IP Library Granted Patent US 7,466,737
Granted Patent B2
US 7,466,737 · App. 11/677,646 · Granted Dec 16, 2008

High power semiconductor laser device

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Quick Facts
Patent No.
US 7,466,737
App. No.
11/677,646
Granted
Dec 16, 2008
Kind
B2
Abstract

In a high power semiconductor laser device, first and second conductivity type clad layers are provided. An active layer is interposed between the first and second conductivity type clad layers. A first optical guide layer is disposed between the first conductivity type clad layer and the active layer. A second optical guide layer is disposed between the second conductivity clad layer and the active layer. Also, an intentionally undoes optical loss confinement region is formed in a portion of at least one of the first and second conductivity type clad layers overlapping laser beam distribution.

Claims (12)

1. A semiconductor laser device comprising:

first and second conductivity type clad layers;

an active layer interposed between the first and second conductivity type clad layers;

a first optical guide layer disposed between the first conductivity type clad layer and the active layer;

a second optical guide layer disposed between the second conductivity clad layer and the active layer; and

an intentionally undoped optical loss confinement region formed in a portion of at least one of the first and second conductivity type clad layers overlapping laser beam distribution.

2. The semiconductor laser device according to claim 1 , wherein the optical loss confinement region is adjacent to the first or second optical guide layer.

3. The semiconductor laser device according to claim 1 , wherein the optical loss confinement region is formed in both the first and second conductivity type clad layers.

4. The semiconductor laser device according to claim 1 , wherein the optical loss confinement region, the active layer and the first and second optical guide layers have a thickness that occupies at least 80% of the laser beam distribution.

5. The semiconductor laser device according to claim 4 , wherein the optical loss confinement region, the active layer and the first and second optical guide layers have a thickness that occupies at least 90% of the laser beam distribution.

6. The semiconductor laser device according to claim 4 , wherein the optical loss confinement region has a thickness of about 10 nm to about 300 μm.

7. The semiconductor laser device according to claim 1 , wherein the optical loss confinement region has a doping concentration of 5×10 16 /cm 3 or less.

Assignments (3)
MERGER Recorded Aug 7, 2012
From: SAMSUNG LED CO., LTD.
To: SAMSUNG ELECTRONICS CO., LTD.
Reel/Frame 028744/0272 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jul 22, 2010
From: SAMSUNG ELECTRO-MECHANICS CO., LTD.
To: SAMSUNG LED CO., LTD.
Reel/Frame 024723/0532 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Feb 22, 2007
From: MA, BYUNG JIN; BAE, SEONG JU
To: SAMSUNG ELECTRO-MECHANICS CO., LTD.
Reel/Frame 018920/0158 →