semiconductor device comprising:
a first semiconductor material layer in a recess in a source region and a second semiconductor material layer in a recess in a drain region, wherein each of the first semiconductor material layer and the second semiconductor material layer are formed using a stressor material having a first ratio of an atomic concentration of a first element and an atomic concentration of a second element and a first level of concentration of a doping material, wherein the first element is silicon;
a third semiconductor material layer overlying the first semiconductor material layer and a fourth semiconductor material layer overlying the second semiconductor material layer, wherein each of the third semiconductor material layer and the fourth semiconductor material layer have a second ratio of the atomic concentration of the first element and the atomic concentration of the second element, wherein the second ratio is higher than the first ratio and wherein each of the third semiconductor material layer and the fourth semiconductor material layer have a second level of concentration of the doping material, wherein the second level of concentration of the doping material is higher than the first level of concentration of the doping material; and
a fifth semiconductor material layer overlying the third semiconductor material layer and a sixth semiconductor material layer overlying the fourth semiconductor material layer, wherein each of the fifth semiconductor material layer and the sixth semiconductor material layer have a third ratio of the atomic concentration of the first element and the atomic concentration of the second element, wherein the third ratio is lower than the second ratio and wherein each of the fifth semiconductor material layer and the sixth semiconductor material layer have a third level of concentration of the doping material, wherein the third level of concentration of the doping material is higher than the second level of concentration of the doping material.
16. The semiconductor device of claim 15 , wherein the stressor material is an alloy of silicon and germanium such that the second element is germanium.
17. The semiconductor device of claim 15 , wherein the doping material is one or more of a group V.
18. The semiconductor device of claim 17 , wherein the first ratio of the atomic concentration of the first element to the atomic concentration of the second element is about 2.3 to 1.
19. The semiconductor device of claim 17 , wherein the doping material is boron and the first level of concentration of the doping material is from about 5e19 atoms per cm 3 to about 2e20 atoms per cm 3 , the second level of concentration of the doping material is from about 2e20 atoms per cm 3 to 5e20 atoms per cm 3 , and the third level of concentration of the doping material is in a range from about 5e20 atoms per cm 3 to 1e21 atoms per cm 3 .
20. The semiconductor device of claim 17 , wherein the second ratio of the atomic concentration of the first element to the atomic concentration of the second element is about 3.0 to 1.