Decoupled, multiple stage positioning system
View Patent ↗A split axis stage architecture is implemented as a multiple stage positioning system that is capable of vibrationally and thermally stable material transport at high speed and rates of acceleration. A split axis design decouples stage motion along two perpendicular axes lying in separate, parallel planes. A dimensionally stable substrate in the form of a granite, or other stone slab, or of ceramic material or cast iron, is used as the base for lower and upper stages. The substrate is precisely cut (“lapped”) such that its upper and lower stage surface portions are flat and parallel to each other.
1. A decoupled, multiple stage positioning system, comprising:
a dimensionally stable substrate having a substrate thickness and opposite first and second substantially parallel major surface portions;
a first guide track assembly coupled to the first major surface portion and positioned to guide motion of a first stage along a first axis in response to a first motive force;
a second guide track assembly coupled to the second major surface portion and positioned to guide motion of a second stage along a second axis in response to a second motive force, and the second and first axes transversely arranged relative to each other; and
the dimensionally stable substrate decoupling the first and second stages so that the guided motions of the first and second stages contribute negligible error motion in a direction along the substrate thickness.
2. The positioning system of claim 1 , further comprising:
a first motor drive operatively associated with the first guide track assembly to provide the first motive force to which the first stage responds; and
a second motor drive operatively associated with the second guide track assembly to provide the second motive force to which the second stage responds.
3. The positioning system of claim 2 , in which each of the first and second motor drives includes a linear motor.
4. The positioning system of claim 2 , in which the first motor drive includes two motors positioned at either side of the first guide track assembly to impart the first motive force to the first stage and guide its motion along the first axis, and in which the second motor drive includes two motors positioned at either side of the second guide track assembly to impart the second motive force to the second stage and guide its motion along the second axis.
5. The positioning system of claim 4 , in which the first stage has a first center of mass, and in which the first motor drive includes two motors positioned at either side of the first guide track assembly to impart the first motive force substantially through the first center of mass of the first stage to guide its motion along the first axis.
6. The positioning system of claim 5 , in which the second stage has a second center of mass, and in which the second motor drive includes two motors positioned at either side of the second guide track assembly to impart the second motive force substantially through the second center of mass of the second stage to guide its motion along the second axis.
7. The positioning system of claim 4 , further comprising a position sensor positioned near each of the two motors of the first motor drive and near each of the two motors of the second motor drive.
8. The positioning system of claim 7 , in which the position sensors and motors cooperate to provide co-located feedback control.
9. The positioning system of claim 7 , in which the position sensors and motors of each of the first and second motor drives cooperate to regulate three-dimensional motions of the first and second stages, respectively.
10. The positioning system of claim 1 , in which at least one of the first and second guide track assemblies includes an air bearing associated with an air bearing guideway.
11. The positioning system of claim 10 , in which the air bearing is of a vacuum pre-loaded type.
12. The positioning system of claim 10 , in which the air bearing is of a magnetically pre-loaded type.
13. The positioning system of claim 10 , in which the air bearing guideway is a surface of the substrate.
14. The positioning system of claim 13 , in which the surface of the substrate, when in a horizontal disposition, constitutes a lower substrate surface and the air bearing develops sufficient force to overcome gravitational force on the one of the first and second stages with which the air bearing is included.
15. The positioning system of claim 1 , in which the substrate includes a stone slab.
16. The positioning system of claim 15 , in which the stone slab is formed of granite.
17. The positioning system of claim 1 , in which the substrate includes a slab of ceramic material.
18. The positioning system of claim 1 , in which the substrate includes a slab made of cast iron.
19. The positioning system of claim 1 , in which the substrate includes a slab made of a polymer composite material.
20. The positioning system of claim 1 , in which the substrate is configured to provide operational clearance that affords the guided motion of the first and second stages.
21. The positioning system of claim 20 , in which the substrate includes a slot through which a component operatively connected to one of the first and second stages can move in operative association with the other one of the first and second stages.
22. The positioning system of claim 1 , in which:
the first and second stages support components of a laser processing system, the first stage supporting a scan lens that has a beam axis and through which a laser beam propagates along a propagation path generally aligned with the beam axis, and the second stage supporting a specimen-holding chuck; and
the guided motions of the first and second stages cooperating to move the beam axis relative to laser beam processing locations on a surface of a specimen held by the chuck.
23. The positioning system of claim 22 , in which the laser processing system performs micromachining of the specimen.
24. The positioning system of claim 1 , in which:
the first and second stages support components of a semiconductor wafer dicing system, the first stage supporting a cutting device and the second stage supporting a wafer-holding chuck; and
the guided motions of the first and second stages cooperating to move the cutting device along wafer scribe locations on a surface of a wafer held by the chuck to dice the wafer.
25. The positioning system of claim 1 , in which:
the first and second stages support components of a semiconductor wafer fuse processing system, the first stage supporting a wafer fuse processing device and the second stage supporting a semiconductor wafer-holding chuck; and
the guided motions of the first and second stages cooperating to move the wafer fuse processing device relative to fuse locations on a surface of a semiconductor wafer held by the chuck; and
the guided motions of the first and second stages cooperating to move the beam axis relative to laser beam processing locations on a surface of a specimen held by the chuck.
26. The positioning system of claim 25 , in which the wafer fuse processing device performs semiconductor wafer fuse irradiation.
27. The positioning system of claim 22 , in which the scan lens forms part of an optical assembly that, together with the first stage, defines a first center of mass, and in which the beam axis and first center of mass coincide with each other.